SI5403DC-T1-GE3

Vishay Siliconix
Si5403DC
New Product
Document Number: 68643
S-81443-Rev. A, 23-Jun-08
www.vishay.com
1
P-Channel 30-V (D-S) MOSFET
FEATURES
Halogen-free
TrenchFET
®
Power MOSFET
100 % R
g
Tested
APPLICATIONS
DC/DC Converter
- Load Switch
- Adaptor Switch
PRODUCT SUMMARY
V
DS
(V) R
DS(on)
(Ω)I
D
(A) Q
g
(Typ.)
- 30
0.030 at V
GS
= - 10 V
6
a
2 nC
0.044 at V
GS
= - 4.5 V
6
a
Ordering Information: Si5403DC-T1-GE3 (Lead (Pb)-free and Halogen-free)
Marking Code
XXX
Lot Traceability
and Date Code
Part #
Code
BQ
1206-8 ChipFET
®
Bottom View
D
D
D
G
D
D
D
S
1
S
G
D
P-Channel MOSFET
Notes:
a. Package limited.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See Solder Profile (
http://www.vishay.com/ppg?73257). The ChipFET is a leadless package. The end of the lead terminal is exposed copper (not
plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required
to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under Steady State conditions is 95 °C/W.
ABSOLUTE MAXIMUM RATINGS T
A
= 25 °C, unless otherwise noted
Parameter Symbol Limit Unit
Drain-Source Voltage
V
DS
- 30
V
Gate-Source Voltage
V
GS
± 20
Continuous Drain Current (T
J
= 150 °C)
T
C
= 25 °C
I
D
- 6
a
A
T
C
= 85 °C
- 5.8
T
A
= 25 °C
- 6
a, b, c
T
A
= 85 °C
- 5.2
b, c
Pulsed Drain Current
I
DM
- 20
Continuous Source-Drain Diode Current
T
C
= 25 °C
I
S
- 5.3
T
A
= 25 °C
- 2.1
b, c
Maximum Power Dissipation
T
C
= 25 °C
P
D
6.3
W
T
C
= 85 °C
3.3
T
A
= 25 °C
2.5
b, c
T
A
= 85 °C
1.3
b, c
Operating Junction and Storage Temperature Range
T
J
, T
stg
- 55 to 150
°C
Soldering Recommendations (Peak Temperature)
d, e
260
THERMAL RESISTANCE RATINGS
Parameter Symbol Typical Maximum Unit
Maximum Junction-to-Ambient
b, f
t 5 s
R
thJA
40 50
°C/W
Maximum Junction-to-Foot (Drain) Steady State R
thJF
15 20
RoHS
COMPLIANT
www.vishay.com
2
Document Number: 68643
S-81443-Rev. A, 23-Jun-08
Vishay Siliconix
Si5403DC
New Product
Notes:
a. Pulse test; pulse width 300 µs, duty cycle 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
SPECIFICATIONS T
J
= 25 °C, unless otherwise noted
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Static
Drain-Source Breakdown Voltage
V
DS
V
GS
= 0 V, I
D
= - 250 µA
- 30 V
V
DS
Temperature Coefficient ΔV
DS
/T
J
I
D
= - 250 µA
- 30
mV/°C
V
GS(th)
Temperature Coefficient ΔV
GS(th)
/T
J
5
Gate-Source Threshold Voltage
V
GS(th)
V
DS
= V
GS
, I
D
= - 250 µA
- 1 - 3 V
Gate-Source Leakage
I
GSS
V
DS
= 0 V, V
GS
= ± 20 V
± 100 nA
Zero Gate Voltage Drain Current
I
DSS
V
DS
= - 30 V, V
GS
= 0 V
- 1
µA
V
DS
= - 30 V, V
GS
= 0 V, T
J
= 85 °C
- 5
On-State Drain Current
a
I
D(on)
V
DS
- 5 V, V
