SERIES
YC
248 (RoHS Compliant)
Chip Resistor Surface Mount
ww.yageo.com
Oct 31, 2008 V.2
Product specification
7
8
TEST TEST METHOD PROCEDURE REQUIREMENTS
Solderability
- Wetting
IPC/JEDECJ-STD-002B test B
IEC 60068-2-58
Electrical Test not required
Magnification 50X
SMD conditions:
1
st
step: method B, aging 4 hours at 155 °C
dry heat
2
nd
step: leadfree solder bath at 245±3 °C
Dipping time: 3±0.5 seconds
Well tinned (≥95% covered)
No visible damage
- Leaching
IPC/JEDECJ-STD-002B test D
IEC 60068-2-58
Leadfree solder, 260 °C, 30 seconds
immersion time
No visible damage
- Resistance to
Soldering Heat
MIL-STD-202G-method 210F
IEC 60068-2-58
Condition B, no pre-heat of samples
Leadfree solder, 270 °C, 10 seconds
immersion time
Procedure 2 for SMD: devices fluxed and
cleaned with isopropanol
±(1%+0.05 Ω)
No visible damage
