NGTB35N60FL2WG

© Semiconductor Components Industries, LLC, 2016
December, 2016 − Rev. 5
1 Publication Order Number:
NGTB35N60FL2W/D
NGTB35N60FL2WG
IGBT - Field Stop II
This Insulated Gate Bipolar Transistor (IGBT) features a robust and
cost effective Field Stop II Trench construction, and provides superior
performance in demanding switching applications, offering both low
on state voltage and minimal switching loss. The IGBT is well suited
for UPS and solar applications. Incorporated into the device is a soft
and fast co−packaged free wheeling diode with a low forward voltage.
Features
Extremely Efficient Trench with Field Stop Technology
T
Jmax
= 175°C
Soft Fast Reverse Recovery Diode
Optimized for High Speed Switching
5 ms Short−Circuit Capability
These are Pb−Free Devices
Typical Applications
Solar Inverters
Uninterruptible Power Supplies (UPS)
Welding
ABSOLUTE MAXIMUM RATINGS
Rating Symbol Value Unit
Collector−emitter voltage V
CES
600 V
Collector current
@ T
C = 25°C
@ TC = 100°C
I
C
70
35
A
Diode Forward Current
@ T
C = 25°C
@ TC = 100°C
I
F
70
35
A
Diode Pulsed Current
T
PULSE
Limited by T
J
Max
I
FM
120 A
Pulsed collector current, T
pulse
limited by T
Jmax
I
CM
120 A
Short−circuit withstand time
V
GE
= 15 V, V
CE
= 400 V,
T
J
+150°C
t
SC
5
ms
Gate−emitter voltage
V
GE
$20
V
V
Transient gate−emitter voltage
(T
PULSE
= 5 ms, D < 0.10)
$30
Power Dissipation
@ T
C = 25°C
@ TC = 100°C
P
D
300
150
W
Operating junction temperature
range
T
J
−55 to +175 °C
Storage temperature range T
stg
−55 to +175 °C
Lead temperature for soldering, 1/8”
from case for 5 seconds
T
SLD
260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
TO−247
CASE 340AL
C
G
35 A, 600 V
V
CEsat
= 1.70 V
E
OFF
= 0.28 mJ
E
Device Package Shipping
ORDERING INFORMATION
NGTB35N60FL2WG TO−247
(Pb−Free)
30 Units / Rail
www.onsemi.com
A = Assembly Location
Y = Year
WW = Work Week
G = Pb−Free Package
MARKING DIAGRAM
35N60FL2
AYWWG
G
E
C
NGTB35N60FL2WG
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2
THERMAL CHARACTERISTICS
Rating Symbol Value Unit
Thermal resistance junction−to−case, for IGBT
R
q
JC
0.50 °C/W
Thermal resistance junction−to−case, for Diode
R
q
JC
1.00 °C/W
Thermal resistance junction−to−ambient
R
q
JA
40 °C/W
ELECTRICAL CHARACTERISTICS (T
J
= 25°C unless otherwise specified)
Parameter
Test Conditions Symbol Min Typ Max Unit
STATIC CHARACTERISTIC
Collector−emitter breakdown voltage,
gate−emitter short−circuited
V
GE
= 0 V, I
C
= 500 mA
V
(BR)CES
600 V
Collector−emitter saturation voltage V
GE
= 15 V, I
C
= 35 A
V
GE
= 15 V, I
C
= 35 A, T
J
= 175°C
V
CEsat
1.50
1.70
2.20
2.00
V
Gate−emitter threshold voltage
V
GE
= V
CE
, I
C
= 350 mA
V
GE(th)
4.5 5.5 6.5 V
Collector−emitter cut−off current, gate−
emitter short−circuited
V
GE
= 0 V, V
CE
= 600 V
V
GE
= 0 V, V
CE
= 600 V, T
J
=
175°C
I
CES
0.2
4.0
mA
Gate leakage current, collector−emitter
