MML09231HT1
1
RF Device Data
Freescale Semiconductor, Inc.
Enhancement Mode pHEMT
Technology (E--pHEMT)
Low Noise Amplifier
The MML09231H is a single-- s tage low nois e amplifier (LNA) w ith active
bias and high isolation for us e in cellular infrastructure applications. It is
designed for a range of low noise, high linearity applic ations such as small
cell, tower mounted amplifiers (TMA) and receiv er front -- end c ircuits. It
operates from a single voltage s upply and is suitable for applic ations with
frequencies from 700 to 1400 MHz such as ISM, GSM, W--CDMA and LTE.
Features
Ultra Low Noise Figure: 0.36 dB @ 900 MHz
Frequency: 700--1400 MHz
Unconditionally Stable Over Temperature
High Reverse Isolation: --21 dB @ 900 MHz
P1dB: 24.5 dBm @ 900 MHz
Small--Signal Gain: 17.2 dB @ 900 MHz (adjustable externally)
Third Order Output Intercept Point: 37.4 dBm @ 900 MHz
Single 5 V Supply
Power--down Pin
Supply Current: 55 mA
50 Ohm Operation (some external matching required)
Cost--effective 8--pin, 2 mm DFN Surface Mount Plastic Package
In Tape and Reel. T1 Suffix = 1,000 Units, 12 mm Tape Width, 7--inch Reel.
DFN 2 2
700--1400 MHz, 17.2 dB
24.5dBm,0.36dBNF
E--pHEMT LNA
MML09231HT1
Table 1. Typical Performance
(1)
Characteristic Symbol
700
MHz
900
MHz
1400
MHz
Unit
Noise Figure
(2a)
NF 0.46
(b)
0.36
(b)
0.45
(b)
dB
Input Return Loss
(S11)
IRL -- 1 7 -- 1 5 -- 1 4 dB
Output Return Loss
(S22)
ORL -- 1 4 -- 1 5 -- 1 5 dB
Small--Signal Gain
(S21)
G
p
19 17.2 13.2 dB
Power Output @
1dB Compression
P1dB 24 24.5 24 dBm
Third Order Input
Intercept Point
IIP3 17 20.2 23.8 dBm
Third Order Output
Intercept Point
OIP3 36 37.4 37 dBm
1. V
DD
=5Vdc,T
A
=25C, 50 ohm system, application circuit
tuned for specified frequency.
2. (a) Noise figure value calculated with connector losses
removed. (b) Z
in
=50.
Table 2. Maximum Ratings
Rating Symbol Value Unit
Supply Voltage V
DD
6 V
Supply Current I
DD
150 mA
RF Input Power P
in
20 dBm
Storage Temperature Range T
stg
--65 to +150 C
Junction Temperature T
J
175 C
Table 3. Thermal Characteristics
Characteristic Symbol Value
(3)
Unit
Thermal Resistance, Junction to Case
Case Temperature 95C, 5 V dc, 55 mA, no RF applied
R
JC
77 C/W
3. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf.
Select Documentation/Application Notes -- AN1955.
This document contains information on a preproduction product. Specifications and information herein are subject to change without notice.
Freescale Semiconductor
Technical Data
Document Number: MML09231H
Rev. 1, 9/2014
Freescale Semiconductor, Inc., 2013--2014.
A
ll rights reserved.
Figure 1. Pin Connections
(Top View)
RF
out
/V
DD
RF
in
18
27
36
N.C.
4 5
V
BIAS
N.C.
Power Down
N.C.
GND
N.C.
Note: Exposed backside of the package is
DC and RF ground.
2
RF Device Data
Freescale Semiconductor, Inc.
MML09231HT1
Table 4. Electrical Characteristics (V
DD
= 5 Vdc, 900 MHz, T
A
=25C, 50 ohm system, in Freescale Application Circuit)
Characteristic Symbol Min Typ Max Unit
Small--Signal Gain (S21) G
p
15.8 17.2 dB
Input Return Loss (S11) IRL -- 1 5 dB
Output Return Loss (S22) ORL -- 1 5 dB
Power Output @ 1dB Compression P1dB 24.5 dBm
Third Order Input Intercept Point IIP3 20.2 dBm
Third Order Output Intercept Point OIP3 37.4 dBm
Reverse Isolation (S12) |S12| -- 2 1 dB
Noise Figure
(1)
NF 0.36 dB
Supply Current
(2)
I
DD
40 55 70 mA
Supply Voltage V
DD
5 V
Supply Current in Power Down Mode I
PD
1.1 mA
Logic Voltage for Power Down
(3)
Input High Voltage
Input Low Voltage
V
PD
2.2
0
V
DD
0.5
V
1. Noise figure value calculated with connector losses removed.
2. DC current measured with no RF signal applied.
3. Limits derived from device characterization.
Table 5. Functional Pin Description
Pin
Number
Pin Function
1 V
BIAS
2 RF
in
3 No Connection
4 No Connection
5 No Connection
6 No Connection
7 RF
out
/Supply Voltage
8 Power Down (active high)
Table 6. ESD Protection Characteristics
Test Methodology Class
Human Body Model (per JESD 22--A114) 1B, passes 700 V
Machine Model (per EIA/JESD 22--A115) A
Charge Device Model (per JESD 22--C101) IV
Table 7. Moisture Sensitivity Level
Test Methodology Rating Package Peak Temperature Unit
Per JESD22--A113, IPC/JEDEC J--STD--020 1 260 C
MML09231HT1
3
RF Device Data
Freescale Semiconductor, Inc.
50 OHM APPLICATION CIRCUIT: 900 MHz
RF
OUTPUT
L1
C1
C2
L2
C4
C3
2
5
7
6
BIAS
CIRCUIT
RF
INPUT
3
1
8
4
N.C.
R1
R2
C5
C6
POWER
DOWN
V
DD
N.C.
N.C.
N.C.
Figure 2. MML09231H Test Circuit Schematic
Table 8. MML09231H Test Circuit Component Designations and Values
Part Description Part Number Manufacturer
C1 100 pF Chip Capacitor GRM1555C1H101JA01 Murata
C2 180 pF Chip Capacitor GRM1555C1H181JA01 Murata
C3 27 pF Chip Capacitor GRM1555C1H270JA01 Murata
C4 220 pF Chip Capacitor GRM1555C1H221JA01 Murata
C5, C6 1000 pF Chip Capacitors GRM1885C1H102JA01 Murata
L1 20 nH Chip Inductor 0402HP-20NXGLW Coilcraft
L2 47 nH Chip Inductor 0402HP-47NXGLW Coilcraft
R1
4.7 k 1/10 W Chip Resistor
CR21-472J-B Kyocera
R2
0 , 1 A Chip Resistor
CR0402-J/-000GLFCT Bourns
PCB
0.02,
r
=3.50
RO4350B Rogers

MML09231HT1

Mfr. #:
Manufacturer:
NXP / Freescale
Description:
RF Amplifier 21DBM GAAS AMP DFN2X2-8
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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