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ADL5611-EVALZ

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P17
ADL5611 Data Sheet
Rev. B | Page 12 of 16
Figure 21. Gain Distribution at 4000 MHz
Figure 22. P1dB Distribution at 900 MHz
Figure 23. OIP3 Distribution at 900 MHz, P
OUT
= 0 dBm per Tone
Figure 24. Noise Figure Distribution at 900 MHz
Figure 25. Single-Tone Harmonics vs. Frequency, P
OUT
= 0 dBm
0
5
10
15
20
25
30
35
40
19.6 19.7 19.8 19.9 20.0
20.1
20.2 20.3
PERCENTAGE (%)
GAIN (dB)
11508-120
0
10
20
30
40
50
60
20.5 20.6 20.7 20.8 20.9 21.0 21.1 21.2 21.3 21.4 21.5
PERCENTAGE (%)
P1dB (dBm)
11508-123
0
5
10
15
20
25
30
35
37 38
39 40
41
42 43
44
45
PERCENTAGE (%)
OIP3 (dBm)
11508-125
0
10
20
30
40
50
60
70
80
90
1.8 1.9
2.0 2.1 2.2
2.3
2.4 2.5
PERCENTAGE (%)
NOISE FIGURE (dB)
11508-126
0
–90
–80
–70
–60
–50
–40
–30
–20
–10
0.5 4.0
3.5
3.02.5
2.01.51.0
HARMONICS (dBc)
FREQUENCY (GHz)
H2
H3
11508-127
Data Sheet ADL5611
Rev. B | Page 13 of 16
APPLICATIONS INFORMATION
BASIC CONNECTIONS
Figure 26 shows the basic connections for operating the ADL5611.
The device supports operation from 30 MHz to 6 GHz. However,
for optimal performance at lower frequency bands, the board con-
figuration must be adjusted. Table 6 lists the recommended board
configuration to operate the device at various frequency bands.
Figure 26. Basic Connections
A 5 V dc bias is supplied to the amplifier through the bias inductor
connected to RFOUT (Pin 3). Decouple the bias voltage using
68 pF, 1.2 nF, and 1 µF power supply decoupling capacitors. The
typical current consumption for the ADL5611 is 94 mA.
At low frequencies, the device exhibits improved performance
with the suggested setup configuration listed in Table 6. Figure 27
and Figure 28 provide a comparison of the performance of the
device at the 30 MHz to 500 MHz band when driven with the
optimal setup configuration and the default setup configuration.
Figure 27. Noise Figure, Gain, P1dB, and OIP3 vs. Frequency,
30 MHz to 500 MHz, Comparison of Performance
with the Optimized Settings and the Default Configuration
Figure 28. Output Return Loss (S22), Input Return Loss (S11), and
Reverse Isolation (S12), 30 MHz to 500 MHz, Comparison of Performance
with the Optimized Settings and the Default Configuration
Table 6. Recommended Components for Basic Connections
Frequency Band
AC Coupling Capacitors (0402) DC Bias Inductor (0603HP)
C1 (nF) C2 (nF) L1 (nH)
500 MHz to 6 GHz 100 100 43
30 MHz to 500 MHz 100 100 1000
RFIN
GND
GND
RFOUT
1
2
(2)
3
ADL5611
L1
VPOS
GND
RFIN
C1
RFOUT
C2
C6
1µF
C5
1.2nF
C4
68pF
11508-222
0
5
10
15
20
25
30
35
40
45
0
50
100 150
200
250
300
350 400 450 500
NOISE FIGURE, GAIN, P1dB, OIP3 (dB, dBm)
FREQUENCY (MHz)
GAIN (dB), DEFAULT SETUP CONFIGURATION
GAIN (dB), LOW FREQUENCY CONFIGURATION
OIP3 (dBm), DEFAULT SETUP CONFIGURATION
OIP3 (dBm), LOW FREQUENCY CONFIGURATION
P1dB (dBm), DEFAULT SETUP CONFIGURATION
P1dB (dBm), LOW FREQUENCY CONFIGURATION
NOISE FIGURE (dB), DEFAULT SETUP CONFIGURATION
NOISE FIGURE (dB), LOW FREQUENCY CONFIGURATION
11508-129
–35
–30
–25
–20
–15
–10
–5
0
0
50
100
150
200 250
300
350 400
450
500
S-PARAMETERS
(dB)
FREQUENC
Y
(MHz)
S
1
1, DE
F
AU
LT SETU
P
CONFIGUR
A
TION
S22, DE
F
AUL
T SETU
P
CONFIGUR
A
TION
S
1
1, LOW FREQUENC
Y CONFIGUR
A
TION
S22, LOW FREQUENC
Y CONFIGUR
A
TION
S12, DE
F
AUL
T SETUP
CONFIGUR
A
TION
S12, LOW FREQUENC
Y
CONFIGURA
TION
11508-130
ADL5611 Data Sheet
Rev. B | Page 14 of 16
SOLDERING INFORMATION AND RECOMMENDED
PCB LAND PATTERN
Figure 29 shows the recommended land pattern for the ADL5611.
To minimize thermal impedance, the exposed pad on the
underside of the SOT-89 package is soldered to a ground plane,
along with Pin 2. If multiple ground layers exist, stitch the layers
together using vias.
Figure 29. Recommended Land Pattern
The land pattern on the ADL5611 evaluation board provides a
measured thermal resistance (θ
JA
) of 52°C/W. To measure θ
JA
,
the temperature at the top of the SOT-89 package is sensed with
an IR temperature gun.
Thermal simulation suggests a junction temperature that is
10°C higher than the top of package temperature. With additional
measurements of the ambient temperature and input/output
power, θ
JA
can be determined.
W-CDMA ACPR PERFORMANCE
Figure 30 shows a plot of the adjacent channel power ratio
(ACPR) vs. P
OUT
for the ADL5611. The signal type used is a
single wideband code division multiple access (W-CDMA)
carrier (Test Model 1-64) at 2140 MHz. This signal is generated
by a very low ACPR source. ACPR is measured at the output by
a high dynamic range spectrum analyzer that incorporates an
instrument noise correction function.
Figure 30. ACPR vs. P
OUT
, Single W-CDMA Carrier (Test Model 1-64)
at 2140 MHz
The ADL5611 achieves an ACPR of −79 dBc at an output power
level of −5 dBm, at which point the device noise and not distortion
begins to dominate the power in the adjacent channels. At an
output power level of 5 dBm, ACPR is still very low at −62 dBc.
3.00mm
3.48mm
1.80mm
5.37mm
0.20mm
0.762mm
0.635mm
0.62mm
0.86mm
0.86mm
1.50mm
1.27mm
11508-229
0
–90
–80
–70
–60
–50
–40
–30
–20
–10
–20 –15 –10 –5 0 105
ACPR AT 5MHz CARRIER OFFSET (dBc)
P
OUT
(dBm)
11508-138
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P17

ADL5611-EVALZ

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Manufacturer:
Analog Devices Inc.
Description:
RF Development Tools ADL5611 EVAL BRD
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