HMC521ALC4 Data Sheet
Rev. 0 | Page 22 of 24
APPLICATIONS INFORMATION
TYPICAL APPLICATION CIRCUIT
Figure 86 shows the typical application circuit for the
HMC521ALC4. The HMC521ALC4 is a passive device and
does not require any external components. The LO and RF pins
are internally ac-coupled. The IFx pins are internally dc-coupled.
For applications not requiring operation to dc, dc block this
port externally using a series capacitor of a value chosen to pass
the necessary IF frequency range. When IF operation to dc is
required, do not exceed the IFx source and sink current rating
specified in the Absolute Maximum Ratings section. To select
the upper sideband when using the HMC521ALC4 as an
upconverter, connect the IF1 pin to the 90° port of the hybrid,
and connect the IF2 pin to the 0° port of the hybrid. To select
the lower sideband, connect the IF1 pin to the 0° port of the
hybrid and the IF2 pin to the 90° port of the hybrid. The input
is from the sum port of the hybrid, and the difference port is
50 Ω terminated.
To select the upper sideband (low-side LO) when using as
downconverter, connect the IF1 pin to the 0° port of the hybrid,
and connect the IF2 pin to the 90° port of the hybrid. To select
the lower sideband (high-side LO), connect the IF1 pin to the
90° port of the hybrid and connect the IF2 pin to the 0° port of
the hybrid. The output is from the sum port of the hybrid, and
the difference port is 50 Ω terminated.
PACKAGE
BASE
RF
IF1 IF2
LO
90°
HYBRID
50 IF
SUPPLY
FOR IF1
SUPPLY
FOR IF2
BIAS TEE/
DC FEED FOR IF2
BIAS TEE/
DC FEED FOR IF1
DC BLOCKING
CAPACITORS
EXTERNAL
90° HYBRID
NOTES
1. DASHED SECTIONS ARE OPTIONAL AND MEANT FOR LO NULLING.
13
1
3
4
2
7
5
6
14
15
16
17
18
8
9
1
0
1
1
1
2
1
9
2
0
2
1
2
2
2
3
2
4
16780-157
Figure 86. Typical Application Circuit
Data Sheet HMC521ALC4
Rev. 0 | Page 23 of 24
EVALUATION PCB INFORMATION
Use RF circuit design techniques for the circuit board used in
the application. Ensure that signal lines have 50 Ω impedance
and connect the package ground leads and the exposed pad
directly to the ground plane (see Figure 87). Use a sufficient
number of via holes to connect the top and bottom ground
planes. The evaluation circuit board shown in Figure 87 is
available from Analog Devices, Inc., upon request.
Table 8. List of Materials for Evaluation PCB
EV1HMC521ALC4
Item Description
J1, J2 PCB mount, SRI, 2.92 mm connectors
J3, J4 PCB mount, Johnson SMA connectors
U1 HMC521ALC4
PCB
1
109996-1 evaluation board on Rogers 4350
1
109996-1 is the raw bare PCB identifier. Reference EV1HMC521ALC4 when
ordering the complete evaluation PCB.
16780-084
Figure 87. Evaluation PCB Top Layer
HMC521ALC4 Data Sheet
Rev. 0 | Page 24 of 24
OUTLINE DIMENSIONS
12
0.50
BSC
2.50 REF
BOTTOM VIEW
TOP VIEW
1
24
7
13
18
19
6
02-27-2017-B
0.36
0.30
0.24
EXPOSED
PAD
PKG-004840
PIN 1
INDICATOR
4.05
3.90 SQ
3.75
3.10 BSC
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
2.60
2.50 SQ
2.40
PIN 1
0.32
BSC
0.08
BSC
SIDE VIEW
1.00
0.90
0.80
SEATING
PLANE
Figure 88. 24-Terminal Ceramic Leadless Chip Carrier [LCC]
(E-24-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range MSL Rating
2
Package Description Package Option
HMC521ALC4 −40°C to +85°C MSL3 24-Terminal Ceramic Leadless Chip Carrier [LCC] E-24-1
HMC521ALC4TR −40°C to +85°C MSL3 24-Terminal Ceramic Leadless Chip Carrier [LCC] E-24-1
HMC521ALC4TR-R5 −40°C to +85°C MSL3 24-Terminal Ceramic Leadless Chip Carrier [LCC] E-24-1
EV1HMC521ALC4
Evaluation PCB Assembly
1
All models are RoHS compliant.
2
See the Absolute Maximum Ratings section, Table 2.
©2018 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D16780-0-7/18(0)

HMC521ALC4

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
RF Mixer Mixers
Lifecycle:
New from this manufacturer.
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