SMP1304-085LF

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
201683F • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • June 13, 2013 1
DATA SHEET
SMP1304-085LF: Surface Mount PIN Diode for High Power
Switch Applications
Applications
Low loss, high power switches
Low distortion attenuators
Features
Low-thermal resistance: 35 °C/W
Suitable for 100 W Continuous Wave T/R switches
Low capacitance: 0.3 pF
Low distortion performance
QFN (3-pin, 2 x 2 mm) package (MSL1, 260 °C per JEDEC
J-STD-020)
Figure 1. SMP1304-085LF Block Diagram
Description
The SMP1304-085LF is a surface mountable, low capacitance
silicon PIN diode designed as a shunt connected PIN diode for high
power, high volume switch and attenuator applications from
10 MHz to beyond 6 GHz.
Maximum resistance at 100 mA is 2 Ω and maximum capacitance
at 30 V is 0.3 pF. The combination of low junction capacitance,
low parasitic inductance, low thermal resistance, and nominal
100 μm I-region width, makes the SMP1304-085LF useful in
large signal switches and attenuator applications.
The device has a 2.5 W dissipation power rating, making it
capable of handling more than 100 W Continuous Wave (CW) and
1000 W peak (1 μs pulse, 1 percent duty cycle) in a shunt-
connected transmit/receive (T/R) switch.
Design information for high power switches may be found in the
Skyworks Application Note, Design With PIN Diodes (document
number 200312).
A block diagram of the SMP1304-085LF is shown in Figure 1.
DATA SHEET • SMP1304-085LF SURFACE MOUNT PIN DIODE
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
2 June 13, 2013 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice 201683F
Table 1. SMP1304-085LF Absolute Maximum Ratings
Parameter Symbol Minimum Maximum Units
Reverse voltage VR 200 V
Forward current @ 25 °C IF 1.5 A
CW power dissipation @ 85 °C PD 2.5 W
Storage temperature TSTG 65 +200 °C
Operating temperature TA 40 +150 °C
Note: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.
CAUTION: Although this device is designed to be as robust as possible, Electrostatic Discharge (ESD) can damage this device. This device
must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body
or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times. The
SMP1304-085LF has been tested as a Class 1C, Human Body Model (HBM) device.
Table 2. SMP1304-085LF Electrical Specifications (Note 1)
(T
A
= +25 °C Unless Otherwise Noted)
Parameter Symbol Test Condition Min Typical Max Units
Reverse current IR V
R
= 200 V 10 μA
Capacitance CT f = 1 MHz, V
R
= 30 V 0.23 0.30 pF
Resistance RS f = 100 MHz
I
F = 1 mA
I
F = 10 mA
I
F = 100 mA
40.00
5.50
1.22
50.00
7.00
2.00
Ω
Ω
Ω
Forward voltage VF IF = 10 mA 0.8 V
Carrier lifetime TL IF = 10 mA 1 μs
I region width W 100 μm
CW thermal resistance θJC Based on thermal
resistance = 92 °C/W for
junction-to-bottom of
circuit board
35 °C/W
Note 1: Performance is guaranteed only under the conditions listed in this Table.
Electrical and Mechanical Specifications
The absolute maximum ratings of the SMP1304-085LF are
provided in Table 1. Electrical specifications are provided in
Table 2.
Typical performance characteristics of the SMP1304-085LF are
illustrated in Figures 2 and 3.
DATA SHEET • SMP1304-085LF SURFACE MOUNT PIN DIODE
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
201683F • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice June 13, 2013 3
Typical Performance Characteristics
(TA = 25 °C, Unless Otherwise Noted)
Figure 2. Series Resistance vs Current @ 100 MHz
Figure 3. Forward Voltage vs Forward Current
High Power Switch Design Application
The SMP1304-085LF PIN diode is designed for shunt applications
such as reflective switches or shunt-diode attenuator circuits.
Compared to other surface mount packages, the design of the
QFN package produces lower thermal resistance and also reduces
the effects of the parasitic inductance of the anode bond wires.
A cross-sectional view of the SMP1304-085LF PIN diode is shown
in Figure 4. The cathode of the die is soldered directly to the top of
the exposed paddle. This paddle is composed of copper, so its
thermal resistance is very low.
The copper ground paddle minimizes the total thermal resistance
between the I layer, which is the location where most heat is
generated under normal operation, and the surface to which the
package is mounted. Minimal thermal resistance between the I
layer and the external environment minimizes junction
temperature.
The electrically equivalent circuit of the SMP1304-085LF PIN
diode is shown in Figure 5. The inductances of pins 1 and 2, as
well as the inductances of the bond wires are in series with the
input and output transmission lines of the external circuit rather
than the portion of the circuit that contains the shunt PIN diode.
Figure 4. Cross-Sectional View of the SMP1304-085LF

SMP1304-085LF

Mfr. #:
Manufacturer:
Skyworks Solutions, Inc.
Description:
PIN Diodes .3pF -40C +150C Common Cathode
Lifecycle:
New from this manufacturer.
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