MIXERS - SUB-HARMONIC - SMT
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8 - 29
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
HMC264LM3 Recommended SMT Attachment Technique
Preparation & Handling of the LM3 Millimeterwave Package for Surface Mounting
The HMC LM3 package was designed to be compatible with
high volume surface mount PCB assembly processes. The
LM3 package requires a speci c mounting pattern to allow
proper mechanical attachment and to optimize electrical per-
formance at millimeterwave frequencies. This PCB layout pat-
tern can be found on each LM3 product data sheet. It can also
be provided as an electronic drawing upon request from Hittite
Sales & Application Engineering.
Follow these precautions to avoid permanent damage:
Cleanliness: Observe proper handling procedures to ensure
clean devices and PCBs. LM3 devices should remain in their
original packaging until component placement to ensure no
contamination or damage to RF, DC & ground contact areas.
Static Sensitivity: Follow ESD precautions to protect against ESD strikes.
General Handling: Handle the LM3 package on the top with a vacuum collet or along the edges with a sharp pair of
bent tweezers. Avoiding damaging the RF, DC, & ground contacts on the package bottom. Do not apply excess pres-
sure to the top of the lid.
Solder Materials & Temperature Pro le: Follow the information contained in the application note. Hand soldering is
not recommended. Conductive epoxy attachment is not recommended.
Solder Paste
Solder paste should be selected based on the user’s experience and be compatible with the metallization systems
used. See the LM3 data sheet Outline drawing for pin & ground contact metallization schemes.
Solder Paste Application
Solder paste is generally applied to the PCB using either a stencil printer or dot placement. The volume of solder
paste will be dependent on PCB and component layout and should be controlled to ensure consistent mechanical &
electrical performance. Excess solder may create unwanted electrical parasitics at high frequencies.
Solder Re ow
The soldering process is usually accomplished in a re ow oven but may also use a vapor phase process. A solder
re ow pro le is suggested above.
Prior to re owing product, temperature pro les should be measured using the same mass as the actual assemblies.
The thermocouple should be moved to various positions on the board to account for edge and corner effects and
varying component masses. The nal pro le should be determined by mounting the thermocouple to the PCB at the
location of the device.
Follow solder paste and oven vendor’s recommendations when developing a solder re ow pro le. A standard pro le
will have a steady ramp up from room temperature to the pre-heat temperature to avoid damage due to thermal shock.
Allow enough time between reaching pre-heat temperature and re ow for the solvent in the paste to evaporate and the
ux to completely activate. Re ow must then occur prior to the ux being completely driven off. The duration of peak
re ow temperature should not exceed 15 seconds. Packages have been quali ed to withstand a peak temperature of
235°C for 15 seconds. Verify that the pro le will not expose device to temperatures in excess of 235°C.
Cleaning
A water-based ux wash may be used.
HMC264LM3
GaAs MMIC SUB-HARMONIC
SMT MIXER, 20 - 30 GHz
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responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
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For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
