PCA9500 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2017. All rights reserved.
Product data sheet Rev. 4.1 — 5 May 2017 25 of 29
NXP Semiconductors
PCA9500
8-bit I
2
C-bus and SMBus I/O port with 2-kbit EEPROM
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
15. Abbreviations
MSL: Moisture Sensitivity Level
Fig 27. Temperature profiles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
Table 10. Abbreviations
Acronym Description
ASIC Application Specific Integrated Circuit
CBT Cross-Bar Technology
CDM Charged-Device Model
CPU Central Processing Unit
EEPROM Electrically Erasable Programmable Read-Only Memory
ESD ElectroStatic Discharge
FF Flip-Flop
GPIO General Purpose Input/Output
I
2
C-bus Inter-Integrated Circuit bus
I/O Input/Output
HBM Human Body Model
LED Light-Emitting Diode
MM Machine Model
SMBus System Management Bus
PCA9500 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2017. All rights reserved.
Product data sheet Rev. 4.1 — 5 May 2017 26 of 29
NXP Semiconductors
PCA9500
8-bit I
2
C-bus and SMBus I/O port with 2-kbit EEPROM
16. Revision history
Table 11. Revision history
Document ID Release date Data sheet status Change notice Supersedes
PCA9500 v.4.1 20170505 Product data sheet - PCA9500_4
Modifications: Updated Section 4 “Ordering information
PCA9500_4 20090415 Product data sheet - PCA9500_3
Modifications:
The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
Legal texts have been adapted to the new company name where appropriate.
Table 3 “Pin description:
added Table note [1]
and its reference at HVQFN16 pin 6
changed naming convention for pins I/On to “IOn”
Figure 7 “I/O Write mode (output): changed symbol “t
pv
” to “t
v(Q)
Figure 8 “I/O Read mode (input):
changed symbol “t
ph
” to “t
h(D)
changed symbol “t
ps
” to “t
su(D)
Table 4 “Limiting values:
changed symbol “V
CC
” to “V
DD
changed parameter for I
SS
from “supply current” to “ground supply current”
changed symbol “P
O
” to “P/out”
changed parameter for T
amb
from “operating temperature” to “ambient temperature”;
placed “operating” in Conditions column
Table 5 “Static characteristics:
added reference to Table note [1]
at I
OL
in sub-section “I/O expander port”
Table 6 “Dynamic characteristics:
sub-section “I
2
C-bus timing”: changed symbol/parameter from “t
SW
, tolerable spike
width on bus” to “t
SP
, pulse width of spikes that must be suppressed by the input filter”
sub-section “Port timing”: changed symbol “t
pv
” to “t
v(Q)
sub-section “Port timing”: changed symbol “t
ps
” to “t
su(D)
sub-section “Port timing”: changed symbol “t
ph
” to “t
h(D)
sub-section “Power-up timing”: changed symbol “t
PUR
” to “t
pu(R)
sub-section “Power-up timing”: changed symbol “t
PUW
” to “t
pu(W)
sub-section “Write cycle limits”: changed symbol “t
WR
” to “T
cy(W)
Figure 23 “Write cycle timing: changed symbol “t
WR
” to “T
cy(W)
added Section 15 “Abbreviations
updated soldering information
PCA9500_3
(9397 750 14134)
20040930 Product data sheet - PCA9500_2
PCA9500_2 20030627 Product data 853-2369 30018
of 2003 Jun 11
PCA9500_1
PCA9500_1 20020927 Product data 853-2369 28875
of 2002 Sep 27
-
PCA9500 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2017. All rights reserved.
Product data sheet Rev. 4.1 — 5 May 2017 27 of 29
NXP Semiconductors
PCA9500
8-bit I
2
C-bus and SMBus I/O port with 2-kbit EEPROM
17. Legal information
17.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
17.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
17.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms
, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Document status
[1][2]
Product status
[3]
Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.

PCA9500PW,118

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
Interface - I/O Expanders 8BIT I2C FMQB GPIO PU2K EEPROM
Lifecycle:
New from this manufacturer.
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