2004 - 2016 Microchip Technology Inc. DS00002119A-page 23
USB2601/USB2602
7.0 PACKAGE INFORMATION
Note 1: Controlling Unit: millimeter.
2: Tolerance on the true position of the leads is ± 0.035 mm maximum.
Package body dimensions D1 and E1 do not include the mold protrusion.
3: Maximum mold protrusion is 0.25 mm.
4: Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5: Details of pin 1 identifier are optional but must be located within the zone indicated.
Note: For the most current package drawings, see the Microchip Packaging Specification at: http://www.microchip.com/packaging
.
FIGURE 7-1: USB2601/USB2602 128-Pin TQFP Package, 1.0mm Height, 14mm x 14mm Footprint
TABLE 7-1: USB2601/USB2602 128-PIN TQFP PACKAGE PARAMETERS
MIN Nominal MAX Remarks
A ~ ~ 1.20 Overall Package Height
A1 0.05 ~ 0.15 Standoff
A2 0.95 ~ 1.05 Body Thickness
D 15.80 ~ 16.20 X Span
D1 13.80 ~ 14.20 X body Size
E 15.80 ~ 16.20 Y Span
E1 13.80 ~ 14.20 Y body Size
H 0.09 ~ 0.20 Lead Frame Thickness
L 0.45 0.60 0.75 Lead Foot Length
L1 ~ 1.00 ~ Lead Length
e 0.40 Basic Lead Pitch
q0
o
~7
o
Lead Foot Angle
W 0.13 0.18 0.23 Lead Width
R1 0.08 ~ ~ Lead Shoulder Radius
R2 0.08 ~ 0.20 Lead Foot Radius
ccc ~ ~ 0.08 Coplanarity
