Page 13Page 12
TYPICAL APPLICATIONS
The figure below shows a typical RS-232 circuit using the HP3 Series receiver
and a Maxim MAX232. The receiver outputs a serial data stream and the
MAX232 converts that to RS-232 compliant signals. The MODE line is grounded
so the channels are selected by the DIP switches.
The figure below shows a circuit using the QS Series USB module. The QS
converts the data from the receiver into USB compliant signals to be sent to a
PC. The MODE line is high, so the module is in Serial Channel Select mode. The
RTS and DTR lines are used to load the channels. Application Note AN-00155
shows sample source code that can be adapted to use on a PC. The QS Series
Data Guide and Application Note AN-00200 discuss the hardware and software
set-up required for QS Series modules.
The receiver can also be connected to a microcontroller, which will interpret the
data and take specific actions. A UART may be employed or an I / O line may be
used to continuously monitor the DATA line for a valid packet. The receiver may
be connected directly to the microcontroller without the need for buffering or
amplification.
Figure 14: HP3 Receiver and MAX232 IC
C3
C5
C1
C2
4.7
uF
4.7
uF
4.7
uF
MAX2
32
4.7
uF
DB-
9
4.7
uF
C
1
+
V+
C
1
-
C
2
+
C
2
-
V-
T2
O
U
T
R2IN
R2
OUT
T2IN
T1IN
R1
OUT
R1IN
T1
OUT
G
N
D
V
CC
V
CC
G
N
D
G
N
D
V
CC
G
N
D
G
N
D
1
2
3
4
5
6
7
8
9
10
11
12
1
3
14
1
5
1
6
1
6
2
7
3
4
9
5
+
+
+
+
+
V
CC
ANT
GND
GND NC
NC
NC
NC
NC
NC
GND
GND
GND
GND
GND
NC
NC
1
2
3
4
5
6
7
829
30
31
32
33
34
35
36
NC
CS0
CS1 / SS CLOCK NC
NC
NC
NC
CS2 / SS DATA
PDN
RSSI
NC
NC
9
10
11
12
13
14
23
24
25
26
27
28
MODE
VCC
AUDIO
NC
NC
DATA
NC
NC
15
16
17
18
19
20
21
22
G
N
D
US
B-
B
GND
5V
DAT -
G
N
D
GS
HD
GS
HD
G
N
D
G
N
D
1
2
3
4
5
6
GND
V
CC
ANT
GND
GND NC
NC
NC
NC
NC
NC
GND
GND
GND
GND
GND
NC
NC
1
2
3
4
5
6
7
8
29
30
31
32
33
34
35
36
NC
CS0
CS1 / SS CLOCK NC
NC
NC
NC
CS2 / SS DATA
PDN
RSSI
NC
NC
9
1
0
11
12
1
3
14
23
24
25
26
27
28
MODE
VCC
AUDIO
NC
NC
DATA
NC
NC
1
6
17
18
19
20
21
22
G
N
D
SDM-USB-QS
USBDP
USBDM
GND D
SR
DATA
_
I
N
DATA
_
OU
T
RT
S
C
T
S
DTR
TX_IND
VCC
SUSP_IND
RX_IND
485_TX
RI
DC
D
1
2
3
4
5
6
7
8
9
1
0
11
12
1
3
1
5
1
6
Figure 15: HP3 Receiver and Linx QS Series USB Module
PROTOCOL GUIDELINES
While many RF solutions impose data formatting and balancing requirements,
Linx RF modules do not encode or packetize the signal content in any manner.
The received signal will be affected by such factors as noise, edge jitter, and
interference, but it is not purposefully manipulated or altered by the modules.
This gives the designer tremendous flexibility for protocol design and interface.
Despite this transparency and ease of use, it must be recognized that there are
distinct differences between a wired and a wireless environment. Issues such as
interference and contention must be understood and allowed for in the design
process. To learn more about protocol considerations, we suggest you read Linx
Application Note AN-00160.
Errors from interference or changing signal conditions can cause corruption of
the data packet, so it is generally wise to structure the data being sent into small
packets. This allows errors to be managed without affecting large amounts of
data. A simple checksum or CRC could be used for basic error detection. Once
an error is detected, the protocol designer may wish to simply discard the corrupt
data or implement a more sophisticated scheme to correct it.
INTERFERENCE CONSIDERATIONS
The RF spectrum is crowded and the potential for conflict with other unwanted
sources of RF is very real. While all RF products are at risk from interference, its
effects can be minimized by better understanding its characteristics.
