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VND830MSP-E

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P28
Package and PCB thermal data VND830MSP-E
22/28 Doc ID 10903 Rev 4
Figure 29. PowerSO-10 thermal impedance junction ambient single pulse
Equation 1
:
pulse calculation formula
Figure 30. Thermal fitting model of a double channel HSD in PowerSO-10
0.1
1
10
100
1000
0.0001 0.001 0.01 0.1 1 10 100 1000
Time (s)
ZTH (°C/W)
0.5 cm
2
6 cm
2
Z
THδ
R
TH
δ Z
THtp
1 δ–()+⋅=
where
δ t
p
T⁄=
T_amb
Pd1
C1
R4
C3 C4
R3R1 R6R5R2
C5 C6C2
Pd2
R2
C1 C2
R1
Tj_1
Tj_2
VND830MSP-E Package and PCB thermal data
Doc ID 10903 Rev 4 23/28
Table 16. Thermal parameter
Area/island (cm
2
)0.56
R1 (°C/ W) 0.15
R2 (°C/ W) 0.8
R3 (°C/ W) 0.7
R4 (°C/ W) 0.8
R5 (°C/ W) 12
R6 (°C/ W) 37 22
C1 (W.s/ °C) 0.0006
C2 (W.s /°C) 2.10E-03
C3 (W.s/ °C) 0.013
C4 (W.s/ °C) 0.3
C5 (W.s/ °C) 0.75
C6 (W.s/ °C) 3 5
Package and packing information VND830MSP-E
24/28 Doc ID 10903 Rev 4
5 Package and packing information
5.1 ECOPACK
®
packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
is an ST trademark.
5.2 PowerSO-10 mechanical data
Figure 31. PowerSO-10 package dimensions
DETAIL "A"
PLANE
SEATING
α
L
A1
F
A1
h
A
D
D1
= =
= =
E4
0.10 A
E
C
A
B
B
DETAIL "A"
SEATING
PLANE
E2
10
1
eB
HE
0.25
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P28

VND830MSP-E

Mfr. #:
Buy VND830MSP-E
Manufacturer:
STMicroelectronics
Description:
Gate Drivers Double Ch High Side
Lifecycle:
New from this manufacturer.
Delivery:
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