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FC30

P1-P3P4-P6P7-P9P10-P12P13-P13
Application hints FC30
10/13 Doc ID 14752 Rev 2
5 Application hints
Figure 6. FC30 electrical connection for 3D orientation detection
The diagram above refers to the electrical connection scheme for application of 3D
orientation detection.
The device core is supplied through the Vdd line while the I/O pads are supplied through the
Vdd_IO line. Power supply decoupling capacitors (100 nF ceramic, 10 µF Al) should be
placed as near as possible to pin 6 of the device (common design practice).
All the voltage and ground supplies must be present at the same time for proper behavior of
the IC (Figure 6).
5.1 Soldering information
The LGA package is compliant with the ECOPACK, RoHS and “green” standards. Leave the
pin 1 indicator unconnected during soldering. Land pattern and soldering recommendations
are available at www.st.com
6
8
13
1
Top VIEW
10uF
Vdd
100nF
GND
Vdd_IO
SIGN
PC
LC
Digital signal from/to signal controller.Signal’s levels are defined by proper selection of Vdd_IO
1
13
8
6
TOP VIEW
Land
Face
Port
PD
FC30 Package information
Doc ID 14752 Rev 2 11/13
6 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com. ECOPACK
is an ST trademark.
Figure 7. LGA-14: mechanical data and package dimensions
OUTLINE AND
MECHANICAL DATA
DIM.
mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A1 0.920 1.000 0.0362 0.0394
A2 0.700 0.0275
A3 0.180 0.220 0.260 0.0071 0.0087 0.0102
D1 2.850 3.000 3.150 0.1122 0.1181 0.1240
E1 4.850 5.000 5.150 0.1909 0.1968 0.2027
e0.800 0.0315
d0.300 0.0118
L1 4.000 0.1575
N1.360 0.0535
N1 1.200 0.0472
P1 0.965 0.975 0.9850.0380 0.03840.0386
P2 0.640 0.650 0.660 0.0252 0.0256 0.0260
T1 0.750 0.800 0.850 0.0295 0.0315 0.0335
T2 0.450 0.500 0.550 0.0177 0.0197 0.0217
R 1.200 1.600 0.0472 0.0630
h 0.150 0.0059
k 0.050 0.0020
i 0.100 0.0039
s 0.100 0.0039
LGA-14 (3x5x0.92mm) Pitch 0.8mm
Land Grid Array Package
7773587 C
Revision history FC30
12/13 Doc ID 14752 Rev 2
7 Revision history
Table 5. Document revision history
Date Revision Changes
29-May-2008 1 Initial release
10-Feb-2010 2 Updated Table 2: Pin description.
P1-P3P4-P6P7-P9P10-P12P13-P13

FC30

Mfr. #:
Buy FC30
Manufacturer:
STMicroelectronics
Description:
Accelerometers 3D Detection Device MEMS
Lifecycle:
New from this manufacturer.
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