22
FN6775.0
December 8, 2008
The compensation network consists of the max system
voltage error amplifier gm2 and the compensation network
R
1
, C
1
, R
2
and C
2
. Equations 15 through 20 relate to the
compensation network’s poles, zeros and gain to the
components in Figure 21. Figure 22 shows an asymptotic
bode plot of the DC/DC converter’s gain vs frequency. It is
strongly recommended that F
Z1
is approximately 1/4*F
DP
and F
Z2
is approximately 1/2*F
DP
.
Compensation Break Frequency Equations
Charge Current Control Loop
When the battery voltage is less than the programmed max
system voltage, the max system voltage error amplifier goes
to it’s maximum output (limited to 0.3V above ICOMP) and
the ICOMP voltage controls the loop through the minimum
voltage buffer. Figure 23 shows the charge current control
loop.
The compensation capacitor (C
ICOMP
) gives the error
amplifier (gm1) a pole at a very low frequency (<<1Hz) and a
a zero at F
Z1
. F
Z1
is created by the 0.25*CA2 output added
to ICOMP. The loop response has another zero due to the
output capacitor’s ESR.
A filter should be added between R
S2
and CSOP and CSON
to reduce switching noise. The filter roll off frequency should
be between the crossover frequency and the switching
frequency (~100kHz). R
F2
should be small (<2Ω) to
minimize offsets due to leakage current into CSOP.
-40
-30
-20
-10
0
10
20
30
40
50
60
0.01 0.1 1 10 100 1k
FREQUENCY (Hz)
GAIN (dB)
LOOP
MODULATOR
COMPENSATOR
F
DP
F
P1
F
ZESR
F
Z1
F
Z2
FIGURE 22. ASYMPTOTIC BODE PLOT OF THE MAX SYSTEM
VOLTAGE CONTROL LOOP GAIN
F
Z1
1
2π C
1
R
1
R
3
+()⋅⋅()
------------------------------------------------------
=
(EQ. 15)
F
Z2
1
2π C
2
R
2
1
gm2
------------
⎩⎭
⎨⎬
⎧⎫
⋅⋅
⎝⎠
⎜⎟
⎛⎞
--------------------------------------------------------------
=
(EQ. 16)
1
gm2
------------
4000Ω=
(EQ. 17)
F
DP
1
2π LC
o
()
-------------------------------
=
(EQ. 18)
F
P1
1
2π R
1
C
1
⋅⋅()
-----------------------------------
=
(EQ. 19)
F
ESR
1
2π C
o
R
ESR
⋅⋅()
--------------------------------------------
=
(EQ. 20)
FIGURE 23. CHARGE CURRENT LIMIT LOOP
R
S2
R
BAT
ICOMP
CSON
PHASE
R
ESR
C
O
11
+
-
CA2
20
CSOP
S
+
-
0.25
+
-
gm1
L
C
F2
R
F2
C
ICOMP
CCDAC
Σ
F
DP
1
2π LC
o
()
-------------------------------
=
(EQ. 21)
F
ZESR
1
2π C
o
R
ESR
⋅⋅()
--------------------------------------------
=
(EQ. 22)
F
Z1
4gm1
2π C
ICOMP
()
---------------------------------------
=
(EQ. 23)
gm1 50μAV=
(EQ. 24)
F
FILTER
1
2π C
F2
R
F2
⋅⋅()
-------------------------------------------
=
(EQ. 25)
ISL9518, ISL9518A
23
FN6775.0
December 8, 2008
C
ICOMP
should be chosen using Equation 26 to set
F
Z1
=F
DP
/10. The crossover frequency will be
approximately 2.5*F
DP
. The phase margin will be between
+10° and +40° depending on F
ZESR
.
Adapter Current Limit Control Loop
If the combined battery charge current and system load
current results in adapter current that equals the
programmed adapter current limit, ISL9518 will reduce the
current to the battery and/or reduce the output voltage to
hold the adapter current at the limit. Above the adapter
current limit, the minimum current buffer equals the output of
gm3 and ICOMP controls the charger output.
A filter should be added between R
S1
and CSIP and CSIN to
reduce switching noise. The filter roll off frequency should be
between the cross over frequency and the switching
frequency (~100kHz).
The loop response equations, bode plots and the selection
of C
ICOMP
are the same as the charge current control loop
with loop gain reduced by the duty cycle. In other words, if
the duty cycle D = 50%, the loop gain will be 6dB lower than
the loop gain in Figure 24. This gives lower crossover
frequency and higher phase margin in this mode.
The current control loops can have the same gain if the Input
current sense resistor is larger than the charge current
sense resistor by the same ratio that input voltage is larger
than output voltage.
Min System Voltage Control Loop
The min system voltage control loop is only active when a
battery is connected that is discharged to a voltage below
the voltage in the MinSystemVoltage register. When it is
active, the ISL9518 reduces the charge current to 256mA
and controls the BGATE FET in the linear range to hold the
min system voltage on the system output. The reduced
charge current and active BGATE control are referred to in
this document as “Trickle Charge Mode”.
