SpecNo.JELF243B-9118B-01 P.10 / 11
MURATA MFG.CO., LTD
Reference
Only
(3)
Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
9.8 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance
phenomenon at the mounted products and P.C.B.
Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 min max.
(3) Cleaner
1. Alcohol type cleaner
Isopropyl alcohol (IPA)
2. Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent,
products shall be dried completely after rinse with de-ionized water in order to remove the cleaner.
(5) Other cleaning Please contact us.
9.9 Resin coating
The inductance value may change and/or it may affect on the product's performance due to high
cure-stress of resin to be used for coating / molding products. So please pay your careful attention when
you select resin.
In prior to use, please make the reliability evaluation with the product mounted in your application set.
9.10 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or
twisting to the substrate when cropping the substrate, inserting and removing a connector from the
substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
9.11 Storage and Handling Requirements
(1) Storage period
Use the products within 6 months after deliverd.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
・Products should be stored in the warehouse on the following conditions.
Temperature: -10°C to 40°C
Humidity: 15% to 85% relative humidity No rapid change on temperature and humidity
Don't keep products in corrosive gases such as sulfur,chlorine gas or acid, or it may cause
oxidization of electrode, resulting in poor solderability.
・Products should be storaged on the palette for the prevention of the influence from humidity, dust and so on.
・Products should be storaged in the warehouse without heat shock, vibration, direct sunlight and so on.
・Products should be storaged under the airtight packaged condition.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
Screw Hole
Recommend
