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74LVC574APW,112

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P20
74LVC574A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 5 — 18 December 2012 12 of 19
NXP Semiconductors
74LVC574A
Octal D-type flip-flop; 5 V tolerance; positive edge-trigger; 3-state
12. Package outline
Fig 11. Package outline SOT163-1 (SO20)
UNIT
A
max.
A
1
A
2
A
3
b
p
cD
(1)
E
(1) (1)
eH
E
LL
p
Q
Z
ywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
inches
2.65
0.3
0.1
2.45
2.25
0.49
0.36
0.32
0.23
13.0
12.6
7.6
7.4
1.27
10.65
10.00
1.1
1.0
0.9
0.4
8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
1.1
0.4
SOT163-1
10
20
w M
b
p
detail X
Z
e
11
1
D
y
0.25
075E04 MS-013
pin 1 index
0.1
0.012
0.004
0.096
0.089
0.019
0.014
0.013
0.009
0.51
0.49
0.30
0.29
0.05
1.4
0.055
0.419
0.394
0.043
0.039
0.035
0.016
0.01
0.25
0.01
0.004
0.043
0.016
0.01
0 5 10 mm
scale
X
θ
A
A
1
A
2
H
E
L
p
Q
E
c
L
v M
A
(A )
3
A
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
99-12-27
03-02-19
74LVC574A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 5 — 18 December 2012 13 of 19
NXP Semiconductors
74LVC574A
Octal D-type flip-flop; 5 V tolerance; positive edge-trigger; 3-state
Fig 12. Package outline SOT339-1 (SSOP20)
UNIT A
1
A
2
A
3
b
p
cD
(1)
E
(1)
eH
E
LL
p
Q
(1)
Zywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.21
0.05
1.80
1.65
0.38
0.25
0.20
0.09
7.4
7.0
5.4
5.2
0.65
7.9
7.6
0.9
0.7
0.9
0.5
8
0
o
o
0.131.25 0.2 0.1
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.
1.03
0.63
SOT339-1 MO-150
99-12-27
03-02-19
X
w M
θ
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v M
A
(A )
3
A
110
20 11
y
0.25
pin 1 index
0 2.5 5 mm
scale
SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm
SOT339-1
A
max.
2
74LVC574A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 5 — 18 December 2012 14 of 19
NXP Semiconductors
74LVC574A
Octal D-type flip-flop; 5 V tolerance; positive edge-trigger; 3-state
Fig 13. Package outline SOT360-1 (TSSOP20)
UNIT A
1
A
2
A
3
b
p
cD
(1)
E
(2) (1)
eH
E
LL
p
QZywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
6.6
6.4
4.5
4.3
0.65
6.6
6.2
0.4
0.3
0.5
0.2
8
0
o
o
0.13 0.10.21
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT360-1 MO-153
99-12-27
03-02-19
w M
b
p
D
Z
e
0.25
110
20
11
pin 1 index
θ
A
A
1
A
2
L
p
Q
detail X
L
(A )
3
H
E
E
c
v M
A
X
A
y
0 2.5 5 mm
scale
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
SOT360-1
A
max.
1.1
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P20

74LVC574APW,112

Mfr. #:
Buy 74LVC574APW,112
Manufacturer:
Nexperia
Description:
Flip Flops 3.3V OCTAL D FF POS
Lifecycle:
New from this manufacturer.
Delivery:
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