LTC1147LCS8-3.3#TRPBF

10
LTC1147-3.3
LTC1147-5/LTC1147L
sn1147 1147fds
Optimum efficiency is obtained by making the ESR equal
to R
SENSE
. As the ESR is increased up to 2R
SENSE
, the
efficiency degrades by less than 1%. If the ESR is greater
than 2R
SENSE
, the voltage ripple on the output capacitor
will prematurely trigger Burst Mode
operation, resulting in
disruption of continuous mode and an efficiency hit which
can be several percent.
Manufacturers such as Nichicon and United Chemicon
should be considered for high performance capacitors.
The OS-CON semiconductor dielectric capacitor available
from Sanyo has the lowest ESR/size ratio of any aluminum
electrolytic at a somewhat higher price. Once the ESR
requirement for C
OUT
has been met, the RMS current
rating generally far exceeds the I
RIPPLE(P-P)
requirement.
In surface mount applications multiple capacitors may
have to be paralleled to meet the capacitance, ESR or RMS
current handling requirements of the application. Alumi-
num electrolytic and dry tantalum capacitors are both
available in surface mount configurations. In the case of
tantalum, it is critical that the capacitors are surge tested
for use in switching power supplies. An excellent choice
is the AVX TPS series of surface mount tantalums, avail-
able in case heights ranging from 2mm to 4mm. For
example, if 200µF/10V is called for in an application
requiring 3mm height, two AVX 100µF/10V (P/N TPSD
107K010) could be used. Consult the manufacturer for
other specific recommendations.
At low supply voltages, a minimum capacitance at C
OUT
is
needed to prevent an abnormal low frequency operating
mode (see Figure 4). When C
OUT
is made too small, the
output ripple at low frequencies will be large enough to trip
the voltage comparator. This causes Burst Mode
opera-
tion to be activated when the LTC1147 series would
normally be in continuous operation. The effect is most
pronounced with low values of R
SENSE
and can be im-
proved by operating at higher frequencies with lower
values of L. The output remains in regulation at all times.
Checking Transient Response
The regulator loop response can be checked by looking
at the load transient response. Switching regulators
take several cycles to respond to a step in DC (resistive)
load current. When a load step occurs, V
OUT
shifts by an
amount equal to I
LOAD
(ESR), where ESR is the effec-
tive series resistance of C
OUT
. I
LOAD
also begins to
charge or discharge C
OUT
until the regulator loop adapts
to the current change and returns V
OUT
to its steady
state value. During this recovery time V
OUT
can be
monitored for overshoot or ringing which would indi-
cate a stability problem. The external components shown
in the Figure 1 circuit will prove adequate compensation
for most applications.
A second, more severe transient is caused by switching
in loads with large (>1µF) supply bypass capacitors. The
discharged bypass capacitors are effectively put in par-
allel with C
OUT
, causing a rapid drop in V
OUT
. No regulator
can deliver enough current to prevent this problem if the
load switch resistance is low and it is driven quickly. The
only solution is to limit the rise time of the switch drive so
that the load rise time is limited to approximately
(25)C
LOAD
. Thus a 10µF capacitor would require a 250µs
rise time, limiting the charging current to about 200mA.
Efficiency Considerations
The percent efficiency of a switching regulator is equal to
the output power divided by the input power times 100%.
It is often useful to analyze individual losses to determine
what is limiting the efficiency and which change would
produce the most improvement. Percent efficiency can be
expressed as:
%Efficiency = 100% – (L1 + L2 + L3 + ...)
Figure 4. Minimum Value of C
OUT
(V
IN
– V
OUT
) VOLTAGE (V)
0
C
OUT
(µF)
600
1000
4
LTC1147 • F04
400
200
0
1
2
3
5
800
L = 50µH
R
SENSE
= 0.02
L = 25µH
R
SENSE
= 0.02
L = 50µH
R
SENSE
= 0.05
APPLICATIO S I FOR ATIO
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LTC1147-3.3
LTC1147-5/LTC1147L
sn1147 1147fds
where L1, L2, etc., are the individual losses as a percent-
age of input power. (For high efficiency circuits only small
errors are incurred by expressing losses as a percentage
of output power.)
