LQG15WH13NJ02D Datasheet LQG15WH1N0S02D, LQG15WH13NJ02D, LQG15WH5N6C02D | P7-P9

SpecNo.JELF243B-9118B-01 P.7 / 11

MURATA MFG.CO., LTD

Reference

Onl

7.4 Peeling off force of cover tape

Speed of Peeling off 300mm/min

Peeling off force 0.1N to 0.6N

(minimum value is typical)

7.5 Dimensions of Leader-tape,Trailer and Reel

There shall be leader-tape ( top tape and empty tape) and trailer-tape (empty tape) as follows.

(in mm)

7.6 Marking for reel

Customer part number, MURATA part number, Inspection number(1) ,RoHS Marking(2),

Quantity etc ･･･

1) <Expression of Inspection No.>

□□ OOOO 

(1) (2) (3)

(1) Factory Code

(2) Date First digit : Year / Last digit of year

Second digit: Month / Jan. to Sep.  1 to 9, Oct. to Dec.  O, N, D

Third, Fourth digi : Day

(3) Serial No.

2) <Expression of RoHS Marking> ROHS – Y (△)

(1) (2)

(1)

RoHS regulation conformity parts.

(2) MURATA classification number

7.7 Marking for Outside package (corrugated paper box)

Customer name, Purchasing order number, Customer part number, MURATA part number,

RoHS Marking(2) ,Quantity, etc ･･･

7.8. Specification of Outer Case

Outer Case Dimensions

(mm)

Standard Reel Quantity

in Outer Case (Reel)

W D H

186 186 93 5



Above Outer Case size is typical. It depends on a quantity of an order.

8. △

Caution

8.1 Caution(Rating)

Do not exceed maximum rated current of the product. Thermal stress may be transmitted to the product and

short/open circuit of the product or falling off the product may be occurred.

8.2 Fail-safe

Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be

caused by the abnormal function or the failure of our product.

Empty tape

190 min.

Leader

Trailer

2.0±0.5



13.0±0.2



21.0±0.8



180



9.0

13.0±1.4

-3

Direction of feed

210 min.

160 min.

Top tape

-0

Label

165 to 180 degree

Cover tape

Base tape

SpecNo.JELF243B-9118B-01 P.8 / 11

MURATA MFG.CO., LTD

Reference

Onl

8.3 Limitation of Applications

Please contact us before using our products for the applications listed below which require especially high

reliability for the prevention of defects which might directly cause damage to the third party's life, body or

property.

(1) Aircraft equipment (6) Transportation equipment (trains, ships, etc.)

(2) Aerospace equipment

(7) Traffic signal equipment

(3) Undersea equipment

(8) Disaster prevention / crime prevention equipment

(4) Power plant control equipment

(9) Data-processing equipment

(5) Medical equipment

(10) Applications of similar complexity and /or reliability

requirements to the applications listed in the above

9. Notice

Products can only be soldered with reflow.

This product is designed for solder mounting.

Please consult us in advance for applying other mounting method such as conductive adhesive.

9.1 Land pattern designing

a 0.5

b 1.2

c 0.65

(in mm)

9.2 Flux, Solder

・Use rosin-based flux.

Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).

Don’t use water-soluble flux.

・Use Sn-3.0Ag-0.5Cu solder.

・Standard thickness of solder paste : 100μm to 150μm.

9.3 Reflow soldering conditions

・Inductance value may be changed a little due to the amount of solder.

So, the chip coil shall be soldered by reflow so that the solder volume can be controlled.

・Pre-heating should be in such a way that the temperature difference between solder and

product surface is limited to 150°C max. Cooling into solvent after soldering also should be in

such a way that the temperature difference is limited to 100°C max.

Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality.

・Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and / or resulting

in the deterioration of product quality.

・Reflow soldering profile

Standard Profile Limit Profile

Pre-heating 150°C～180°C 、90s±30s

Heating above 220°C､30s～60s above 230°C､60s max.

Peak temperature 245°C±3°C 260°C,10s

Cycle of reflow 2 times 2 times

Chip Coil

Land

Solder Resist

Limit Profile

Standard Profile

90s±30s

230℃

260℃

245℃±3℃

220℃

30s～60s

60s max.

180

150

Temp.

(s)

(℃)

Time.

SpecNo.JELF243B-9118B-01 P.9 / 11

MURATA MFG.CO., LTD

Reference

Onl

9.4 Reworking with soldering iron

The following conditions must be strictly followed when using a soldering iron.

Pre-heating 150°C,1 min

Tip temperature 350°C max.

Soldering iron output 80W max.

Tip diameter φ3mm max.

Soldering time 3(+1,-0)s

Time 2 times

Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the

crack on the products due to the thermal shock.

9.5 Solder Volume

・ Solder shall be used not to be exceed the upper limits as shown below.

・ Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.

Exceeding solder volume may cause the failure of mechanical or electrical performance.

1/3T≦t≦T

T：thickness of product

9.6 Mount Shock

Over Mechanical stress to products at mounting process causes crack and electrical failure etc.

9.7 Product’s location

The following shall be considered when designing and laying out P.C.B.'s.

(1) P.C.B. shall be designed so that products are not subjected to the mechanical stress due to

warping the board.

［Products direction］

Products shall be located in the sideways

direction (Length:a＜b) to the mechanical

stress.

(2) Components location on P.C.B. separation.

It is effective to implement the following measures, to reduce stress in separating the board.

It is best to implement all of the following three measures; however, implement as many measures as possible

to reduce stress.

Contents of Measures Stress Level

(1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1

(2) Add slits in the board separation part. A > B

(3) Keep the mounting position of the component away from the board separation surface. A > C

*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.

If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.

Upper Limit

Recommendable

〈

Poor example

〉

〈

Good example

〉

Perforation

Slit

P1-P3 P4-P6 P7-P9 P10-P11

LQG15WH13NJ02D

Mfr. #:

Buy LQG15WH13NJ02D

Manufacturer:

Murata Electronics

Description:

Fixed Inductors 0402 13nH 5% 400mA 0.26ohms 2.8GHz

Lifecycle:

New from this manufacturer.

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LQG15WH13NJ02D

LQG15WH13NJ02D

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