PCA9624 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet Rev. 4.1 — 18 January 2016 22 of 40
NXP Semiconductors
PCA9624
8-bit Fm+ I
2
C-bus 100 mA 40 V LED driver
10.1.1 Example 1: T
j
calculation of PCA9624DR, in TSSOP24 package, when T
amb
is known
R
th(j-a)
= 108 C/W
T
amb
= 50 C
LED output low voltage (LED V
OL
) = 0.5 V
LED output current per channel = 80 mA
Number of outputs = 8
I
DD(max)
= 10 mA
V
DD(max)
= 5.5 V
I
2
C-bus clock (SCL) maximum sink current = 25 mA
I
2
C-bus data (SDA) maximum sink current = 25 mA
1. Find P
tot
(device total power dissipation):
output total power = 80 mA 8 0.5 V = 320 mW
chip core power consumption = 10 mA 5.5 V = 55 mW
SCL power dissipation = 25 mA 0.4 V = 10 mW
SDA power dissipation = 25 mA 0.4 V = 10 mW
P
tot
= (320 + 55 + 10 + 10) mW = 395 mW
2. Find T
j
(junction temperature):
T
j
= (T
amb
+R
th(j-a)
P
tot
) = (50 C + 108 C/W 395 mW) = 92.7 C
10.1.2 Example 2: T
j
calculation where only T
case
is known
This example uses a customer’s specific application of the PCA9624PW, 8-channel LED
controller in the TSSOP24 package, where only the case temperature (T
case
) is known.
T
j
= T
case
+ R
th(j-c)
P
tot
, where:
R
th(j-c)
= 30 C/W
T
case
(measured) = 94.6 C
V
OL
of LED ~ 0.5 V
I
DD(max)
= 10 mA
V
DD(max)
= 5.5 V
LED output voltage LOW = 0.5 V
LED output current:
60 mA on 1 port = (60 mA 1)
50 mA on 6 ports = (50 mA 6)
40 mA on 1 port = (40 mA 1)
I
2
C-bus maximum sink current on clock line = 25 mA
I
2
C-bus maximum sink current on data line = 25 mA
PCA9624 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet Rev. 4.1 — 18 January 2016 23 of 40
NXP Semiconductors
PCA9624
8-bit Fm+ I
2
C-bus 100 mA 40 V LED driver
1. Find P
tot
(device total power dissipation)
output current (60 mA 1 port); output power (60 mA 1 0.5 V) = 30 mW
output current (50 mA 6 ports); output power (50 mA 6 0.5 V) = 150 mW
output current (40 mA 1 port); output power (40 mA 1 0.5 V) = 20 mW
Output total power = 200 mW
chip core power consumption = 10 mA 5.5 V = 55 mW
SCL power dissipation = 25 mA 0.4 V = 10 mW
SDA power dissipation = 25 mA 0.4 V = 10 mW
P
tot
(device total power dissipation) = 275 mW
2. Find T
j
(junction temperature):
T
j
= T
case
+ R
th(j-a)
P
tot
= 94.6 C + 30 C/W 275 mW = 102.85 C
11. Limiting values
[1] Each bit must be limited to a maximum of 100 mA and the total package limited to 800 mA due to internal
busing limits. The pull-up (current limiting) resistor must be of sufficient size (W) and value () to guarantee
that the 100 mA limit is not exceeded on any output.
[2] Refer to Section 10.1
for calculation.
Table 14. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
DD
supply voltage 0.5 +6.0 V
V
I/O
voltage on an input/output pin V
SS
0.5 5.5 V
V
drv(LED)
LED driver voltage V
SS
0.5 40 V
I
O(LEDn)
output current on pin LEDn - 100 mA
I
OL(tot)
total LOW-level output current LED driver outputs;
V
OL
=0.5V
[1]
800 - mA
I
SS
ground supply current per V
SS
pin - 800 mA
P
tot
total power dissipation T
amb
=25C-1.8W
T
amb
=85C - 0.72 W
P/ch power dissipation per channel T
amb
=25C-100mW
T
amb
=85C-45mW
T
j
junction temperature
[2]
- +125 C
T
stg
storage temperature 65 +150 C
T
amb
ambient temperature operating 40 +85 C
PCA9624 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet Rev. 4.1 — 18 January 2016 24 of 40
NXP Semiconductors
PCA9624
8-bit Fm+ I
2
C-bus 100 mA 40 V LED driver
[1] This value signifies package’s ability to handle more than 100 mA per output driver. The device’s maximum
current rating per output is 100 mA.
12. Thermal characteristics
[1] Calculated in accordance with JESD 51-7.
Table 15. TSSOP24 versus HVQFN24 power dissipation and output current capability
Measurement TSSOP24 HVQFN24
T
amb
= 25 C
maximum power
dissipation
(chip + output drivers)
926 mW 2220 mW
maximum power
dissipation
(output drivers only)
851 mW 2150 mW
maximum drive current
per channel
[1] [1]
T
amb
= 60 C
maximum power
dissipation
(chip + output drivers)
602 mW 1440 mW
maximum power
dissipation
(output drivers only)
527 mW 1365 mW
maximum drive current
per channel
[1] [1]
T
amb
= 80 C
maximum power
dissipation
(chip + output drivers)
417 mW 1000 mW
maximum power
dissipation
(output drivers only)
342 mW 925 mW
maximum drive current
per channel
[1]
851 mW
8-bit 0.5 V
--------------------------------
212.75 mA=
2150 mW
8-bit 0.5 V
--------------------------------
537.5 mA=
527 mW
8-bit 0.5 V
--------------------------------
131.8 mA=
1365 mW
8-bit 0.5 V
--------------------------------
341.25 mA=
342 mW
8-bit 0.5 V
--------------------------------
85.5 mA=
925 mW
8-bit 0.5 V
--------------------------------
231.3 mA=
Table 16. Thermal characteristics
Symbol Parameter Conditions Typ Unit
R
th(j-a)
thermal resistance from junction to ambient TSSOP24
[1]
108 C/W
HVQFN24
[1]
45 C/W
R
th(j-c)
thermal resistance from junction to case TSSOP24
[1]
30 C/W
HVQFN24
[1]
19.6 C/W

PCA9624PW,118

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
LED Lighting Drivers 100 mA 40 V LED Driver
Lifecycle:
New from this manufacturer.
Delivery:
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