93LC46/56/66
DS21712C-page 10 2002-2012 Microchip Technology Inc.
3.0 PIN DESCRIPTION
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1: PIN FUNCTION TABLE
3.1 Chip Select (CS)
A high level selects the device. A low level deselects
the device and forces it into Standby mode. However, a
programming cycle which is already initiated and/or in
progress will be completed, regardless of the CS input
signal. If CS is brought low during a program cycle, the
device will go into Standby mode as soon as the
programming cycle is completed.
CS must be low for 250 ns minimum (T
CSL) between
consecutive instructions. If CS is low, the internal
control logic is held in a Reset status.
3.2 Serial Clock (CLK)
The serial clock is used to synchronize the communica-
tion between a master device and the 93LC46/56/66.
Opcode, address and data bits are clocked in on the
positive edge of CLK. Data bits are also clocked out on
the positive edge of CLK.
CLK can be stopped anywhere in the transmission
sequence (at high or low level) and can be continued
anytime with respect to clock high time (T
CKH) and
clock low time (T
CKL). This gives the controlling master
freedom in preparing opcode, address and data.
CLK is a “don't care” if CS is low (device deselected). If
CS is high, but Start condition has not been detected,
any number of clock cycles can be received by the
device without changing its status (i.e., waiting for Start
condition).
CLK cycles are not required during the self-timed write
(i.e., auto erase/write) cycle.
After detection of a Start condition the specified number
of clock cycles (respectively low-to-high transitions of
CLK) must be provided. These clock cycles are required
to clock in all required opcode, address and data bits
before an instruction is executed (see instruction set
truth table). CLK and DI then become “don't care” inputs
waiting for a new Start condition to be detected.
3.3 Data In (DI)
Data In is used to clock in a Start bit, opcode, address
and data synchronously with the CLK input.
3.4 Data Out (DO)
Data Out is used in the Read mode to output data syn-
chronously with the CLK input (T
PD after the positive
edge of CLK).
This pin also provides Ready/Busy status information
during erase and write cycles. Ready/Busy
status infor-
mation is available on the DO pin if CS is brought high
after being low for minimum chip select low time (TCSL)
and an erase or write operation has been initiated.
The Status signal is not available on DO, if CS is held
low or high during the entire write or erase cycle. In all
other cases DO is in the High-Z mode. If status is
checked after the write/erase cycle, a pull-up resistor
on DO is required to read the Ready signal.
3.5 Organization (ORG)
When ORG is connected to VCC, the (x16) memory
organization is selected. When ORG is tied to V
SS, the
(x8) memory organization is selected. ORG can only be
floated for clock speeds of 1 MHz or less for the (x16)
memory organization. For clock speeds greater than
1 MHz, ORG must be tied to V
CC or VSS.
Name PDIP SOIC
ROTATED
TSSOP
Description
CS 1 1 3 Chip Select
CLK 2 2 4 Serial Data Clock
DI 3 3 5 Serial Data Input
DO 4 4 6 Serial Data Output
V
SS 5 5 7 Ground
ORG 6 6 8 Memory Configuration
NU 7 7 1 Not Utilized
Vcc 8 8 2 +1.8V to 5.5V Power Supply
Note: CS must go low between consecutive
instructions.
2002-2012 Microchip Technology Inc. DS21712C-page 11
93LC46/56/66
4.0 PACKAGING INFORMATION
4.1 Package Marking Information
XXXXXXXX
XXXXXNNN
YYWW
8-Lead PDIP (300 mil)
Example:
8-Lead SOIC (150 mil)
Example:
XXXXXXXX
XXXXYYWW
NNN
93LC46
I/PNNN
YYWW
93LC46
I/SNYYWW
NNN
8-Lead Rotated SOIC (150 mil)
Example:
XXXXXXXX
XXXXYYWW
NNN
93LC46X
I/SNYYWW
NNN
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
* This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
93LC46/56/66
DS21712C-page 12 2002-2012 Microchip Technology Inc.
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
B1
B
A1
A
L
A2
p
E
eB
c
E1
n
D
1
2
Units INCHES* MILLIMETERS
Dimension Limits MIN NOM MAX MIN NOM MAX
Number of Pins
n
88
Pitch
p
.100 2.54
Top to Seating Plane A .140 .155 .170 3.56 3.94 4.32
Molded Package Thickness A2 .115 .130 .145 2.92 3.30 3.68
Base to Seating Plane A1 .015 0.38
Shoulder to Shoulder Width E .300 .313 .325 7.62 7.94 8.26
Molded Package Width
E1
.240 .250 .260 6.10 6.35 6.60
Overall Length D .360 .373 .385 9.14 9.46 9.78
Tip to Seating Plane L .125 .130 .135 3.18 3.30 3.43
Lead Thickness
c
.008 .012 .015 0.20 0.29 0.38
Upper Lead Width B1 .045 .058 .070 1.14 1.46 1.78
Lower Lead Width B .014 .018 .022 0.36 0.46 0.56
Overall Row Spacing § eB .310 .370 .430 7.87 9.40 10.92
Mold Draft Angle Top
5 10 15 5 10 15
Mold Draft Angle Bottom
5 10 15 5 10 15
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
JEDEC Equivalent: MS-001
Drawing No. C04-018
.010” (0.254mm) per side.
§ Significant Characteristic
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging

93LC66/P

Mfr. #:
Manufacturer:
Microchip Technology
Description:
EEPROM 512x8 Or 256x16
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union