PDF: 09005aef818e3e75/Source: 09005aef818e3df5 Micron Technology, Inc., reserves the right to change products or specifications without notice.
htf5c32x72k.fm - Rev. B 2/07 EN
14 ©2005 Micron Technology, Inc. All rights reserved.
256MB: (x72, SR) 244-Pin DDR2 Mini-RDIMM
Serial Presence-Detect
Notes: 1. The
t
RC SPD values shown are JEDEC DDR2 device specification values. The actual Micron
DDR2 device specification is
t
RC = 55ns for all speed grades.
32
Address and command setup time,
t
IS
b
-667
-53E
-40E
20
25
35
33
Address and command hold time,
t
IH
b
-667
-53E
-40E
27
37
47
34
Data/data mask input setup time,
t
DS
b
-667/-53E
-40E
10
15
35
Data/data mask input hold time,
t
DH
b
-667
-53E
-40E
17
22
27
36
Write recovery time,
t
WR
3C
37
WRITE-to-READ command delay,
t
WTR
-667/-53E
-40E
1E
28
38
READ-to-PRECHARGE command delay,
t
RTP
1E
39
Memory analysis probe
00
40
Extension for bytes 41 and 42
00
41
MIN active-to-active/refresh time,
t
RC
1
-667/-53E
-40E
3C
37
42
MIN AUTO REFRESH-to-ACTIVE/AUTO REFRESH command period,
t
RFC
69
43
SDRAM device MAX cycle time,
t
CK (MAX)
80
44
SDRAM device MAX DQS–DQ skew time,
t
DQSQ
-667
-53E
-40E
18
1E
23
45
SDRAM device MAX read data hold skew factor,
t
QHS
-667
-53E
-40E
22
28
2D
46
PLL relock time
0F
47–61
Optional features, not supported
00
62
SPD revision
Release 1.2 12
63
Checksum for bytes 0–62
ECC/ECC and parity
-667
-53E
-40E
7E/82
29/2D
90/94
64
Manufacturer’s JEDEC ID code
MICRON 2C
65–71
Manufacturer’s JEDEC ID code
(continued) FF
72
Manufacturing location
1–12 01–0C
73–90
Module part number (ASCII)
– Variable data
91
PCB identification code
1–9 01–09
92
Identification code (continued)
000
93
Year of manufacture in BCD
– Variable data
94
Week of manufacture in BCD
– Variable data
95–98
Module serial number
– Variable data
99–127
Reserved for manufacturer-specific data
00
128–255
Reserved for customer-specific data
FF
Table 14: Serial Presence-Detect Matrix (continued)
Byte Description Entry (Version) 256MB