PIC18F2410-I/SO

© 2005 Microchip Technology Inc. DS80227B-page 1
PIC18F2X1X/4X1X
Clarifications/Corrections to the Data
Sheet:
In the Device Data Sheet (DS39636A), the following
clarifications and corrections should be noted. Any
silicon issues related to the PIC18F2X1X/4X1X
devices will be reported in a separate silicon errata.
Please check the Microchip web site for any existing
issues.
1. Module: I/O Ports
The TRIS setting for the TX pin on PORTC in
Table 9-5 of the Device Data Sheet was incorrectly
stated as 1’.
The correct TRIS setting for the TX pin on PORTC
is ‘0’.
2. Module: Resets
The PR2 initialization condition shown in Table 4-4
for MCLR
Resets, WDT Reset, RESET Instruction,
Stack Resets and Wake-up via WDT or Interrupt
should read “uuuu uuuu” as shown in the
following table (changes are shown in bold text):
TABLE 4-4: INITIALIZATION CONDITIONS FOR ALL REGISTERS
Register Applicable Devices
Power-on Reset,
Brown-out Reset
MCLR
Resets,
WDT Reset,
RESET Instruction,
Stack Resets
Wake-up via WDT
or Interrupt
PR2 2410 2510 2515 2610 4410 4510 4515 4610 1111 1111 uuuu uuuu uuuu uuuu
Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’, q = value depends on condition.
Shaded cells indicate conditions do not apply for the designated device.
PIC18F2X1X/4X1X Data Sheet Errata
PIC18F2X1X/4X1X
DS80227B-page 2 © 2005 Microchip Technology Inc.
3. Module: DC Characteristics
In Section 25.3 “DC Characteristics”
(page 326), the specifications for V
IL parameters
D033B and D034 have been clarified and now
read as follows:
4. Module: A/D Converter Characteristics
In Table 25-24: A/D Converter Characteristics
(page 349), specification A40 has been added:
TABLE 25-24: A/D CONVERTER CHARACTERISTICS: PIC18F2X1X/4X1X (INDUSTRIAL, EXTENDED)
PIC18LF2X1X/4X1X (INDUSTRIAL)
5. Module: Instruction Set
In Table 23-2: PIC18FXXXX Instruction Set
(page 261), the BTG instruction has been modified.
The changes are shown in bold text:
25.3 DC Characteristics: PIC18F2X1X/4X1X (Industrial, Extended)
PIC18LF2X1X/4X1X (Industrial)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +85°C for industrial
Param
No.
Symbol Characteristic Min Max Units Conditions
V
IL Input Low Voltage
D033B
D034
OSC1
T13CKI
V
SS
VSS
0.3
0.3
V
V
XT, LP modes
Param
No.
Symbol Characteristic Min Typ Max Units Conditions
A40 I
AD A/D Current from VDD PIC18FXXXX 180 μA Average current during
conversion
PIC18LFXXXX 90 μA
TABLE 23-2: PIC18FXXXX INSTRUCTION SET
Mnemonic,
Operands
Description Cycles
16-Bit Instruction Word
Status
Affected
Notes
MSb LSb
BIT-ORIENTED OPERATIONS
BTG f, b, a Bit Toggle f 1 0111 bbba ffff ffff None 1, 2
Note 1: When a Port register is modified as a function of itself (e.g., MOVF PORTB, 1, 0), the value used will be
that value present on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input
and is driven low by an external device, the data will be written back with a ‘0’.
2: If this instruction is executed on the TMR0 register (and where applicable, ‘d’ = 1), the prescaler will be
cleared if assigned.
© 2005 Microchip Technology Inc. DS80227B-page 3
PIC18F2X1X/4X1X
6. Module: Timing Diagrams and
Specifications
Table 25-6: External Clock Timing Requirements
(page 333), has been revised (changes and
additions are shown in bold text).
TABLE 25-6: EXTERNAL CLOCK TIMING REQUIREMENTS
7. Module: EUSART
The RX pin sampling information in Section 17.1.2
“Sampling has changed. This section now reads
as follows:
17.1.2 SAMPLING
The data on the RX pin is sampled three times by a
majority detect circuit to determine if a high or a low
level is present at the RX pin when SYNC is clear or
when BRG16 and BRGH are both not set.
The data on the RX pin is sampled once when SYNC is
set or when BRGH16 and BRGH are both set.
8. Module: MSSP
In Section 16.3.2 “Operation”, the following note
has been added:
9. Module: QFN
In the QFN pin diagrams on pages 3 and 4, and in
Table 1-3: PIC18F2410/2510/2515/2610 Pinout I/O
Descriptions, the following note has been added:
Note: It is recommended to connect the bottom
pad of QFN package parts to V
SS.
Param.
No.
Symbol Characteristic Min Max Units Conditions
1A F
OSC External CLKI Frequency
(1)
DC 1 MHz XT, RC Oscillator mode
DC 25 MHz HS Oscillator mode
DC 31.25 kHz LP Oscillator mode
DC 40 MHz EC Oscillator mode
Oscillator Frequency
(1)
DC 4 MHz RC Oscillator mode
0.1 4 MHz XT Oscillator mode
4 25 MHz HS Oscillator mode
4 10 MHz HS + PLL Oscillator mode
5 200 kHz LP Oscillator mode
1T
OSC External CLKI Period
(1)
1000 ns XT, RC Oscillator mode
40 ns HS Oscillator mode
32 μs LP Oscillator mode
25 ns EC Oscillator mode
Oscillator Period
(1)
250 ns RC Oscillator mode
250 1 μs XT Oscillator mode
40 250 ns HS Oscillator mode
100 250 ns HS + PLL Oscillator mode
5 200 μs LP Oscillator mode
Note 1: Instruction cycle period (T
CY) equals four times the input oscillator time base period for all configurations
except PLL. All specified values are based on characterization data for that particular oscillator type under
standard operating conditions with the device executing code. Exceeding these specified limits may result
in an unstable oscillator operation and/or higher than expected current consumption. All devices are tested
to operate at “min.” values with an external clock applied to the OSC1/CLKI pin. When an external clock
input is used, the “max.” cycle time limit is “DC” (no clock) for all devices.
Note: The SSPBUF register cannot be used with
read-modify-write instructions, such as
BCF, BTFSC, COMF, etc.

PIC18F2410-I/SO

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Manufacturer:
Microchip Technology
Description:
8-bit Microcontrollers - MCU 16KB 768 RAM 25I/O
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