Not for New Designs
TFBS6711
www.vishay.com
Vishay Semiconductors
Rev. 2.0, 06-Sep-13
7
Document Number: 84676
For technical questions, contact: irdasupportAM@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SETTING TO THE LOWER BANDWIDTH MODE
(2.4 kbit/s to 115.2 kbit/s)
1. Set SD input to logic “high”.
2. Set TXD input to logic “low”. Wait t
s
200 ns.
3. Set SD to logic “low” (this negative edge latches state of
TXD, which determines speed setting).
4. TXD must be held for t
h
200 ns.
TXD is now enabled as normal TXD input for the lower
bandwidth mode.
Fig. 4 - Mode Switching Timing Diagram
RECOMMENDED SOLDER PROFILES
Solder Profile for Sn/Pb Soldering
Fig. 5 - Recommended Solder Profile for Sn/Pb Soldering
Lead (Pb)-free, Recommended Solder Profile
The TFBS6711 is a lead (Pb)-free transceiver and qualified
for lead (Pb)-free processing. For lead (Pb)-free solder paste
like Sn
(3.0-4.0)
Ag
(0.5-0.9)
Cu, there are two standard reflow
profiles: Ramp-Soak-Spike (RSS) and Ramp-To-Spike
(RTS). The Ramp-Soak-Spike profile was developed
primarily for reflow ovens heated by infrared radiation. With
widespread use of forced convection reflow ovens the
Ramp-To-Spike profile is used increasingly. Shown in
figure 5 and 6 are Vishay’s recommended profiles for use
with the TFBS6711 transceivers. For more details please
refer to the application note “SMD Assembly Instructions”.
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices wave
soldering is not recommended.
Manual Soldering
Manual soldering is the standard method for lab use.
However, for a production process it cannot be
recommended because the risk of damage is highly
dependent on the experience of the operator. Nevertheless,
we added a chapter to the above mentioned application
note, describing manual soldering and desoldering.
Storage
The storage and drying processes for all Vishay transceivers
(TFDUxxxx and TFBSxxx) are equivalent to MSL4.
The data for the drying procedure is given on labels on the
packing and also in the application note “Taping, Labeling,
Storage and Packing”.
Fig. 6 - Solder Profile, RSS Recommendation
TXD
SD
t
s
t
h
50 %
High: FIR
Low: SIR
50 %
50 %
14873
TRUTH TABLE
INPUTS OUTPUTS
SD TXD INPUT IRRADIANCE mW/m
2
RXD TRANSMITTER
High x x Weakly pulled (500 k) high 0
Low High x Low active (echo) I
e
Low High > 80µs x High 0
Low Low < 4 High 0
Low Low
> min. irradiance E
e
in angular range
< max. irradiance E
e
in angular range
Low (active) 0
Low Low > max. irradiance E
e
in angular range x 0
0
20
40
60
80
100
120
140
160
180
200
220
240
260
0 50 100 150 200 250 300 350
Time (s)
Temperature (°C)
2 °C/s to 4 °C/s
2 °C/s to 4 °C/s
0
20
40
60
80
100
120
140
160
180
200
220
240
260
280
0 50 100 150 200 250 300 350
Time (s)
Temperature (°C)
T
peak
= 260 °C max.
50 s max.
19261
