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ESDAVLC12-1BV2

P1-P3P4-P6P7-P9
Package information
ESDAVLC12-1BV2
4/9
DocID027160 Rev 2
2 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
is an ST trademark.
Epoxy meets UL 94,V0
Lead-free package
2.1 ST01005 package information
Figure 9: ST01005 package outline
ESDAVLC12-1BV2
Package information
DocID027160 Rev 2
5/9
Bar indicates Pin1
Use r direction of un ree ling
All dimensions are in mm
4.0 ± 0.1
4.0 ± 0.1
2.0 ± 0.05
8.0 + 0.3 / - 0.1
1.75 ± 0.1
3.5 ± 0.05
Ø 1.50 ± 0.1
0.20 ± 0.03
0.23 ± 0.03
0.20 ± 0.2
0.46 ±0.03
V
V
V
V
V
V
Table 3: ST01005 package mechanical data
Ref.
Dimensions
Millimeters
Inches
Min.
Typ.
Max.
Min.
Typ.
Max.
A
0.16
0.18
0.20
0.0063
0.0071
0.0079
b
0.094
0.104
0.114
0.0037
0.0041
0.0045
E
0.17
0.2
0.23
0.0067
0.0078
0.0091
E1
0.154
0.164
0.174
0.0061
0.0065
0.0069
D
0.37
0.40
0.43
0.0146
0.0157
0.0169
D1
0.26
0.6
0.0102
0.0236
fE
0.010
0.018
0.026
0.0004
0.0007
0.0010
fD
0.11
0.125
0.13
0.0043
0.0049
0.0051
Figure 10: Footprint recommendations,
dimensions in mm (inches)
Figure 11: Marking layout
Product marking may be rotated by multiples of 90° for assembly plant
differentiation. In no case should this product marking be used to orient the
component for its placement on a PCB. Only pin 1 mark is to be used for this
purpose.
Figure 12: Tape and reel specifications
170 µm
120 µm
460 µm
170 µm
75 µm
Top side soldermask
Pads
PIN 1
PIN 2
Recommendation on PCB assembly
ESDAVLC12-1BV2
6/9
DocID027160 Rev 2
L
T
W
100 µm
150 µm
200 µm
Stencil opening
Stencil thickness: 75 µm (3 mils)
Use of solder paste type 4 mandatory
3 Recommendation on PCB assembly
3.1 Stencil opening design
1. Reference design
a. Stencil opening thickness: 75 μm
Figure 13: Stencil opening dimensions
Figure 14: Recommended stencil window position in mm (inches)
3.2 Solder paste
1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
2. “No clean” solder paste is recommended.
3. Offers a high tack force to resist component movement during high speed.
4. Solder paste with fine particles: powder particle size is 20-38 μm.
P1-P3P4-P6P7-P9

ESDAVLC12-1BV2

Mfr. #:
Buy ESDAVLC12-1BV2
Manufacturer:
STMicroelectronics
Description:
TVS Diodes / ESD Suppressors DFD PROTECTION
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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