IRF9Z34NPBF

IRF9Z34NPbF
HEXFET
®
Power MOSFET
PD - 94983
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This
benefit, combined with the fast switching speed and
ruggedized device design that HEXFET Power
MOSFETs are well known for, provides the designer
with an extremely efficient and reliable device for use
in a wide variety of applications.
The TO-220 package is universally preferred for all
commercial-industrial applications at power dissipation
levels to approximately 50 watts. The low thermal
resistance and low package cost of the TO-220
contribute to its wide acceptance throughout the
industry.
Parameter Max. Units
I
D
@ T
C
= 25°C Continuous Drain Current, V
GS
@ -10V -19
I
D
@ T
C
= 100°C Continuous Drain Current, V
GS
@ -10V -14 A
I
DM
Pulsed Drain Current -68
P
D
@T
C
= 25°C Power Dissipation 68 W
Linear Derating Factor 0.45 W/°C
V
GS
Gate-to-Source Voltage ± 20 V
E
AS
Single Pulse Avalanche Energy 180 mJ
I
AR
Avalanche Current -10 A
E
AR
Repetitive Avalanche Energy 6.8 mJ
dv/dt Peak Diode Recovery dv/dt -5.0 V/ns
T
J
Operating Junction and -55 to + 175
T
STG
Storage Temperature Range
Soldering Temperature, for 10 seconds 300 (1.6mm from case )
°C
Mounting torque, 6-32 or M3 screw 10 lbfin (1.1Nm)
Absolute Maximum Ratings
Parameter Typ. Max. Units
R
θJC
Junction-to-Case  2.2
R
θCS
Case-to-Sink, Flat, Greased Surface 0.50  °C/W
R
θJA
Junction-to-Ambient  62
Thermal Resistance
V
DSS
= -55V
R
DS(on)
= 0.10
I
D
= -19A
T
O
-22
0
AB
l Advanced Process Technology
l Dynamic dv/dt Rating
l 175°C Operating Temperature
l Fast Switching
l P-Channel
l Fully Avalanche Rated
Description
02/05/04
S
D
G
l Lead-Free
IRF9Z34NPbF
Parameter Min. Typ. Max. Units Conditions
I
S
Continuous Source Current MOSFET symbol
(Body Diode)
 
showing the
I
SM
Pulsed Source Current integral reverse
(Body Diode)
 
p-n junction diode.
V
SD
Diode Forward Voltage   -1.6 V T
J
= 25°C, I
S
= -10A, V
GS
= 0V
t
rr
Reverse Recovery Time  54 82 ns T
J
= 25°C, I
F
= -10A
Q
rr
Reverse RecoveryCharge  110 160 nC di/dt = -100A/µs
t
on
Forward Turn-On Time Intrinsic turn-on time is negligible (turn-on is dominated by L
S
+L
D
)
Parameter Min. Typ. Max. Units Conditions
V
(BR)DSS
Drain-to-Source Breakdown Voltage -55   V V
GS
= 0V, I
D
= -250µA
V
(BR)DSS
/T
J
Breakdown Voltage Temp. Coefficient  -0.05  V/°C Reference to 25°C, I
D
= -1mA
R
DS(on)
Static Drain-to-Source On-Resistance   0.10 V
GS
= -10V, I
D
= -10A
V
GS(th)
Gate Threshold Voltage -2.0  -4.0 V V
DS
= V
GS
, I
D
= -250µA
g
fs
Forward Transconductance 4.2   S V
DS
= 25V, I
D
= -10A
  -25
µA
V
DS
= -55V, V
GS
= 0V
  -250 V
DS
= -44V, V
GS
= 0V, T
J
= 150°C
Gate-to-Source Forward Leakage   100 V
GS
= 20V
Gate-to-Source Reverse Leakage   -100
nA
V
GS
= -20V
Q
g
Total Gate Charge   35 I
D
= -10A
Q
gs
Gate-to-Source Charge   7.9 nC V
DS
= -44V
Q
gd
Gate-to-Drain ("Miller") Charge   16 V
GS
= -10V, See Fig. 6 and 13
t
d(on)
Turn-On Delay Time  13  V
DD
= -28V
t
r
Rise Time  55  I
D
= -10A
t
d(off)
Turn-Off Delay Time  30  R
G
= 13
t
f
Fall Time  41  R
D
= 2.6Ω, See Fig. 10
Between lead,
 
6mm (0.25in.)
from package
and center of die contact
C
iss
Input Capacitance  620  V
GS
= 0V
C
oss
Output Capacitance  280  pF V
DS
= -25V
C
rss
Reverse Transfer Capacitance  140   = 1.0MHz, See Fig. 5
nH
Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
L
D
Internal Drain Inductance
L
S
Internal Source Inductance  
I
GSS
ns
4.5
7.5
I
DSS
Drain-to-Source Leakage Current
Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
I
SD
-10A, di/dt -290A/µs, V
DD
V
(BR)DSS
,
T
J
175°C
Notes:
Starting T
J
= 25°C, L = 3.6mH
R
G
= 25, I
AS
= -10A. (See Figure 12)
Pulse width 300µs; duty cycle 2%.
S
D
G
Source-Drain Ratings and Characteristics
A
S
D
G
-19
-68
IRF9Z34NPbF
Fig 4. Normalized On-Resistance
Vs. Temperature
Fig 2. Typical Output CharacteristicsFig 1. Typical Output Characteristics
Fig 3. Typical Transfer Characteristics
1
10
100
0.1 1 10 100
D
DS
20µs PULSE WIDTH
T = 25°C
c
A
-I , Drain-to-Source Current (A)
-V , Drain-to-Source Voltage (V)
VGS
TOP - 15V
- 10V
- 8.0V
- 7.0V
- 6.0V
- 5.5V
- 5.0V
BOT TOM - 4. 5V
-4.5V
1
10
100
0.1 1 10 100
D
DS
A
-I , Drain-to-Source Current (A)
-V , Drain-to-Source Voltage (V)
VGS
TOP - 15V
- 10V
- 8.0V
- 7.0V
- 6.0V
- 5.5V
- 5.0V
BOTTOM - 4.5V
-4.5V
20µs PULSE WIDTH
T = 175°C
C
1
10
100
45678910
T = 25°C
J
GS
D
A
-I , Drain-to-Source Current (A)
-V , Gate-to-Source Voltage (V)
V = -25V
20µs PULSE WIDTH
DS
T = 175°C
J
0.0
0.5
1.0
1.5
2.0
-60 -40 -20 0 20 40 60 80 100 120 140 160 180
J
T , Junction Temperature (°C)
R , Drain-to-Source On Resistance
DS(on)
(Normalized)
A
V = -10V
GS
I = -17A
D

IRF9Z34NPBF

Mfr. #:
Manufacturer:
Infineon / IR
Description:
MOSFET MOSFT PCh -55V -17A 100mOhm 23.3nC
Lifecycle:
New from this manufacturer.
Delivery:
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