Interference may come from internal or external sources. The first step is to
eliminate interference from noise sources on the board. This means paying
careful attention to layout, grounding, filtering, and bypassing in order to
eliminate all radiated and conducted interference paths. For many products, this
is straightforward; however, products containing components such as switching
power supplies, motors, crystals, and other potential sources of noise must be
approached with care. Comparing your own design with a Linx evaluation board
can help to determine if and at what level design-specific interference is present.
External interference can manifest itself in a variety of ways. Low-level
interference will produce noise and hashing on the output and reduce the link’s
overall range.
High-level interference is caused by nearby products sharing the same
frequency or from near-band high-power devices. It can even come from your
own products if more than one transmitter is active in the same area. It is
important to remember that only one transmitter at a time can occupy a
frequency, regardless of the coding of the transmitted signal. This type of
interference is less common than those mentioned previously, but in severe
cases it can prevent all useful function of the affected device.
Although technically it is not interference, multipath is also a factor to be
understood. Multipath is a term used to refer to the signal cancellation effects
that occur when RF waves arrive at the receiver in different phase relationships.
This effect is a particularly significant factor in interior environments where
objects provide many different signal reflection paths. Multipath cancellation
results in lowered signal levels at the receiver and, thus, shorter useful distances
for the link.
BOARD LAYOUT GUIDELINES
If you are at all familiar with RF devices, you may be concerned about
specialized board layout requirements. Fortunately, because of the care taken by
Linx in designing the modules, integrating them is very straightforward. Despite
this ease of application, it is still necessary to maintain respect for the RF stage
and exercise appropriate care in layout and application in order to maximize
performance and ensure reliable operation. The antenna can also be influenced
by layout choices. Please review this data guide in its entirety prior to beginning
your design. By adhering to good layout principles and observing some basic
design rules, you will be on the path to RF success.
The adjacent figure shows the suggested
PCB footprint for the module. The actual pad
dimensions are shown in the Pad Layout
section of this manual. A ground plane (as
large as possible) should be placed on a
lower layer of your PC board opposite the
module. This ground plane can also be critical
to the performance of your antenna, which will
be discussed later. There should not be any
ground or traces under the module on the
same layer as the module, just bare PCB.
During prototyping, the module should be soldered to a properly laid-out circuit
board. The use of prototyping or “perf” boards will result in horrible performance
and is strongly discouraged.
No conductive items should be placed within 0.15in of the module’s top or sides.
Do not route PCB traces directly under the module. The underside of the module
has numerous signal-bearing traces and vias that could short or couple to traces
on the product’s circuit board.
The module’s ground lines should each have their own via to the ground plane
and be as short as possible.
AM / OOK receivers are particularly subject to noise. The module should, as
much as reasonably possible, be isolated from other components on your PCB,
especially high-frequency circuitry such as crystal oscillators, switching power
supplies, and high-speed bus lines. Make sure internal wiring is routed away
from the module and antenna, and is secured to prevent displacement.
The power supply filter should be placed close to the module’s V
CC
line.
In some instances, a designer may wish to encapsulate or “pot” the product.
Many Linx customers have done this successfully; however, there are a wide
variety of potting compounds with varying dielectric properties. Since such
compounds can considerably impact RF performance, it is the responsibility of
the designer to carefully evaluate and qualify the impact and suitability of such
materials.
The trace from the module to the antenna should be kept as short as possible.
A simple trace is suitable for runs up to 1/8-inch for antennas with wide
bandwidth characteristics. For longer runs or to avoid detuning narrow bandwidth
antennas, such as a helical, use a 50-ohm coax or 50-ohm microstrip
transmission line as described in the following section.