short−circuited
V
GE
= 20 V , V
CE
= 0 V I
GES
100 nA
DYNAMIC CHARACTERISTIC
Input capacitance
V
CE
= 20 V, V
GE
= 0 V, f = 1 MHz
C
ies
3115
pF
Output capacitance C
oes
149
Reverse transfer capacitance C
res
88
Gate charge total
V
CE
= 480 V, I
C
= 35 A, V
GE
= 15 V
Q
g
125
nC
Gate to emitter charge Q
ge
30
Gate to collector charge Q
gc
63
SWITCHING CHARACTERISTIC, INDUCTIVE LOAD
Turn−on delay time
T
J
= 25°C
V
CC
= 400 V, I
C
= 35 A
R
g
= 10 W
V
GE
= 0 V/ 15 V
t
d(on)
72
ns
Rise time t
r
40
Turn−off delay time t
d(off)
132
Fall time t
f
75
Turn−on switching loss E
on
0.84
mJ
Turn−off switching loss E
off
0.28
Total switching loss E
ts
1.12
Turn−on delay time
T
J
= 150°C
V
CC
= 400 V, I
C
= 35 A
R
g
= 10 W
V
GE
= 0 V/ 15 V
t
d(on)
70
ns
Rise time t
r
38
Turn−off delay time t
d(off)
135
Fall time t
f
96
Turn−on switching loss E
on
1.05
mJ
Turn−off switching loss E
off
0.50
Total switching loss E
ts
1.55
DIODE CHARACTERISTIC
Forward voltage
V
GE
= 0 V, I
F
= 35 A
V
GE
= 0 V, I
F
= 35 A, T
J
= 175°C
V
F
1.50
2.20
2.25
2.90
V
Reverse recovery time
T
J
= 25°C
I
F
= 35 A, V
R
= 200 V
di
F
/dt = 200 A/ms
t
rr
68 ns
Reverse recovery charge Q
rr
265 nC
Reverse recovery current I
rrm
7 A
Reverse recovery time
T
J
= 175°C
I
F
= 35 A, V
R
= 400 V
di
F
/dt = 200 A/ms
t
rr
156 ns
Reverse recovery charge Q
rr
836 nC
Reverse recovery current I
rrm
8.43 A
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
NGTB35N60FL2WG
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3
TYPICAL CHARACTERISTICS
Figure 1. Output Characteristics Figure 2. Output Characteristics
V
CE
, COLLECTOR−EMITTER VOLTAGE (V) V
CE
, COLLECTOR−EMITTER VOLTAGE (V)
543210
Figure 3. Output Characteristics Figure 4. Typical Transfer Characteristics
V
CE
, COLLECTOR−EMITTER VOLTAGE (V) V
GE
, GATE−EMITTER VOLTAGE (V)
1480
I
C
, COLLECTOR CURRENT (A)
I
C
, COLLECTOR CURRENT (A)
V
GE
= 20 to 15 V
T
J
= 25°C
10 V
9 V
8 V
7 V
543210
I
C
, COLLECTOR CURRENT (A)
V
GE
= 20 to 17 V
T
J
= 150°C
10 V
9 V
8 V
7 V
I
C
, COLLECTOR CURRENT (A)
V
GE
= 20 to
15 V
T
J
= −55°C
10 V
9 V
8 V
T
J
= 25°C
T
J
= 150°C
11 V
11 V
7 V
876
11 V
678
543210876
140
120
100
80
60
40
20
0
2
6410121816
Figure 5. V
CE(sat)
vs. T
J
T
J
, JUNCTION TEMPERATURE (°C)
3.75
V
CE
, COLLECTOR−EMITTER VOLTAGE (V)
75500−25−50−75 200175100
I
C
= 70 A
I
C
= 35 A
I
C
= 15 A
25 125 150
Figure 6. Typical Capacitance
V
CE
, COLLECTOR−EMITTER VOLTAGE (V)
1007050100
10
100
1000
10,000
C, CAPACITANCE (pF)
C
ies
C
oes
C
res
20 30 40 60 9080
T
J
= 25°C
13 V
13 V
140
140
120
100
80
60
40
20
0
15 V
120
100
80
60
40
20
0
140
120
100
80
60
40
20
0
13 V
I
C
= 5 A
3.50
3.25
3.00
2.75
2.50
2.25
2.00
1.75
1.50
1.25
1.00
0.75
0.50

NGTB35N60FL2WG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
IGBT Transistors 600V/35A FAST IGBT FSII T
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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