IEC 1000-4-2
The IEC 1000-4-2 standard covers ESD testing and per-
formance of finished equipment; it does not specifically
refer to integrated circuits. The MAX3344E/MAX3345E
help the user design equipment that meets level 4 of IEC
1000-4-2, without the need for additional ESD-protection
components.
The major difference between tests done using the
Human Body Model and IEC 1000-4-2 is a higher peak
current in IEC 1000-4-2, because series resistance is
lower in the IEC 1000-4-2 model. Hence, the ESD with-
stand voltage measured to IEC 1000-4-2 is generally
lower than that measured using the Human Body Model.
Figure 1c shows the IEC 1000-4-2 model.
The Air-Gap Discharge Method involves approaching
the device with a charged probe. The Contact
Discharge Method connects the probe to the device
before the probe is energized.
Machine Model
The Machine Model for ESD tests all pins using a 200pF
storage capacitor and zero discharge resistance. Its
objective is to emulate the stress caused by contact that
occurs with handling and assembly during manufactur-
ing. All pins require this protection during manufactur-
ing. Therefore, after PC board assembly, the Machine
Model is less relevant to I/O ports.
Applications Information
External Components
External Resistors
Two external 23.7Ω ±1% to 27.4Ω ±1%, 1/2W resistors
are required for USB connection. Place the resistors
in between the MAX3344E/MAX3345E and the USB
connector on the D+ and D- lines (see the Typical
Operating Circuit).
External Capacitors
Use three external capacitors for proper operation. Use
a 0.1µF ceramic for decoupling V
L
, a 1µF ceramic for
decoupling V
CC
, and a 1.0µF (min) ceramic or plastic
filter capacitor on VTRM. Return all capacitors to GND.
UCSP Applications Information
For the latest application details on UCSP construction,
dimensions, tape carrier information, printed circuit board
techniques, bump-pad layout, and recommended reflow
temperature profile, as well as the latest information on
reliability testing results, refer to the Application Note
UCSP—A Wafer-Level Chip-Scale Package available on
Maxim’s website at www.maxim-ic.com/ucsp.
MAX3344E/MAX3345E
±15kV ESD-Protected USB Transceivers
in UCSP with USB Detect
______________________________________________________________________________________ 11
Chip Information
TRANSISTOR COUNT: 2162
PROCESS: BiCMOS
