IC Sockets XR2 F-11
■ Tools and Accessories
■ Precautions
XR2Z-11
IC Holder (made from PBT)
XR2Z-13
Note: Order the following models in multiples of the minimum order.
Model No. of IC Socket contacts IC socket width Order in multiples of
XR2Z-11 14, 16, 18, 20, 24 7.62 m 100
XR2Z-13 24, 28, 32, 40, 42, 48 15.24 mm 500
Note: This Holder protects the IC
from falling out due to shock.
The IC will not fall out even
with a 980 m/s
2
shock. Appli-
cable IC height: 2.7 to 5.6 mm.
XY2C-0101
XY2C-0103
IC Removal Tool
Model No. of IC Socket contacts IC socket width
XY2C-0101 14, 16, 18, 20 7.62 m
XY2C-0103 24, 28, 32, 40 15.24 mm
Correct Use
Soldering
• When soldering, make sure that the outer
sleeve of the IC Socket does not stick out
of the circuit board through-holes.
• Make sure that no flux enters the IC
Socket from the top.
Removing ICs
• Use the XY2C-0101 or XY2C-0103 IC
Removal Tool to remove ICs.
• Do not use a screwdriver to remove the
IC. It may damage the circuit board.
• Do not use a testing rod or check pin to
check contacts or circuits. This may dam-
age the inner clips or plating and may
lead to improper contact.
• Four-point contact construction is used for
plated products to make them more toler-
ant of momentary power interruptions.
We recommend using gold-plated con-
tacts in areas subject to vibration and
shock.
Automated Soldering
Conditions (Jet Flow)
1. Soldering temperature: 250±5°C
2. Continuous soldering time: Within 5 s
Applicable IC Lead
Dimensions
1. Use leads that are within the range
shown here. For details, refer to page F-
1. Use an IC with leads longer than 3
mm. If the leads are too long, the IC will
not sit flush on the board.
2. Use an IC with tapered leads for easy
insertion, a minimum amount of bend-
ing, and minimum damage to the leads.
NG
OK
OK
