TS33010
Final
Rev
June 2
,
2016
7of
Functional
Description
This voltage-mode Point of Load (POL) synchronous
step-down power supply product can be used in the
consumer, and industrial market segments. It includes
flexibility to be used for a wide range of output voltages
and is optimized for high efficiency power conversion
with low RDSON integrated synchronous switches. A
2.25MHz internal switching frequency facilitates low cost
LC filter combinations and improved transient response.
Additionally, the fixed output version, with integrated
Power on Reset and Fault circuitry enables a minimal
external component count to provide a complete power
supply solution for a variety of applications.
Detailed Pin
Description
Unregulated input, V
CC
This terminal is the unregulated input voltage source for the
IC. It is recommended that a 22
μF bypass capacitor be
placed close as possible to the VCC pins for best
performance. Since this is the main supply for the IC, good
layout practices need to be followed for this connection.
Feedback,
FB
This is the voltage feedback input terminal for the
adjustable version. For the fixed mode versions, this pin
should be left floating and not connected.
The connection on the PCB should be kept as short as
Switching output,
VSW
This is the switching node of the regulator. It should be
connected directly to the 1.5
μH inductor with a wide, short
trace. It is switching between VCC and PGND at the
switching frequency.
Ground,
GND
This ground is used for the majority of the device including
the analog reference, control loop, and other circuits.
Power Ground,
PGND
This is a separate ground connection used for the low side
synchronous FET to isolate switching noise from the rest of
the device.
Enable,
EN
This is an input terminal to activate the entire device. This
will enable the internal reference, oscillator, etc, and allow
the fault detection circuitry to work correctly. Notice that
the EN needs to be low for the part to exhibit less than
200nA quiescent current. The input threshold is
TTL/CMOS compatible.
Power Good Output,
PG
This is an open drain, active high output. The switched
mode output voltage is monitored and the PG line will
remain
possible from the feedback resistors, kept away from the
VSW
threshold,
connections or other switching/high
frequency nodes, and should not be shared with any other
connection. This should minimize stray coupling, reduce
noise injection, and minimize voltage shift cause by output
load.
To choose the resistors for the adjustable version,
use the following equation:
V
OUT
= 0.6 (1 + R
TOP
/R
BOT
)
For stability, R
TOP
should be 270K Ohms to 330K Ohms.
Output Voltage Sense,
V
OUT
S
ense
This is the input terminal for the voltage output feedback
and is needed for both adjustable and fixed voltage
versions. This should be connected to the main output
capacitor, and the same good layout practices should be
followed as for the FB connection. Keep this line as short
as possible, keep it away from the VSW and other
switching or high frequency traces, and do not share this
connection with any other connection
on the PCB.
low until the output voltage reaches the V
OUT-UV
approximately 85% of the final regulation output. Once the
internal comparator detects the output voltage is above the
desired threshold, an internal 14ms delay timer is activated
and the PG line is de-asserted to high when this delay timer
expires. In the event the output voltage decreases below
V
OUT- UV
the PG line will be asserted low immediately and
remain low until the output rises above V
OUT-UV
and the delay
timer times out again. If EN is pulled low and the VCC input
undervoltage trips, the PG pin will immediately be pulled
low.
nLow Power Mode
Output, nLP
This is an input to force the PWM mode when light
load is on the output. The PFM low power mode has
higher output voltage ripple, which is some
applications may be unacceptable. If low ripple is
needed on the output this pin can be tied to VCC
input, or switched above 1.5V during operation to
force the device into normal PWM mode.
TS33010
Final
Rev
June 2
,
2016
8of
Internal Protection
Details
Internal Current
Limit
Current limit is always active when the regulator is
enabled. High side current limit will shorten the high side
on time and tri-state the high side. Additionally, low side
current limit will protect the low side FET and turn off the
switch if current limit is sensed on the low side switch.
Since the output is fully synchronous, the current limit is
protected on the low side in both the positive and negative
direction.
Soft
S
tar
t
Soft start ensures current limit does not prevent regulator
startup and minimize overshoot at startup. The typical
startup time is 1.2ms. These values do not change with
output voltage, current limit settings, or adjustable/fixed
mode. The soft start is re-triggered with the any rising
edge that enables the regulator, including the EN input
pins, thermal shutdown, VCC Undervoltage, or a VCC
Power cycle.
Output
Overvoltage
If the output of the regulator exceeds 106% of the
regulation voltage, the VSW outputs will tri-state to protect
the device from damage. This check occurs at the start of
each switching cycle. If it occurs during the middle of a
cycle, the switching for that cycle will complete, and the
VSW outputs will tri-state at the beginning of the next
cycle.
VCC
Under-Voltage
L
o
ck
out
The device is held in the off state until VCC reaches 1.60V.
There is a 50mV hysteresis on this input, which requires
the input to fall below 1.55V before the device will disable.
TS33010
Final
Rev
June 2
,
2016
9of
External Component
S
elec
tion
The internal compensation is optimized for a 10μF output capacitor and a 1.5μH inductor. To keep the output ripple low, a
low ESR (less than 20mOhm) ceramic is recommended. For optimal over-current protection, the inductor should be able to
handle 1A without saturation.
Application Using A Multi-Layer
PCB
To maximize the efficiency of this package for application on a single layer or multi-layer PCB, certain guidelines must be
followed when laying out this part on the PCB.
The following are guidelines for mounting
the
exposed pad IC on
a
Multi-Layer
PCB
with
ground
aplane.
Solder Pad (Land Pattern)
Package Thermal Pad
Thermal Via's
Package Outline
Package and PCB Land Configuration
For a Multi-Layer PCB
JEDEC
standard
FR4 PCB
C
r
oss-sec
tion:
(square)
Package Solder Pad
Component Traces
4
Plane
2Plane
1.5748mm
Thermal Via
1.5038 - 1.5748 mm
Component Trace
(2oz Cu)
1.0142 - 1.0502 mm
Ground Plane (1oz
Cu)
Thermal Isolation
Power plane only
Package Solder Pad
(bottom trace)
0.5246 - 0.5606 mm
Power Plane (1oz
Cu)
0.0 - 0.071 mm Board Base
&BottomPad
Multi-Layer Board (Cross-sectional
Vie
w)
In a multi-layer board application, the thermal vias are the primary method of heat transfer from the package thermal pad to
the internal ground plane. The efficiency of this method depends on several factors, including die area, number of thermal
vias, thickness of copper, etc.

TS33010-M012QFNR

Mfr. #:
Manufacturer:
Semtech
Description:
Switching Voltage Regulators 2.25 MHZ DC/DC SYNC BUCK, 500 MA- FG
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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