Although all dissipative elements in the circuit produce
losses, four main sources usually account for most of the
losses in LTC1147 circuits: 1) LTC1147 DC bias current,
2) MOSFET gate charge current, 3) I
2
R losses, and 4)
voltage drop of the Schottky diode.
1. The DC supply current is the current which flows into
V
IN
(Pin 1) less the gate charge current. For V
IN
= 10V
the LTC1147 series DC supply current is 160µA for no
load, and increases proportionally with load up to a
constant 1.6mA after the LTC1147 series has entered
continuous mode. Because the DC bias current is
drawn from V
IN
, the resulting loss increases with
input voltage. For V
IN
= 10V the DC bias losses are
generally less than 1% for load currents over 30mA.
However, at very low load currents the DC bias current
accounts for nearly all of the loss.
2. MOSFET gate charge current results from switching
the gate capacitance of the power MOSFET. Each time
a MOSFET gate is switched from low to high to low
again, a packet of charge dQ moves from V
IN
to
ground. The resulting dQ/dt is a current out of V
IN
which is typically much larger than the DC supply
current. In continuous mode, I
GATECHG
= f(Q
P
). The
typical gate charge for a 0.135 P-channel power
MOSFET is 40nC. This results in I
GATECHG
= 4mA in
100kHz continuous operation for a 2% to 3% typical
midcurrent loss with V
IN
= 10V.
Note that the gate charge loss increases directly with
both input voltage and operating frequency. This is the
principal reason why the highest efficiency circuits
operate at moderate frequencies. Furthermore, it ar-
gues against using a larger MOSFET than necessary to
control I
2
R losses, since overkill can cost efficiency as
well as money!
3. I
2
R losses are easily predicted from the DC resis-
tances of the MOSFET, inductor and current shunt. In
continuous mode the average output current flows
through L and R
SENSE
, but is “chopped” between the
P-channel and Schottky diode. The MOSFET R
DS(ON)
multiplied by the P-channel duty cycle can be summed
with the resistances of L and R
SENSE
to obtain I
2
R
losses. For example, if R
DS(ON)
= 0.1, R
L
= 0.15,
and R
SENSE
= 0.05, then the total
resistance is 0.3
at V
IN
2V
OUT
. This results in losses ranging from 3%
to 10% as the output current increases from 0.5A to
2A. I
2
R losses cause the efficiency to roll off at high
output currents.
4. The Schottky diode is a major source of power loss at
high currents and gets worse at high input voltages.
The diode loss is calculated by multiplying the forward
voltage drop times the Schottky diode duty cycle
multiplied by the load current. For example, assuming
a duty cycle of 50% with a Schottky diode forward
voltage drop of 0.4V, the loss increases from 0.5% to
8% as the load current increases from 0.5A to 2A.
Figure 5 shows how the efficiency losses in a typical
LTC1147 series regulator end up being apportioned.
The gate charge loss is responsible for the majority of
the efficiency lost in the midcurrent region. If Burst
Mode
operation was not employed at low currents,
the gate charge loss alone would cause efficiency to
drop to unacceptable levels. With Burst Mode
opera-
tion, the DC supply current represents the lone (and
unavoidable) loss component which continues to
become a higher percentage as output current is
reduced. As expected, the I
2
R losses and Schottky
diode loss dominate at high load currents.
