OP777/OP727/OP747
REV. D –13–
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-187-AA
0.80
0.55
0.40
4
8
1
5
0.65 BSC
0.40
0.25
1.10 MAX
3.20
3.00
2.80
COPLANARITY
0.10
0.23
0.09
3.20
3.00
2.80
5.15
4.90
4.65
PIN 1
IDENTIFIER
15° MAX
0.95
0.85
0.75
0.15
0.05
10-07-2009-B
Figure 12. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
COMPLIANT TO JEDEC STANDARDS MS-012-AA
012407-A
0.25 (0.0098)
0.17 (0.0067)
1.27 (0.0500)
0.40 (0.0157)
0.50 (0.0196)
0.25 (0.0099)
45°
1.75 (0.0688)
1.35 (0.0532)
SEATING
PLANE
0.25 (0.0098)
0.10 (0.0040)
4
1
85
5.00 (0.1968)
4.80 (0.1890)
4.00 (0.1574)
3.80 (0.1497)
1.27 (0.0500)
BSC
6.20 (0.2441)
5.80 (0.2284)
0.51 (0.0201)
0.31 (0.0122)
COPLANARITY
0.10
Figure 13. 8-Lead Standard Small Outline Package [SOIC_N]
Narrow Body
(R-8)
Dimensions shown in millimeters and (inches)
OP777/OP727/OP747
–14– REV. D
8
5
41
PIN 1
0.65 BSC
SEATING
PLANE
0.15
0.05
0.30
0.19
1.20
MAX
0.20
0.09
6.40 BSC
4.50
4.40
4.30
3.10
3.00
2.90
COPLANARIT
Y
0.10
0.75
0.60
0.45
COMPLIANT TO JEDEC STANDARDS MO-153-AA
Figure 14. 8-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-8)
Dimensions shown in millimeters
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
COMPLIANT TO JEDEC STANDARDS MS-012-AB
060606-A
14
8
7
1
6.20 (0.2441)
5.80 (0.2283)
4.00 (0.1575)
3.80 (0.1496)
8.75 (0.3445)
8.55 (0.3366)
1.27 (0.0500)
BSC
SEATING
PLANE
0.25 (0.0098)
0.10 (0.0039)
0.51 (0.0201)
0.31 (0.0122)
1.75 (0.0689)
1.35 (0.0531)
0.50 (0.0197)
0.25 (0.0098)
1.27 (0.0500)
0.40 (0.0157)
0.25 (0.0098)
0.17 (0.0067)
COPLANARITY
0.10
45°
Figure 15. 14-Lead Standard Small Outline Package [SOIC_N]
Narrow Body
(R-14)
Dimensions shown in millimeters and (inches)
OP777/OP727/OP747
REV. D –15–
COMPLIANT TO JEDEC STANDARDS MO-153-AB-1
061908-A
4.50
4.40
4.30
14
8
7
1
6.40
BSC
PIN 1
5.10
5.00
4.90
0.65 BSC
0.15
0.05
0.30
0.19
1.20
MAX
1.05
1.00
0.80
0.20
0.09
0.75
0.60
0.45
COPLANARITY
0.10
SEATING
PLANE
Figure 16. 14-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-14)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option Branding
OP727AR –40°C to +85°C 8-Lead SOIC_N R-8
OP727AR-REEL –40°C to +85°C 8-Lead SOIC_N R-8
OP727AR-REEL7 –40°C to +85°C 8-Lead SOIC_N R-8
OP727ARUZ –40°C to +85°C 8-Lead TSSOP RU-8
OP727ARUZ-REEL –40°C to +85°C 8-Lead TSSOP RU-8
OP727ARZ –40°C to +85°C 8-Lead SOIC_N R-8
OP727ARZ-REEL –40°C to +85°C 8-Lead SOIC_N R-8
OP727ARZ-REEL7 –40°C to +85°C 8-Lead SOIC_N R-8
OP747ARU –40°C to +85°C 14-Lead TSSOP RU-14
OP747ARU-REEL –40°C to +85°C 14-Lead TSSOP RU-14
OP747ARUZ –40°C to +85°C 14-Lead TSSOP RU-14
OP747ARUZ-REEL –40°C to +85°C 14-Lead TSSOP RU-14
OP747ARZ –40°C to +85°C 14-Lead SOIC R-14
OP747ARZ-REEL –40°C to +85°C 14-Lead SOIC R-14
OP747ARZ-REEL7 –40°C to +85°C 14-Lead SOIC R-14
OP777ARMZ –40°C to +85°C 8-Lead MSOP RM-8 A1A
OP777ARMZ-REEL –40°C to +85°C 8-Lead MSOP RM-8 A1A
OP777ARZ –40°C to +85°C 8-Lead SOIC_N R-8
OP777ARZ-REEL –40°C to +85°C 8-Lead SOIC_N R-8
OP777ARZ-REEL7 –40°C to +85°C 8-Lead SOIC_N R-8
1
Z = RoHS Compliant Part.

OP777ARZ

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Precision Amplifiers Prec RRO SGL Supply 3-30V 100uV Max
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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