Data Sheet ADG1206/ADG1207
Rev. C | Page 19 of 20
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-153-AE
28
15
141
8°
0
°
SEATING
PLANE
COPLANARITY
0.10
1.20 MAX
6.40 BSC
0.65
BSC
PIN 1
0.30
0.19
0.20
0.09
4.50
4.40
4.30
0.75
0.60
0.45
9.80
9.70
9.60
0.15
0.05
Figure 39. 28-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-28)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MO-220-WHHD.
112408-A
1
0.50
BSC
BOTTOM VIEWTOP VIEW
PIN 1
INDICATOR
32
9
16
17
24
25
8
EXPOSED
PAD
PIN 1
INDICATOR
3.25
3.10 SQ
2.95
SEATING
PLANE
0.05 MAX
0.02 NOM
0.20 REF
COPLANARITY
0.08
0.30
0.25
0.18
5.10
5.00 SQ
4.90
0.80
0.75
0.70
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.50
0.40
0.30
0.25 MIN
Figure 40. 32-Lead Lead Frame Chip Scale Package [LFCSP]
5 mm × 5 mm Body and 0.75 mm Package Height
(CP-32-7)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Description Package Option
ADG1206YRUZ −40°C to +125°C 28-Lead Thin Shrink Small Outline Package [TSSOP] RU-28
ADG1206YRUZ-REEL7 −40°C to +125°C 28-Lead Thin Shrink Small Outline Package [TSSOP] RU-28
ADG1206YCPZ-REEL7 −40°C to +125°C 32-Lead Lead Frame Chip Scale Package [LFCSP] CP-32-7
ADG1207YRUZ −40°C to +125°C 28-Lead Thin Shrink Small Outline Package [TSSOP] RU-28
ADG1207YRUZ-REEL7 −40°C to +125°C 28-Lead Thin Shrink Small Outline Package [TSSOP] RU-28
ADG1207YCPZ-REEL7 −40°C to +125°C 32-Lead Lead Frame Chip Scale Package [LFCSP] CP-32-7
1
Z = RoHS Compliant Part.