Figure 5. Efficiency Loss
OUTPUT CURRENT (A)
0.01
EFFICIENCY/LOSS (%)
90
95
1
LTC1147 • F05
85
80
0.03
0.1
0.3
3
100
GATE CHARGE
LTC1147 I
Q
I
2
R
SCHOTTKY
DIODE
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LTC1147-3.3
LTC1147-5/LTC1147L
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APPLICATIO S I FOR ATIO
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f
MIN
=
3.3
4.5
)
)
1 –
1
2.61µs
= 102kHz
P
P
=
3.3(0.125)(1A)
2
(1.27)
4.5
= 116mW
This last step is necessary to assure that the power
dissipation and junction temperature of the P-channel are
not exceeded.
Troubleshooting Hints
Since efficiency is critical to LTC1147 series applications,
it is very important to verify that the circuit is functioning
correctly in both continuous and Burst Mode
operation.
The waveform to monitor is the voltage on the timing
capacitor Pin 2.
In continuous mode (I
LOAD
> I
BURST
) the voltage on the C
T
pin should be a sawtooth with a 0.9V
P-P
swing. This
voltage should never dip below 2V as shown in Figure 6a.
When load currents are low (I
LOAD
< I
BURST
) Burst Mode
operation occurs. The voltage on the C
T
pin now falls to
ground for periods of time as shown in Figure 6b. During
this time the LTC1147 series are in sleep mode with the
quiescent current reduced to 160µA.
The inductor current should also be monitored. Look to
verify that the peak-to-peak ripple current in continuous
mode operation is approximately the same as in Burst
Mode
operation.
Other losses including C
IN
and C
OUT
ESR dissipative
losses, MOSFET switching losses, and inductor core losses,
generally account for less than 2% total additional loss.
Design Example
As a design example, assume V
IN
= 5V (nominal), V
OUT
=
3.3V, I
MAX
= 1A, and f = 130kHz; R
SENSE
, C
T
and L can
immediately be calculated:
R
SENSE
= 100mV/1A = 0.1
t
OFF
= (1/130kHz)[1 – (3.3/5)] = 2.61µs
C
T
= 2.61µs/(1.3)(10
4
) = 220pF
L = (5.1)(10
5
)(0.1)(220pF)(3.3V) = 33µH
Assume that the MOSFET dissipation is to be limited to
P
P
= 250mW.
If T
A
= 50°C and the thermal resistance of the MOSFET is
50°C/W, then the junction temperatures will be 63°C and
δ
P
= 0.007(63 – 25) = 0.27. The required R
DS(ON)
for the
MOSFET can now be calculated:
P-Ch R
DS(ON)
=
5(0.25)
3.3(1)
2
(1.27)
= 0.3
The P-channel requirement can be met by a Si9430DY.
Note that the most stringent requirement for the Schottky
diode is with V
OUT
= 0 (i.e., short circuit). During a
continuous short circuit, the worst-case Schottky diode
dissipation rises to:
P
D
= I
SC(AVG)
(V
D
)
With the 0.1 sense resistor I
SC(AVG)
= 1A will result,
increasing the 0.4V Schottky diode dissipation to 0.4W.
C
IN
will require an RMS current rating of at least 0.5A at
temperature, and C
OUT
will require an ESR of 0.1 for
optimum efficiency.
Now allow V
IN
to drop to its minimum value. At lower input
voltages the operating frequency will decrease and the
P-channel will be conducting most of the time, causing the
power dissipation to increase. At V
IN(MIN)
= 4.5V, the
frequency will decrease and the P-channel will be con-
ducting most of the time causing its power dissipation to
increase. At V
IN(MIN)
= 4.5V:
If Pin 2 is observed falling to ground at high output
currents, it indicates poor decoupling or improper ground-
ing. Refer to the Board Layout Checklist.
3.3V
0V
LTC1147 • F06
Figure 6b. Burst Mode Operation C
T
Waveform
3.3V
0V
Figure 6a. Continuous Mode Operation C
T
Waveform

LTC1147LCS8-3.3#TRPBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Voltage Regulators 3.3V LV Hi Eff Stepdn Reg
Lifecycle:
New from this manufacturer.
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