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YC248-JR-0722RL

P1-P3P4-P6P7-P8
SERIES
YC
248 (RoHS Compliant)
Chip Resistor Surface Mount
w
ww.yageo.com
Oct 31, 2008 V.2
Product specification
4
8
MARKING
YC248
1-Digit marking
E-24 series: 3 digits
First two digits for significant figure and 3rd digit for number of zeros
For further marking information, please see special data sheet “Chip resistors marking”
Fig. 1 Jumper = 0 Ω
YNSC014
0
Fig. 2 Value = 240 KΩ
YNSC035
2
DIMENSIONS
TYPE YC248
B (mm)
0.30 ±0.15
H (mm)
0.45 ±0.05
P (mm)
0.50 ±0.05
L (mm)
4.00 ±0.20
T (mm)
0.45 ±0.10
W
1
(mm)
0.40 ±0.15
W
2
(mm)
1.60 ±0.15
Table 1
SCHEMATIC
handbook, 2 columns
CCB258_
b
16 15 14 13 12
1234 8
9
5
11
6
10
7
R1 R2 R3 R4 R5 R6 R7 R8
Fig. 5 Equivalent circuit diagram
For dimension see Fig. 4 and Table 1
R1=R2=R3=R4=R5=R6=R7=R8
P
L
B
H
T
W1
W2
CCB261_b
Fig. 4
Y
C248
series chip resistors
dimension
For dimension see Table
1
O
O
U
U
T
T
L
L
I
I
N
N
E
E
S
S
overcoat
resistive layer
inner electrode
termination
ceramic substrate
YNSC069
Fig. 3
Chip resistor outlines
CONSTRUCTION
The resistor is constructed on top
of a high-grade ceramic body.
Internal metal electrodes are added
on each end to make the contacts to
the thick film resistive element. The
composition of the resistive element
is a noble metal imbedded into a
glass and covered by a second glass
to prevent environment influences.
The resistor is laser trimmed to the
rated resistance value. The resistor
is covered with a protective epoxy
coat, finally the two external terminations (matte tin on Ni-barrier) are added. See fig.3
SERIES
YC
248 (RoHS Compliant)
Chip Resistor Surface Mount
w
ww.yageo.com
Oct 31, 2008 V.2
Product specification
5
8
FOOTPRINT AND SOLDERING
PROFILES
For recommended footprint and
soldering profiles, please see the
special data sheet “Chip resistors
mounting”.
FUNCTIONAL DESCRIPTION
POWER RATING
YC 248 rated power at 70 °C is 1/16 W
R
ATED VOLTAGE
The DC or AC (rms) continuous working voltage
corresponding to the rated power is determined by
the following formula:
V=√(P X R)
or max. working voltage whichever is less
Where
V=Continuous rated DC or
AC (rms) working voltage (V)
P=Rated power (W)
R=Resistance value (X)
MLB206_2
70
10055 50
T
amb
( C)
o
(%P )
rated
0
0
50
100
155
P
handbook, halfpage
Fig. 5
Maximum dissipation (P) in percentage of rated power as a
function of the operating ambient temperature (T
amb
)
PACKING STYLE AND P
A
CKAGING QUANTITY
PRODUCT TYPE PACKING STYLE REEL DIMENSION QUANTITY PER REEL
YC248
Paper Taping Reel (R) 7" (178 mm) 5,000 units
Embossed taping reel (K) 7" (178 mm) 4,000 units
NOTE
1. For Paper/Embossed tape and reel specification/dimensions, please see the special data sheet “Chip resistors packing”.
Table 3 Packing style and packaging quantity
ELECTRICAL CHARACTERISTICS
CHARACTERISTICS
YC248 1/16 W
Operating Temperature Range
–55 °C to +155 °C
Maximum Working Voltage
50 V
Maximum Overload Voltage
100 V
Dielectric Withstanding Voltage
100 V
Number of Resistors
8
5% (E24)
10 Ω to 1 MΩ
1% (E24/E96) 10 Ω to 1 MΩ
Resistance Range
Zero Ohm Jumpe
r
< 0.05 Ω
Temperature Coefficient
±200 ppm/°C
Jumper Criteria
Rated Current 2.0 A
Maximum Current 10 A
Table 2
SERIES
YC
248 (RoHS Compliant)
Chip Resistor Surface Mount
w
ww.yageo.com
Oct 31, 2008 V.2
Product specification
6
8
TESTS AND REQUIREMENTS
TEST TEST METHOD PROCEDURE REQUIREMENTS
Life/
Operational Life/
Endurance
MIL-STD-202G-method 108A
IEC 60115-1 4.25.1
JIS C 5202-7.10
1,000 hours at 70±5 °C applied RCWV
1.5 hours on, 0.5 hour off, still air required
±(2%+0.05 Ω)
High
Temperature
Exposure/
Endurance at
upper category
temperature
MIL-STD-202G-method 108A
IEC 60115-1 4.25.3
JIS C 5202-7.11
1,000 hours at maximum operating temperature
depending on specification, unpowered
No direct impingement of forced air to the parts
Tolerances: 155±3 °C
±(1%+0.05 Ω)
Moisture
Resistance
MIL-STD-202G-method 106F
IEC 60115-1 4.24.2
Each temperature / humidity cycle is defined at 8
hours (method 106F), 3 cycles / 24 hours for 10d
with 25 °C / 65 °C 95% R.H, without steps 7a &
7b, unpowered
Parts mounted on test-boards, without
condensation on parts
Measurement at 24±2 hours after
test conclusion
±(2%+0.05 Ω)
Thermal Shock
MIL-STD-202G-method 107G
-55/+155 °C
Note: Number of cycles required is 300. Devices
unmounted
Maximum transfer time is 20 seconds. Dwell time
is 15 minutes. Air – Air
±(0.5%+0.05 Ω) for 10 KΩ to
10 MΩ
±(1%+0.05 Ω) for others
Short time
overload
MIL-R-55342D-para 4.7.5
IEC60115-1 4.13
2.5 times RCWV or maximum overload voltage
whichever is less for 5 sec at room temperature
±(2%+0.05 Ω)
No visible damage
Board Flex/
Bending
IEC60115-1 4.33
Device mounted on PCB test board as described,
only 1 board bending required
3 mm bending
Bending time: 60±5 seconds
Ohmic value checked during bending
±(1%+0.05 Ω)
No visible damage
Table 4 Test condition, procedure and requirements
P1-P3P4-P6P7-P8

YC248-JR-0722RL

Mfr. #:
Buy YC248-JR-0722RL
Manufacturer:
Yageo
Description:
Res Thick Film Array 22 Ohm 5% ±200ppm/C ISOL Epoxy 16-Pin 1606(8 X 0602) Convex SMD T/R
Lifecycle:
New from this manufacturer.
Delivery:
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