37
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T4088/98/108/118 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 40-BIT
CONFIGURATION 16,384 x 40, 32,768 x 40, 65,536 x 40 and 131,072 x 40
FEBRUARY 13, 2009
Figure 16. Write Cycle and Full Flag Timing in x20DDR to x40SDR with Bus-Matching and Rate-Matching (IDT Standard Mode)
WCLK
FF
WEN
RCS
tENS
tSKEW1
(1)
Q0-Q39
RCLK
tENH
tENS
1
2
tWFF
D0-D19
REN
t
RCSLZ
tA
tDS tDStDH tDH
tWFF
tSKEW1
(1)
tENS
tENH
tA
1
2
tWFF
tDS tDStDH tDH
tCLK2
tCLKH2
tCLKL2
NO WRITE
NO WRITE
tWFF
DATA READ
NEXT DATA READ
Wx
Wx+1 Wx+2 Wx+3
5995 drw19
NOTES:
1. t
SKEW1 is the minimum time between a rising RCLK edge and a rising WCLK edge to guarantee that FF will go HIGH (after one WCLK cycle plus tWFF). If the time between the rising edge of the RCLK and the rising edge of the
WCLK is less than t
SKEW1, then the FF deassertion may be delayed one extra WCLK cycle.
2. LD = HIGH, OE = LOW, EF = HIGH.
3. WCS = LOW.
4. WCLK must be free running for FF to update.
38
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T4088/98/108/118 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 40-BIT
CONFIGURATION 16,384 x 40, 32,768 x 40, 65,536 x 40 and 131,072 x 40
FEBRUARY 13, 2009
Figure 17. Write Cycle and Full Flag in x40SDR to x20DDR with Bus-Matching and Rate-Matching (IDT Standard Mode)
WCLK
FF
WEN
RCS
t
ENS
Q0-Q19
RCLK
t
ENH
t
ENS
1
2
t
WFF
D0-D39
REN
t
RCSLZ
t
A
t
DS
t
DH
t
ENS
t
ENH
t
A
1
2
t
DS
t
DS
t
DH
t
DH
t
CLK1
NO WRITE
NO WRITE
t
WFF
DATA READ
NEXT DATA READ
Wx
Wx+2 Wx+3
t
A
t
DS
t
DH
Wx+1
t
CLKH1
t
CLKH1
t
WFF
t
A
t
SKEW2
(1)
t
WFF
t
ENS
t
RCSHZ
DATA
READ
NEXT DATA
READ
5995 drw20
t
SKEW2
(1)
NOTES:
1. t
SKEW2 is the minimum time between a falling RCLK edge and a rising WCLK edge to guarantee that FF will go HIGH (after one WCLK cycle plus tWFF). If the time between the falling edge of the RCLK and the rising edge of WCLK
is less than t
SKEW2, then FF deassertion may be delayed one extra WCLK cycle.
2. OE = LOW, EF = HIGH.
3. WCS = LOW, RCS = LOW, WSDR = HIGH and RSDR = HIGH.
4. WCLK must be free running for FF to update.
39
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T4088/98/108/118 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 40-BIT
CONFIGURATION 16,384 x 40, 32,768 x 40, 65,536 x 40 and 131,072 x 40
FEBRUARY 13, 2009
Figure 18. Read Cycle and Read Chip Select (IDT Standard Mode)
NOTES:
1. tSKEW1 is the minimum time between a rising WCLK edge and a rising RCLK edge to guarantee that EF will go HIGH (after one RCLK cycle plus tREF). If the time between the
rising edge of WCLK and the rising edge of RCLK is less than tSKEW1, then EF deassertion may be delayed one extra RCLK cycle.
2. First data word latency = tSKEW1 + 1*TRCLK + tREF.
3. OE is LOW.
4. RCLK must be free running for EF to update.
RCLK
REN
1
2
5995 drw21
RCS
Q0 - Qn
WCLK
WEN
Dn
t
ENS
LAST DATA
D
x
t
ENS
t
ENS
t
ENS
EF
t
A
t
REF
t
REF
t
RCSLZ
LAST DATA-1
t
RCSHZ
t
RCSLZ
t
A
t
RCSHZ
t
SKEW1
(1)
t
ENH
t
ENS
t
DH
t
DS
t
ENH

IDT72T40118L5BB

Mfr. #:
Manufacturer:
Description:
IC FIFO DDR/SDR 5NS 208-BGA
Lifecycle:
New from this manufacturer.
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