©1988 Fairchild Semiconductor Corporation www.fairchildsemi.com
74AC273, 74ACT273 Rev. 1.6.0 8
74AC273, 74ACT273 — Octal D-Type Flip-Flop
Physical Dimensions
Figure 1. 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www
.fairchildsemi.com/packaging/
0.10 C
C
A
SEE DETAIL A
NOTES: UNLESS OTHERWISE SPECIFIED
A) THIS PACKAGE CONFORMS TO JEDEC
MS-013, VARIATION AC, ISSUE E
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS DO NOT INCLUDE MOLD
FLASH OR BURRS.
E) LANDPATTERN STANDARD: SOIC127P1030X265-20L
PIN ONE
INDICATOR
0.25
1 10
BC A
M
20 11
B
X45°
8°
0°
SEATING PLANE
GAGE PLANE
DETAIL A
SCALE: 2:1
SEATING PLANE
LAND PATTERN RECOMMENDATION
F) DRAWING FILENAME: MKT-M20BREV3
0.65
1.27
2.25
9.50
13.00
12.60
11.43
7.60
7.40
10.65
10.00
0.51
0.35
1.27
2.65 MAX
0.30
0.10
0.33
0.20
0.75
0.25
(R0.10)
(R0.10)
1.27
0.40
(1.40)
0.25
D) CONFORMS TO ASME Y14.5M-1994
