Package and PCB thermal data VND5050AJ-E / VND5050AK-E
28/37 Doc ID 12272 Rev 10
Figure 34. PowerSSO-24™ Thermal impedance junction ambient single pulse (one
channel on)
Equation 2: pulse calculation formula
where δ = t
P
/T
Figure 35. Thermal fitting model of a double channel HSD in PowerSSO-24™
(b)
b. The fitting model is a simplified thermal tool and is valid for transient evolutions where the embedded
protections (power limitation or thermal cycling during thermal shutdown) are not triggered.
Z
THδ
R
TH
δ Z
THtp
1 δ()+=
VND5050AJ-E / VND5050AK-E Package and PCB thermal data
Doc ID 12272 Rev 10 29/37
Table 16. PowerSSO-24™ thermal parameter
Area/island (cm
2
)Footprint28
R1=R7 (°C/W) 0.4
R2=R8 (°C/W) 2
R3 (°C/W) 6
R4 (°C/W) 7.7
R5 (°C/W) 9 9 8
R6 (°C/W) 28 17 10
C1=C7 (W.s/°C) 0.001
C2=C8 (W.s/°C) 0.0022
C3 (W.s/°C) 0.025
C4 (W.s/°C) 0.75
C5 (W.s/°C) 1 4 9
C6 (W.s/°C) 2.2 5 17
Package and packing information VND5050AJ-E / VND5050AK-E
30/37 Doc ID 12272 Rev 10
5 Package and packing information
5.1 ECOPACK
®
packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK
®
is an ST trademark.
5.2 PowerSSO-12™
package information
Figure 36. PowerSSO-12™ package dimensions

VND5050AK-E

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
Power Switch ICs - Power Distribution Double Ch Hi Side Driver analog
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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