LQM2HPN2R2MG0L

Spec No. JELF243B-0019K-01 P.7/9
MURATA MFG.CO., LTD
Reference
Only
11.3 Flow soldering / Reflow soldering conditions
Pre-heating should be in such a way that the temperature difference between solder and product
surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that
the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products
quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the
deterioration of product quality.
Soldering profile
(1) Flow soldering profile
Standard Profile Limit Profile
Pre-heating 150, 60s min.
Heating 250, 4s6s 265±3, 5s
Cycle of flow 2 times 2 times
(2) Reflow soldering profile
Standard Profile Limit Profile
Pre-heating 150°C180°C, 90s±30s
Heating above 220°C, 30s60s above 230°C, 60s max.
Peak temperature 245°C±3°C 260°C, 10s
Cycle of reflow 2 times 2 times
11.4 Reworking with soldering iron
The following conditions must be strictly followed when using a soldering iron.
Pre-heating 150°C,1 min
Tip temperature 350°C max.
Soldering iron output 80W max.
Tip diameter φ3mm max.
Soldering time 3(+1, -0)s
Time 2 times
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on
the products due to the thermal shock.
265℃±3℃
Heating Time
150
Limit Profile
Standard Profile
(s)Time.
Temp.
(℃)
60s min.
250℃
Limit Profile
Standard Profile
90s±30s
230
260℃
245℃±3℃
220
30s~60s
60s max.
180
150
Temp.
(s)
(℃)
Time.
Spec No. JELF243B-0019K-01 P.8/9
MURATA MFG.CO., LTD
Reference
Only
11.5 Solder Volume
Solder shall be used not to be exceeded the upper limits as shown below.
Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
1/3TtT
T thickness of electrode
11.6 Product’s location
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
Products direction
Products shall be located in the sideways
direction (Length: a‹b) to the mechanical
stress.
(2) Products location on P.C.B. separation
Products (A, B, C, D) shall be located carefully so
that products are not subject to the mechanical
stress due to warping the board.
Because they may be subjected the mechanical
stress in order of ACBD.
11.7 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance
phenomenon at the mounted products and P.C.B.
Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 min max.
(3) Cleaner
1. Alcohol type cleaner
Isopropyl alcohol (IPA)
2. Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent,
products shall be dried completely after rinse with de-ionized water in order to remove the cleaner.
(5) Other cleaning Please contact us.
11.8 Resin coating
The inductance value may change and/or it may affect on the product's performance due to high
cure-stress of resin to be used for coating/molding products. So please pay your careful attention when you
select resin.
In prior to use, please make the reliability evaluation with the product mounted in your application set.
11.9 Caution for use
There is possibility that the inductance value change due to magnetism. Don‘t use a magnet or a pair of
tweezers with magnetism when chip coil are handled. (The tip of the tweezers should be molded with resin or
pottery.)
11.10 Magnetic Saturation
When the excessive current over rated current is applied, the inductance value may change due to
magnetism.
Seam
Slit
A
D
B
C
b
a
Length:ab
Poor example
Good example
b
a
Upper Limit
Recommendable
t
Spec No. JELF243B-0019K-01 P.9/9
MURATA MFG.CO., LTD
Reference
Only
11.11 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or
twisting to the substrate when cropping the substrate, inserting and removing a connector from the
substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
11.12 Storage and Handing Requirements
(1) Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
Products should be stored in the warehouse on the following conditions.
Temperature -10°C to 40°C
Humidity
15% to 85% relative humidity No rapid change on temperature and humidity
Don't keep products in corrosive gases such as sulfur,chlorine gas or acid, or it may cause oxidization of
electrode, resulting in poor solderability.
Products should be stored on the palette for the prevention of the influence from humidity, dust and so
on.
Products should be s stored in the warehouse without heat shock, vibration, direct sunlight and so on.
Products should be stored under the airtight packaged condition.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical
shock.
12! Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications
before ordering.

LQM2HPN2R2MG0L

Mfr. #:
Manufacturer:
Description:
Fixed Inductors 1008 2.2uH 20%
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union