34
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T4088/98/108/118 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 40-BIT
CONFIGURATION 16,384 x 40, 32,768 x 40, 65,536 x 40 and 131,072 x 40
FEBRUARY 13, 2009
Figure 13. Read Cycle, Output Enable, Empty Flag and First Data Word Latency in Double Data Rate Mode (IDT Standard Mode)
NOTES:
1. t
SKEW2 is the minimum time between a falling WCLK edge and a rising RCLK edge to guarantee that EF will go HIGH (after one RCLK cycle plus tREF). If the time between the falling edge of WCLK and the rising edge of RCLK
is less than t
SKEW2, then EF deassertion may be delayed one extra RCLK cycle.
2. REN = LOW.
3. First data word latency = t
SKEW1 + 1*tRCLK + tREF.
4. RCS = LOW, WSDR = HIGH and RSDR = HIGH.
5. RCLK must be free running for EF to update.
t
OLZ
t
REF
t
REF
D
n
D
n
D
0
t
A
D
1
t
OHZ
t
OLZ
Q
0-
Q
39
EF
OE
WCLK
WEN
D
0
-D
39
5995 drw16
D
0
D
1
t
DH
t
DS
t
DS
t
DH
t
ENS
t
ENH
t
REF
t
A
RCLK
12
t
SKEW2
(1)
t
CLK2
t
CLKH2
t
OE
t
A
WCS
t
WCSS
t
WCSH
t
A
D
n
-
1
NO Read NO Read NO Read NO Read
t
CLKL2
35
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T4088/98/108/118 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 40-BIT
CONFIGURATION 16,384 x 40, 32,768 x 40, 65,536 x 40 and 131,072 x 40
FEBRUARY 13, 2009
Figure 14. Read Cycle, Empty Flag and First Data Word Latency in x40DDR to x10SDR with Bus-Matching and Rate-Matching (IDT Standard Mode)
RCLK
EF
WEN
REN
WCS
tENS
tSKEW2
(1)
D0-D39
tDS
W
0
- W
3
Q0-Q9
WCLK
tENH
twcSH
tWCSS
W
4
-
W
7
tDH
tDS
tDH
12
tREF
tENS
tA tA
tA tA tA
W0
W1 W2
tA
tA
tA
W3
W4 W5 W6
W7
tENH
tREF
Previous Data in Ouput Register
5995 drw17
NOTES:
1. t
SKEW2 is the minimum time between a falling WCLK edge and a rising RCLK edge to guarantee that EF will go HIGH (after one RCLK cycle plus tREF). If the time between the falling edge of WCLK and the rising edge of RCLK
is less than t
SKEW2, then EF deassertion may be delayed one extra RCLK cycle.
2. REN = LOW.
3. First data word latency = t
SKEW1 + 1*tRCLK + tREF.
4. RCS = LOW, WSDR = HIGH and RSDR = HIGH.
5. RCLK must be free running for EF to update.
36
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T4088/98/108/118 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 40-BIT
CONFIGURATION 16,384 x 40, 32,768 x 40, 65,536 x 40 and 131,072 x 40
FEBRUARY 13, 2009
Figure 15. Read Cycle and Empty Flag in x20SDR to x40DDR with Bus-Matching and Rate-Matching (IDT Standard Mode)
NOTES:
1. t
SKEW1 is the minimum time between a rising WCLK edge and a rising RCLK edge to guarantee that EF will go HIGH (after one RCLK cycle plus tREF). If the time between the rising edge of WCLK and the rising edge of RCLK is
less than t
SKEW1, then EF deassertion may be delayed one extra RCLK cycle.
2. OE = LOW.
3. First data word latency = t
SKEW1 + 1*tRCLK + tREF.
4. RCS = LOW, WCS = LOW, WSDR = LOW and RSDR = HIGH.
5. RCLK must be free running for EF to update.
Q
0-
Q
39
t
SKEW
(1)
WCLK
RCLK
REN
12
WEN
t
REF
EF
D
0
-D
19
5995 drw18
t
REF
t
REF
Last Word Last 40-bit Word
t
ENS
t
ENH
W
0
W
1
W
2
W
3
t
ENH
t
ENS
W
0
-W
1
t
A
t
A
t
A
t
A
t
DS
t
DH
t
DS
t
DH
t
DS
t
DH
t
DH
t
DS
t
CLK2
t
CLKH2
t
CLKL2
Previous Data
t
ENH
NO Read
W
2
-W
3

IDT72T40108L5BB

Mfr. #:
Manufacturer:
Description:
IC FIFO DDR/SDR 5NS 208-BGA
Lifecycle:
New from this manufacturer.
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