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PMZB550UNEYL

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P16
NXP Semiconductors
PMZB550UNE
30 V, N-channel Trench MOSFET
PMZB550UNE All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved
Product data sheet 25 March 2015 9 / 15
Q
G
(nC)
0 0.80.60.2 0.4
aaa-017185
2
3
1
4
5
V
GS
(V)
0
I
D
= 0.6 A; V
DS
= 15 V; T
amb
= 25 °C
Fig. 15. Gate-source voltage as a function of gate
charge; typical values
003aaa508
V
GS
V
GS(th)
Q
GS1
Q
GS2
Q
GD
V
DS
Q
G(tot)
I
D
Q
GS
V
GS(pl)
Fig. 16. Gate charge waveform definitions
V
SD
(V)
0 1.61.20.4 0.8
aaa-017186
1.0
0.5
1.5
2.0
I
S
(A)
0
T
j
= 150 °C
T
j
= 25 °C
V
GS
= 0 V
Fig. 17. Source current as a function of source-drain voltage; typical values
11. Test information
t
1
t
2
P
t
006aaa812
duty cycle δ =
t
1
t
2
Fig. 18. Duty cycle definition
NXP Semiconductors
PMZB550UNE
30 V, N-channel Trench MOSFET
PMZB550UNE All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved
Product data sheet 25 March 2015 10 / 15
12. Package outline
References
Outline
version
European
projection
Issue date
IEC JEDEC JEITA
SOT883B
sot883b_po
11-11-02
12-01-03
Unit
mm
max
nom
min
0.40
0.37
0.34
0.04 0.55
0.50
0.47
0.65
0.60
0.55
1.05
1.00
0.95
0.65
0.30
0.25
0.22
A
(1)
Dimensions
Note
1. Including plating thickness
Leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.37 mm SOT883B
A
1
b
0.20
0.15
0.12
b
1
D E e
0.35
e
1
L
0.30
0.25
0.22
L
1
scale
L (2x)
E
2
3
1
b (2x)
b
1
A
1
A
D
L
1
0 0.5 1 mm
e
1
e
Fig. 19. Package outline DFN1006B-3 (SOT883B)
NXP Semiconductors
PMZB550UNE
30 V, N-channel Trench MOSFET
PMZB550UNE All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved
Product data sheet 25 March 2015 11 / 15
13. Soldering
1.3
0.3
0.6
0.7
0.4
0.9
0.3
(2x)
0.4
(2x)
0.25
(2x)
R0.05 (8x)
0.7
Footprint information for reflow soldering SOT883B
sot883b_fr
occupied area
solder land
solder resist
solder land plus solder paste
solder paste deposit
Dimensions in mm
Fig. 20. Reflow soldering footprint for DFN1006B-3 (SOT883B)
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P16

PMZB550UNEYL

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Manufacturer:
Nexperia
Description:
MOSFET 30V N-Channel Trench MOSFET
Lifecycle:
New from this manufacturer.
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