Chip Resistor Surface Mount
ww.yageo.com
Nov 01, 2011 V.0
Product specification
8
10
SERIES
PR/PF/PH
0805/1206/2512/0815
TESTS AND REQUIREMENTS
TEST TEST METHOD PROCEDURE REQUIREMENTS
Life/
Operational Life/
Endurance
MIL-STD-202G-method 108A
IEC 60115-1 4.25.1
JIS C 5202-7.10
1,000 hours at 70±5 °C applied RCWV
1.5 hours on, 0.5 hour off, still air required
±(1%+0.0005 Ω)
High
Temperature
Exposure/
Endurance at
Upper Category
Temperature
MIL-STD-202G-method 108A
IEC 60115-1 4.25.3
JIS C 5202-7.11
1,000 hours at maximum operating temperature
depending on specification, unpowered
No direct impingement of forced air to the parts
Tolerances: 155±3 °C
±(1%+0.0005 Ω)
Moisture
Resistance
MIL-STD-202G-method 106F
IEC 60115-1 4.24.2
Each temperature / humidity cycle is defined at 8
hours (method 106F), 3 cycles / 24 hours for 10d
with 25 °C / 65 °C 95% R.H, without steps 7a &
7b, unpowered
Parts mounted on test-boards, without
condensation on parts
Measurement at 24±2 hours after
test conclusion
±(0.5%+0.0005 Ω)
Thermal Shock
MIL-STD-202G-method 107G
-55/+155 °C
Note: Number of cycles required is 300. Devices
unmounted
Maximum transfer time is 20 seconds. Dwell time
is 15 minutes. Air – Air
±(0.5%+0.0005 Ω)
Short Time
Overload
MIL-R-55342D-para 4.7.5
IEC60115-1 4.13
5 times of rated power for 5 seconds at room
temperature
±(0.5%+0.0005 Ω)
No visible damage
Board Flex/
Bending
IEC60115-1 4.33
Device mounted on PCB test board as described,
only 1 board bending required
Bending for 0805: 3 mm
1206/2512/other: 2 mm
Holding time: minimum 60 seconds
±(1%+0.05 Ω)
No visible damage
Ta b l e 4 Test condition, procedure and requirements
