ComLink™ Series
CY2DL814
Document #: 38-07057 Rev. *B Page 7 of 8
© Cypress Semiconductor Corporation, 2005. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
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Package Drawing and Dimensions
ComLink is a trademark of Cypress Semiconductor Corporation. All product and company names mentioned in this document
are the trademarks of their respective holders.
PIN 1 ID
0°~8°
16
ea
150
18
916
SEATING PLANE
0.230[5.842]
0.244[6.197]
0.157[3.987]
0.150[3.810]
0.386[9.804]
0.393[9.982]
0.050[1.270]
BSC
0.061[1.549]
0.068[1.727]
0.004[0.102]
0.0098[0.249]
0.0138[0.350]
0.0192[0.487]
0.016[0.406]
0.035[0.889]
0.0075[0.190]
0.0098[0.249]
DIMENSIONS IN INCHES[MM] MIN.
MAX.
0.016[0.406]
0.010[0.254]
X 45°
0.004[0.102]
REFERENCE JEDEC MS-012
PART #
S16.15 STANDARD PKG.
SZ16.15 LEAD FREE PKG.
PACKAGE WEIGHT 0.15gms
16-Lead (150-Mil) SOIC S16.15
51-85068-*B
4.90[0.193]
1.10[0.043] MAX.
0.65[0.025]
0.20[0.008]
0.05[0.002]
16
PIN1ID
6.50[0.256]
SEATING
PLANE
1
0.076[0.003]
6.25[0.246]
4.50[0.177]
4.30[0.169]
BSC.
5.10[0.200]
0.15[0.006]
0.19[0.007]
0.30[0.012]
0.09[[0.003]
BSC
0.25[0.010]
0°-8°
0.70[0.027]
0.50[0.020]
0.95[0.037]
0.85[0.033]
PLANE
GAUGE
DIMENSIONS IN MM[INCHES] MIN.
MAX.
REFERENCE JEDEC MO-153
PACKAGE WEIGHT 0.05 gms
PART #
Z16.173 STANDARD PKG.
ZZ16.173 LEAD FREE PKG.
16-lead TSSOP 4.40 mm Body Z16.173
51-85091-*A