Page 15Page 14
GROUND PLANE
GROUND PLANE
ON LOWER LAYER
ON LOWER LAYER
GROUND PLANE
ON LOWER LAYER
Figure 16: Suggested PCB Layout
Dielectric Constant Width/Height (W/d)
Effective Dielectric
Constant
Characteristic
Impedance
4.80 1.8 3.59 50.0
4.00 2.0 3.07 51.0
2.55 3.0 2.12 48.0
Trace
Board
Ground plane
Figure 17: Microstrip Formulas
MICROSTRIP DETAILS
A transmission line is a medium whereby RF energy is transferred from one
place to another with minimal loss. This is a critical factor, especially in high-
frequency products like Linx RF modules, because the trace leading to the
module’s antenna can effectively contribute to the length of the antenna,
changing its resonant bandwidth. In order to minimize loss and detuning, some
form of transmission line between the antenna and the module should be used,
unless the antenna can be placed very close (<1/8in.) to the module. One
common form of transmission line is a coax cable, another is the microstrip. This
term refers to a PCB trace running over a ground plane that is designed to serve
as a transmission line between the module and the antenna. The width is based
on the desired characteristic impedance of the line, the thickness of the PCB,
and the dielectric constant of the board material. For standard 0.062in thick FR-
4 board material, the trace width would be 111 mils. The correct trace width can
be calculated for other widths and materials using the information below. Handy
software for calculating microstrip lines is also available on the Linx website,
www.linxtechnologies.com.
PAD LAYOUT
The following pad layout diagram is designed to facilitate both hand and
automated assembly.
PRODUCTION GUIDELINES
The modules are housed in a hybrid SMD package that supports hand or
automated assembly techniques. Since the modules contain discrete
components internally, the assembly procedures are critical to ensuring the
reliable function of the modules. The following procedures should be reviewed
with and practiced by all assembly personnel.
HAND ASSEMBLY
Pads located on the bottom of the
module are the primary mounting
surface. Since these pads are
inaccessible during mounting,
castellations that run up the side of
the module have been provided to
facilitate solder wicking to the
module’s underside. This allows for
very quick hand soldering for
prototyping and small volume
production.
If the recommended pad guidelines have been followed, the pads will protrude
slightly past the edge of the module. Use a fine soldering tip to heat the board
pad and the castellation, then introduce solder to the pad at the module’s edge.
The solder will wick underneath the module, providing reliable attachment. Tack
one module corner first and then work around the device, taking care not to
exceed the times listed below.
Castellations
PCB Pads
Soldering Iron
Tip
Solder
Absolute Maximum Solder Times
Hand-Solder Temp. TX +225°C for 10 Seconds
Hand-Solder Temp. RX +225°C for 10 Seconds
Recommended Solder Melting Point +180°C
Reflow Oven: +220°C Max. (See adjoining diagram)
Figure 19: Soldering Technique
Page 17Page 16 Page 17
Figure 18: Recommended PCB Layout
0.750
0.090
0.100
0.065
0.030 Dia. Finished
0.100
0.060
0.060
Surface-Mount ReceiverPinned Receiver
AUTOMATED ASSEMBLY
For high-volume assembly, most users will want to auto-place the modules. The
modules have been designed to maintain compatibility with reflow processing
techniques; however, due to the their hybrid nature, certain aspects of the
assembly process are far more critical than for other component types.
Following are brief discussions of the three primary areas where caution must be
observed.
Reflow Temperature Profile
The single most critical stage in the automated assembly process is the reflow
stage. The reflow profile below should not be exceeded, since excessive
temperatures or transport times during reflow will irreparably damage the
modules. Assembly personnel will need to pay careful attention to the oven’s
profile to ensure that it meets the requirements necessary to successfully reflow
all components while still remaining within the limits mandated by the modules.
The figure below shows the recommended reflow oven profile for the modules.
Shock During Reflow Transport
Since some internal module components may reflow along with the components
placed on the board being assembled, it is imperative that the modules not be
subjected to shock or vibration during the time solder is liquid. Should a shock
be applied, some internal components could be lifted from their pads, causing
the module to not function properly.
Washability
The modules are wash resistant, but are not hermetically sealed. Linx
recommends wash-free manufacturing; however, the modules can be subjected
to a wash cycle provided that a drying time is allowed prior to applying electrical
power to the modules. The drying time should be sufficient to allow any moisture
that may have migrated into the module to evaporate, thus eliminating the
potential for shorting damage during power-up or testing. If the wash contains
contaminants, the performance may be adversely affected, even after drying.
125°C
185°C
217°C
255°C
235°C
60 12030 150 180 210 240 270 300 330 360090
50
100
150
200
250
300
Recommended RoHS Profile
Max RoHS Profile
Recommended Non-RoHS Profile
180°C
Temperature (
o
C)
Time (Seconds)
Figure 20: Maximum Reflow Profile

RXM-900-HP3-PPO

Mfr. #:
Manufacturer:
Description:
RF RCVR FM/FSK 902-928MHZ 18SIP
Lifecycle:
New from this manufacturer.
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