When the battery voltage is higher than min system voltage,
BGATE goes approximately 7V below the system voltage (at
CSON) to fully enhance the BGATE FET.
When the battery voltage is less than the min system voltage,
the min system voltage loop controls the voltage on BGATE to
hold the system voltage at the programmed min system
voltage. The difference between the min system voltage and
the battery voltage drops across the BGATE FET.
Component Placement
The power MOSFET should be close to the IC so that the
gate drive signal, the LGATE, UGATE, PHASE, and BOOT,
traces can be short.
Place the components in such a way that the area under the
IC has less noise traces with high dV/dt and di/dt, such as
gate signals and phase node signals.
Signal Ground and Power Ground Connection
At minimum, a reasonably large area of copper, which will
shield other noise couplings through the IC, should be used
as signal ground beneath the IC. The best tie-point between
the signal ground and the power ground is at the negative
side of the output capacitor on each side, where there is little
noise; a noisy trace beneath the IC is not recommended.
AGND and VDD Pins
At least one high quality ceramic decoupling capacitor
should be used to cross these two pins. The decoupling
capacitor can be put close to the IC.
LGATE Pin
This is the gate drive signal for the bottom MOSFET of the
buck converter. The signal going through this trace has both
high dv/dt and high di/dt, and the peak charging and
discharging current is very high. These two traces should be
-60
-40
-20
0
20
40
60
0.01 0.1 1 10 100 1k
FREQUENCY (kHz)
GAIN (dB)
LOOP
MODULATOR
COMPENSATOR
F
DP
F
ZESR
F
Z1
F
FILTER
FIGURE 24. CHARGE CURRENT LOOP BODE PLOTS
C
ICOMP
4gm1
2π F
DP
10
---------------------------------
=
(EQ. 26)
FIGURE 25. ADAPTER CURRENT LIMIT LOOP
L
C
ICOMP
R
BAT
ICOMP
PHASE
R
ESR
C
O
11
S
+
-
0.25
+
-
gm3
DCIN
CSIN
+
-
20
CSIP
C
F1
R
F1
R
S2
CSON
+
-
20
CSOP
C
F2
R
F2
ACDAC
Σ
ISL9518, ISL9518A
24
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FN6775.0
December 8, 2008
short, wide, and away from other traces. There should be no
other traces in parallel with these traces on any layer.
PGND Pin
PGND pin should be laid out to the source of the lower
NMOS.The negative side of the output capacitor must be
close to the source node of the bottom MOSFET. This trace
is the return path of LGATE.
PHASE Pin
This trace should be short, and positioned away from other
weak signal traces. This node has a very high dv/dt with a
voltage swing from the input voltage to ground. No trace
should be in parallel with it. This trace is also the return path
for UGATE. Connect this pin to the high-side MOSFET
source.
UGATE Pin
This pin has a square shape waveform with high dV/dt. It
provides the gate drive current to charge and discharge the
top MOSFET with high di/dt. This trace should be wide,
short, and away from other traces, similar to the LGATE.
BOOT Pin
This pin’s di/dt is as high as the UGATE; therefore, this trace
should be as short as possible.
CSOP, CSON, CSIP and CSIN Pins
Accurate charge current and adapter current sensing is
critical for good performance. The current sense resistor
connects to the CSON and the CSOP pins through a low
pass filter with the filter capacitor very near the IC (see
Figure 2). Traces from the sense resistor should start at the
pads of the sense resistor and should be routed close
together through the low pass filter and to the CSOP and
CSON pins (see Figure 26). The CSON pin is also used as
the system voltage feedback. The traces should be routed
away from the high dV/dt and di/dt pins like PHASE, BOOT
pins. In general, the current sense resistor should be close
to the IC. These guidelines should also be followed for the
adapter current sense resistor and CSIP and CSIN. Other
layout arrangements should be adjusted accordingly.
DCIN Pin
This pin connects to AC adapter output voltage, and should
be less noise sensitive.
Copper Size for the Phase Node
The capacitance of PHASE should be kept very low to
minimize ringing. It would be best to limit the size of the
PHASE node copper in strict accordance with the current
and thermal management of the application.
Identify the Power and Signal Ground
The input and output capacitors of the converters (the
source terminal of the bottom switching MOSFET PGND)
should connect to the power ground. The other components
should connect to signal ground. Signal and power ground
are tied together at one point.
Clamping Capacitor for Switching MOSFET
It is recommended that ceramic capacitors be used closely
connected to the drain of the high-side MOSFET, and the
source of the low-side MOSFET. This capacitor reduces the
noise and the power loss of the MOSFET.
FIGURE 26. CURRENT SENSE RESISTOR LAYOUT
HIGH
CURRENT
TRACE
HIGH
CURRENT
TRACE
KELVIN CONNECTION TRACES
TO THE LOW PASS FILTER
AND
CSOP AND CSON
SENSE
RESISTOR
ISL9518, ISL9518A

ISL9518AHRTZ

Mfr. #:
Manufacturer:
Renesas / Intersil
Description:
Battery Management TQFN ISL9518A NOTEBOOK BATRY CHRGR
Lifecycle:
New from this manufacturer.
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