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HMC521ALC4

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24
HMC521ALC4 Data Sheet
Rev. 0 | Page 4 of 24
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
RF Input Power 20 dBm
LO Input Power
27 dBm
IFx Input Power 20 dBm
IFx Source and Sink Current 2 mA
Peak Reflow Temperature (Moisture
Sensitivity Level 3 (MSL3))
1
260°C
Junction Temperature (T
J
) 175°C
Lifetime at Maximum (T
J
)
>1 × 10
6
hours
Continuous Power Dissipation, P
DISS
(T
A
= 85°C, Derate 6.22 mW/°C Above 85°C)
460 mW
Operating Temperature Range
−40°C to +85°C
Storage Temperature Range −65°C to +150°C
Lead Temperature Range −65°C to +150°C
Electrostatic Discharge (ESD) Sensitivity
Human Body Model (HBM) 250 V
Field Induced Charged Device Model
(FICDM)
500 V
1
See the Ordering Guide.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to PCB design and
operating environment. Careful attention to PCB thermal
design is required.
θ
JA
is the natural convection junction to ambient thermal
resistance measured in a one cubic foot sealed enclosure. θ
JC
is
the junction to case thermal resistance.
Table 3. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
E-24-1
1
120 148 °C/W
1
Test Condition 1: JEDEC Standard JESD51-2.
ESD CAUTION
Data Sheet HMC521ALC4
Rev. 0 | Page 5 of 24
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
13
1
3
4
2
7
NIC
NIC
GND
RF
5
6
GND
NIC
NIC
14
GND
15
LO
16
GND
17
NIC
18
NIC
NIC
8
NIC
9
IF1
10
NIC
11
IF2
12
19
GND
NIC
20
NIC
21
NIC
22
NIC
23
NIC
24
NIC
NOTES
1.
NIC = NOT INTERNALLY CONNECTED.
THESE PINS
ARE NOT CONNECTED INTERNALLY.
2.
EXPOSED
P
AD. THE EXPOSED PAD MUST BE
CONNECTED TO THE GND PIN.
16780-002
HMC521ALC4
TOP VIEW
(Not to Scale)
Figure 2. Pin Configuration 7
Table 4. Pin Function Descriptions
Pin No. Mnemonic Description
1, 2, 6 to 8, 10,
13, 17 to 24
NIC Not Internally Connected. These pins are not connected internally.
3, 5, 12, 14, 16 GND
Ground. These pins and package bottom must be connected to RF and dc ground. See Figure 3 for the
GND interface schematic.
4
RF
Radio Frequency Port. This pin is ac-coupled and matched to 50 Ω. See Figure 6 for the RF interface
schematic.
9 IF1
First Quadrature Intermediate Frequency Port. This pin is dc-coupled. For applications not requiring
operation to dc, dc block this port externally using a series capacitor of a value chosen to pass the
necessary IF frequency range. For operation to dc, these pins must not source or sink more than 2 mA of
current. Otherwise, die malfunction or die failure may result. See Figure 5 for the IFx interface schematic.
11 IF2
Second Quadrature Intermediate Frequency Port. This pin is dc-coupled. For applications not requiring
operation to dc, dc block this port externally using a series capacitor of a value chosen to pass the
necessary IF frequency range. For operation to dc, these pins must not source or sink more than 2 mA of
current. Otherwise, die malfunction or die failure may result. See Figure 5 for the IFx interface schematic.
15 LO
Local Oscillator Port. This pin is ac-coupled and matched to 50 Ω. See Figure 4 for the LO interface
schematic.
EPAD Exposed Pad. The exposed pad must be connected to the GND pin.
INTERFACE SCHEMATICS
GND
16780-003
Figure 3. GND Interface Schematic
LO
16780-004
Figure 4. LO Interface Schematic
IFx
16780-005
Figure 5. IFx Interface Schematic
RF
16780-006
Figure 6. RF Interface Schematic
HMC521ALC4 Data Sheet
Rev. 0 | Page 6 of 24
TYPICAL PERFORMANCE CHARACTERISTICS
DOWNCONVERTER PERFORMANCE, IF = 100 MHz
Upper Sideband (Low-Side LO)
–20
–16
–12
–8
–4
0
7.5
8.5
9.5
10.5 1
1.5 12.5
13.5 14.5
CONVERSION GAIN (dB)
RF FREQUENC
Y (GHz)
–40°C
+25°C
+85°C
16780-007
Figure 7. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 15 dBm
0
10
20
30
40
50
60
7.5 8.5 9.5 10.5 11.5
12.5 13.5 14.5
IMAGE REJECTION (dBc)
RF FREQUENCY (GHz)
–40°C
+25°C
+85°C
16780-008
Figure 8. Image Rejection vs. RF Frequency at Various Temperatures,
LO = 15 dBm
0
5
10
15
20
30
25
7.5 8.5
9.5 10.5 11.5 12.5 13.5 14.5
INPUT IP3 (dBm)
RF FREQUENCY (GHz)
–40°C
+25°C
+85°C
16780-009
Figure 9. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 15 dBm
–20
–16
–12
–8
–4
0
7.5
8.5
9.5
10.5
11.5
12.5
13.5
14.5
CONVERSION GAIN (dB)
RF FREQUENC
Y (GHz)
LO =
1
1dBm
LO = 13dBm
LO = 15dBm
LO = 17dBm
LO = 19dBm
16780-010
Figure 10. Conversion Gain vs. RF Frequency at Various LO Power Levels,
T
A
= 25°C
0
10
20
30
40
50
60
7.5 8.5 9.5 10.5 11.5 12.5 13.5 14.5
IMAGE REJECTION (dBc)
RF FREQUENCY (GHz)
LO = 11dBm
LO = 13dBm
LO = 15dBm
LO = 17dBm
LO = 19dBm
16780-011
Figure 11. Image Rejection vs. RF Frequency at Various LO Power Levels,
T
A
= 25°C
0
5
10
15
20
25
30
7.5
8.5
9.5
10.5
1
1.5
12.5
13.5
14.5
INPUT IP3 (dBm)
RF FREQUENCY (GHz)
LO = 11dBm
LO = 13dBm
LO = 15dBm
LO = 17dBm
LO = 19dBm
16780-012
Figure 12. Input IP3 vs. RF Frequency at Various LO Power Levels,
T
A
= 25°C
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24

HMC521ALC4

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Manufacturer:
Analog Devices Inc.
Description:
RF Mixer Mixers
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