NCP3902
www.onsemi.com
3
Table 2. MAXIMUM RATINGS
Rating Symbol Value Unit
USBIN (Note 1)
USBIN
−0.3 to 28 V
USBIN (Note 2) 100 V
USB_SNS (Note 1) USB_SNS −0.3 to 20 V
OUT (Note 1) V
OUT
−0.3 to 20 V
VP,EN_N,RX_N,FLAG_N (Note 1) V
CTRL
−0.3 to 6 V
Storage Temperature Range T
STG
−65 to 150 °C
Maximum Junction Temperature (Note 3) T
J
−40 to TSD °C
Moisture Sensitivity (Note 4) MSL Level 1
Human Body Model (HBM) ESD Rating (JEDEC standard: JESD22−A114) ESD HBM 2500 V
Charged Device Model (CDM) ESD Rating (JEDEC standard: JESD22−A114) ESD CDM 1000 V
Latch up Current @ 25°C
(JEDEC standard: JESD78 class II):
ILU
120 mA
Latch up Current @ 85°C
(JEDEC standard: JESD78 class II):
100 mA
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. With Respect to GND. According to JEDEC standard JESD22−A108
2. With Respect to GND. According to standard IEC61000−4−5 1.2/50 ms
3. A thermal shutdown protection avoids irreversible damage on the device due to power dissipation
4. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020
Table 3. OPERATING CONDITION
Symbol Parameter Condition Min Typ Max Unit
USBIN Operational Power Supply on USBIN 0 28 V
VP, EN_N, RX_N, FLAG_N Operational Supply 0 5.5 V
I
OUT
Operational Output Current 0 3 A
V
OUT
Operational Supply on OUT OTG mode, USBIN = 0 V 0 5.5 V
C
IN
1
mF
C
INSNS
1
mF
C
OUT
0.1
mF
R
q
JA
(Notes 3 and 5) 45 °C/W
T
J
−40 25 +125 °C
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
5. The R
q
JA
is dependent on the PCB heat dissipation. Board used to drive this data was a 2s2p JEDEC PCB standard.