GS
= - 10 V
- 20 A
Drain-Source On-State Resistance
a
R
DS(on)
V
GS
= - 10 V, I
D
= - 7.2 A
0.025 0.030
Ω
V
GS
= - 4.5 V, I
D
= - 6.0 A
0.036 0.044
Forward Transconductance
a
g
fs
V
DS
= - 15 V, I
D
= - 7.2 A
18 S
Dynamic
b
Input Capacitance
C
iss
V
DS
= - 15 V, V
GS
= 0 V, f = 1 MHz
1340
pFOutput Capacitance
C
oss
215
Reverse Transfer Capacitance
C
rss
185
Total Gate Charge
Q
g
V
DS
= - 15 V, V
GS
= - 10 V, I
D
= - 7.2 A
28 42
nC
V
DS
= - 15 V, V
GS
= - 4.5 V, I
D
= - 7.2 A
15 23
Gate-Source Charge
Q
gs
4.5
Gate-Drain Charge
Q
gd
7.2
Gate Resistance
R
g
f = 1 MHz 1.2 6 12 Ω
Tur n - O n D e l ay Time
t
d(on)
V
DD
= - 15 V, R
L
= 2.6 Ω
I
D
- 5.8 A, V
GEN
= - 4.5 V, R
g
= 1 Ω
50 75
ns
Rise Time
t
r
140 210
Turn-Off Delay Time
t
d(off)
30 45
Fall Time
t
f
18 27
Tur n - O n D e l ay Time
t
d(on)
V
DD
= - 15 V, R
L
= 2.6 Ω
I
D
- 5.8 A, V
GEN
= - 10 V, R
g
= 1 Ω
11 17
Rise Time
t
r
11 17
Turn-Off Delay Time
t
d(off)
37 56
Fall Time
t
f
12 18
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
I
S
T
C
= 25 °C
- 5.3
A
Pulse Diode Forward Current
I
SM
- 20
Body Diode Voltage
V
SD
I
S
= - 5.8 A, V
GS
= 0 V
- 0.8 - 1.2 V
Body Diode Reverse Recovery Time
t
rr
I
F
= - 5.8 A, dI/dt = - 100 A/µs, T
J
= 25 °C
22 33 ns
Body Diode Reverse Recovery Charge
Q
rr
15 25 nC
Reverse Recovery Fall Time
t
a
13
ns
Reverse Recovery Rise Time
t
b
9
Document Number: 68643
S-81443-Rev. A, 23-Jun-08
www.vishay.com
3
Vishay Siliconix
Si5403DC
New Product
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
Output Characteristics
On Resistance vs. Drain Current
Gate Charge
0
4
8
12
16
20
012345
V
DS
- Drain-to-Source Voltage (V)
- Drain Current (A)I
D
V
GS
=10thru 4 V
V
GS
=3V
0.00
0.01
0.02
0.03
0.04
0.05
048 12 16 20
- On-Resistance (Ω)R
DS(on)
I
D
- Drain Current (A)
V
GS
=10V
V
GS
=4.5V
0
2
4
6
8
10
0 6 12 18 24 30
- Gate-to-Source Voltage (V)
Q
g
- Total Gate Charge (nC)
V
GS
V
DS
=24V
V
DS
=15V
I
D
=7.2A
Transfer Characteristics
Capacitance
On-Resistance vs. Junction Temperature
0
1
2
3
4
5
0.0 0.7 1.4 2.1 2.8 3.5
V
GS
- Gate-to-Source Voltage (V)
- Drain Current (A)I
D
T
C
= 25 °C
T
C
= 125 °C
T
C
= - 55 °C
0
600
1200
1
800
2400
0 6 12 18 24 30
C
iss
V
DS
- Drain-to-Source Voltage (V)
C - Capacitance (pF)
C
oss
C
rss
0.6
0.8
1.0
1.2
1.4
1.6
- 50 - 25 0 25 50 75 100 125 150
T
J
-Junction Temperature (°C)
(Normalized)
- On-Resistance
R
DS(on)
V
GS
=10V,I
D
=6.0A
V
GS
=4.5V,I
D
=7.2A

SI5403DC-T1-GE3

Mfr. #:
Manufacturer:
Vishay / Siliconix
Description:
MOSFET -30V Vds 20V Vgs 1206-8 ChipFET
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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