NXP Semiconductors
PCA9624
8-bit Fm+ I
2
C-bus 100 mA 40 V LED driver
© NXP Semiconductors N.V. 2016. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 18 January 2016
Document identifier: PCA9624
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
24. Contents
1 General description . . . . . . . . . . . . . . . . . . . . . . 1
2 Features and benefits . . . . . . . . . . . . . . . . . . . . 2
3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
4 Ordering information. . . . . . . . . . . . . . . . . . . . . 3
4.1 Ordering options. . . . . . . . . . . . . . . . . . . . . . . . 3
5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 5
6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
7 Functional description . . . . . . . . . . . . . . . . . . . 6
7.1 Device addresses . . . . . . . . . . . . . . . . . . . . . . . 6
7.1.1 Regular I
2
C-bus slave address. . . . . . . . . . . . . 6
7.1.2 LED All Call I
2
C-bus address . . . . . . . . . . . . . . 7
7.1.3 LED Sub Call I
2
C-bus addresses . . . . . . . . . . . 7
7.1.4 Software Reset I
2
C-bus address . . . . . . . . . . . 7
7.2 Control register. . . . . . . . . . . . . . . . . . . . . . . . . 8
7.3 Register definitions. . . . . . . . . . . . . . . . . . . . . . 9
7.3.1 Mode register 1, MODE1 . . . . . . . . . . . . . . . . 10
7.3.2 Mode register 2, MODE2 . . . . . . . . . . . . . . . . 10
7.3.3 PWM0 to PWM7, individual brightness
control. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
7.3.4 GRPPWM, group duty cycle control . . . . . . . . 11
7.3.5 GRPFREQ, group frequency . . . . . . . . . . . . . 12
7.3.6 LEDOUT0 and LEDOUT1, LED driver output
state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
7.3.7 SUBADR1 to SUBADR3, I
2
C-bus subaddress
1 to 3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
7.3.8 ALLCALLADR, LED All Call I
2
C-bus address. 13
7.4 Active LOW output enable input . . . . . . . . . . . 14
7.5 Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . 14
7.6 Software reset. . . . . . . . . . . . . . . . . . . . . . . . . 14
7.7 Individual brightness control with group
dimming/blinking. . . . . . . . . . . . . . . . . . . . . . . 15
8 Characteristics of the I
2
C-bus . . . . . . . . . . . . 16
8.1 Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
8.1.1 START and STOP conditions . . . . . . . . . . . . . 16
8.2 System configuration . . . . . . . . . . . . . . . . . . . 16
8.3 Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . 17
9 Bus transactions . . . . . . . . . . . . . . . . . . . . . . . 18
10 Application design-in information . . . . . . . . . 20
10.1 Junction temperature calculation . . . . . . . . . . 21
10.1.1 Example 1: T
j
calculation of PCA9624DR, in
TSSOP24 package, when T
amb
is known . . . . 22
10.1.2 Example 2: T
j
calculation where only T
case
is
known . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
11 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 23
12 Thermal characteristics . . . . . . . . . . . . . . . . . 24
13 Static characteristics . . . . . . . . . . . . . . . . . . . 25
14 Dynamic characteristics. . . . . . . . . . . . . . . . . 27
15 Test information . . . . . . . . . . . . . . . . . . . . . . . 29
16 Package outline. . . . . . . . . . . . . . . . . . . . . . . . 30
17 Handling information . . . . . . . . . . . . . . . . . . . 32
18 Soldering of SMD packages. . . . . . . . . . . . . . 32
18.1 Introduction to soldering. . . . . . . . . . . . . . . . . 32
18.2 Wave and reflow soldering. . . . . . . . . . . . . . . 32
18.3 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . 32
18.4 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . 33
19 Soldering: PCB footprints . . . . . . . . . . . . . . . 35
20 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 37
21 Revision history . . . . . . . . . . . . . . . . . . . . . . . 37
22 Legal information . . . . . . . . . . . . . . . . . . . . . . 38
22.1 Data sheet status. . . . . . . . . . . . . . . . . . . . . . 38
22.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
22.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 38
22.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 39
23 Contact information . . . . . . . . . . . . . . . . . . . . 39
24 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
