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ADL5611-EVALZ

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P17
ADL5611 Data Sheet
Rev. B | Page 6 of 16
Frequency
(MHz)
S11 S21 S12 S22
Magnitude (dB) Angle (°) Magnitude (dB) Angle (°) Magnitude (dB) Angle (°) Magnitude (dB) Angle (°)
3600 −13.681 −403.841 +20.385 −647.042 −26.068 −341.857 −13.141 −480.219
3700 −14.819 −418.280 +20.334 −661.029 −25.962 −352.974 −13.812 −497.201
3800 −16.480 −433.535 +20.321 −675.145 −25.829 −364.326 −14.683 −517.273
3900 −18.415 −450.193 +20.283 −689.975 −25.641 -375.829 −15.473 −540.432
4000 −20.901 −481.302 +20.107 −704.970 −25.735 −388.338 −15.539 −563.571
4100 −22.899 −530.706 +19.930 −719.959 −25.751 −400.117 −15.329 −589.891
4200 −20.175 −574.613 +19.528 −735.700 −25.987 −412.869 −14.226 −611.397
4300 −16.107 −607.497 +18.987 −750.647 −26.349 −424.046 −12.606 −631.788
4400 −12.487 −632.642 +18.248 −764.216 −26.734 −433.978 −10.710 −651.154
4500 −9.908 −655.826 +17.627 −775.099 −26.846 −442.104 −9.069 −671.887
4600 −8.294 −676.352 +17.415 −785.594 −26.704 −451.707 −7.925 −691.567
4700
−7.462
−692.336
+17.300
−797.596
−26.413
−463.172
−7.360
−709.087
4800 −6.742 −707.212 +17.180 −810.719 −26.495 −473.259 −6.944 −725.426
4900 −6.341 −719.044 +16.938 −823.703 −26.376 −485.497 −6.709 −738.970
5000 −5.850 −730.317 +16.723 −836.856 −26.732 −496.442 −6.431 −752.403
5100 −5.683 −740.078 +16.407 −849.613 −26.564 −506.443 −6.520 −764.449
5200 −5.393 −749.333 +16.142 −862.399 −26.637 −518.454 −6.474 −775.847
5300 −5.255 −757.862 +15.797 −874.886 −26.764 −527.731 −6.577 −787.719
5400 −4.941 −766.095 +15.601 −886.816 −26.723 −538.802 −6.816 −798.987
5500 −4.762 −775.169 +15.423 −899.572 −26.813 −550.352 −7.136 −810.139
5600 −4.751 −783.296 +15.212 −912.138 −26.836 −560.482 −7.707 −821.411
5700 −4.718 −791.495 +15.016 −925.031 −26.865 −570.790 −8.420 −832.448
5800 −4.803 −798.324 +14.811 −937.622 −26.711 −581.237 −9.417 −843.000
5900 −4.815 −805.589 +14.640 −950.405 −26.625 −592.240 −10.700 −853.572
6000 −4.846 −812.180 +14.474 −963.642 −26.496 −603.172 −12.335 −863.102
Data Sheet ADL5611
Rev. B | Page 7 of 16
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter Rating
Supply Voltage, V
POS
6.5 V
Input Power (50 Ω Impedance)
20 dBm
Internal Power Dissipation (Pad Soldered to
Ground)
800 mW
ESD Human Body Model (HBM) Rating (ESDA/
JEDEC JS-001-2011)
±1.5 kV
Maximum Junction Temperature
150°C
Operating Temperature Range −40°C to +105°C
Storage Temperature Range −65°C to +150°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Table 4 lists the junction-to-air thermal resistance (θ
JA
) and the
junction-to-case thermal resistance (θ
JC
) for the ADL5611.
Table 4. Thermal Resistance
Package Type θ
JA
1
θ
JC
2
Unit
3-Lead SOT-89 (RK-3) 52 9 °C/W
1
Measured on the ADL5611 evaluation board. For more information about
board layout, see the Soldering Information and Recommended PCB Land
Pattern section.
2
Based on simulation with a standard JEDEC board per JESD51.
ESD CAUTION
ADL5611 Data Sheet
Rev. B | Page 8 of 16
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
Figure 2. Pin Configuration
Table 5. Pin Function Descriptions
Pin No. Mnemonic Description
1 RFIN RF Input. This pin requires a dc blocking capacitor.
2 GND Ground. Connect this pin to a low impedance ground plane.
3
RFOUT
RF Output and Supply Voltage. DC bias is provided to this pin through an inductor that is connected to the
external power supply. The RF path requires a dc blocking capacitor.
EPAD
Exposed Pad. The exposed pad encompasses Pin 2 and the tab at the top side of the package. Solder the exposed
pad to a low impedance ground plane for electrical grounding and thermal transfer.
RFIN
GND
RFOUT
1
2
3
GND
ADL5611
TOP VIEW
(Not to Scale)
(2)
NOTES
1. THE EXPOSED PAD ENCOMPASSES PIN 2 AND THE
TAB AT THE TOP SIDE OF THE PACKAGE. SOLDER
THE EXPOSED PAD TO A LOW IMPEDANCE GROUND
PLANE FOR ELECTRICAL GROUNDING AND
THERMAL TRANSFER.
11508-002
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P17

ADL5611-EVALZ

Mfr. #:
Buy ADL5611-EVALZ
Manufacturer:
Analog Devices Inc.
Description:
RF Development Tools ADL5611 EVAL BRD
Lifecycle:
New from this manufacturer.
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