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DLP31DN441ML4L

P1-P3P4-P6P7-P9
Spec No. JEFL243E-0003L-01 P7/10
MURATA MFG.CO., LTD
Reference
Only
16.6 Standard Land Dimensions (Flow and Reflow)
16.7 Soldering
(1) Soldering Conditions
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
On flow soldering (e.g. double wave soldering), use the product in consideration of the
conditions of solder, solder temperature and immersion time (melting time) because longer
soldering time may cause the corrosion of the electrode.
On dipping soldering, use the product in consideration of the conditions of solder,
solder temperature, flux, preheat and so on because de-wetting may be caused.
① Flow soldering profile
Standard Profile Limit Profile
Pre-heating 150℃、60s min.
Heating 250℃、4～6s 265±3℃、5s max.
Cycle of flow 2 times 2 times
Products
0.8
2.2to2.6
0.8 pitch
0.4
(in mm)
2.8
Resist
Copper foil pattern
No patter
150
60ｓ min. Time（ｓ）
265±3℃
Temp.
(℃)
Heating Time
Standard Profile
250℃
Limit Profile
Spec No. JEFL243E-0003L-01 P8/10
MURATA MFG.CO., LTD
Reference
Only
② Reflow soldering profile
Standard Profile Limit Profile
Pre-heating 150～180°C 、90s±30s
Heating above 220°C、30s～60s above 230°C、60s max.
Peak temperature 245±3°C 260°C、10s
Cycle of reflow 2 times 2 times
(2) Standard printing pattern of solder paste
Standard thickness of the solder paste should be 150 to 200µm.
Use the solder paste printing pattern of the right pattern.
For the resist and copper foil pattern, use standard land dimensions.
Use the Solder Sn-3.0Ag-0.5Cu for pattern printing.
(3) Reworking with Soldering iron
The following conditions shall be strictly followed when using a soldering iron after
being mounted by flow or reflow soldering.
· Pre-heating: 150°C, 1 min · Soldering iron output: 30W max.
· Tip temperature: 350°C max. · Tip diameter:φ3mm max.
· Soldering time : 3(+1,-0) seconds. · Times : 2times max.
Do not touch the products directly with the tip of the soldering iron.
(4) Solder Volume
Solder shall be used not to be exceeded the upper limits as shown below.
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Excessive solder volume may cause the failure of mechanical or electrical performance.
16.8 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for Isopropyl alcohol.)
(2) Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon
at the mounted products and P.C.B..
Power : 20W/ l max. / Frequency : 28kHz to 40kHz / Time : 5 minutes max.
(3) Cleaner
1. Alternative cleaner Isopropyl alcohol (IPA)
2. Aqueous agent PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized
water in order to remove the cleaner.
(5) Other cleaning Please contact us.
0.4
1.0
1.0
0.8
0.8
(in mm)
Limit Profile
Standard Profile
90s±30s
230℃
260℃/10s
245℃±3℃
220℃
30s～60s
60s max.
180
150
Temp.
Time(s)
(℃)
U
pp
er Limit
U
pp
er Limit
Recommendable
Recommendable
1/3 T ≦ ｔ ≦ T （T : Chip thickness）
t
Spec No. JEFL243E-0003L-01 P9/10
MURATA MFG.CO., LTD
Reference
Only
16.9 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening
screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
16.10 Operating Environment
Do not use this product under the following environmental conditions, on deterioration
of the performance, such as insulation resistance may result from the use.
(1) in corrosive gases (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
16.11 Storage Conditions
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage environment condition
Products should be stored in the warehouse on the following conditions.
Temperature : -10 to +40°C
Humidity : 15 to 85% relative humidity
No rapid change on temperature and humidity
Products should not be stored in corrosive gases, such as sulfureous, acid gases,alkaline gases,to
prevent the following deterioration.
Poor solderability due to the oxidized electrode.
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
Products should be stored under the airtight packaged condition.
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
17.
△
!
Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.
P1-P3P4-P6P7-P9

DLP31DN441ML4L

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Common Mode Filters / Chokes 440ohms
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