AX8052F143
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40
Using an External VCO
Figure 21. Typical Application Diagram with External VCO
VCTRL
OUTP
OUTN
EN
VCO
VDD_ANA
GND
ANTP
ANTN
ANTP1
GND
VDD_ANA
CLK16P
CLK16N
TST1
TST2
VDD_IO
PA5
PA4
GND
RESET_N
DBG_EN
PB7
PB6
PB5
PB4
FILT
L2
L1
SYSCLK
PC3
PC2
PC4
GND
PB3
PA3
PA2
PA1
PA0
VDD_IO
PC1
PC0
PB0
PB2
PB1
AX8052F143
AX8052F143
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41
Using a TCXO
Figure 22. Typical Application Diagram with a TCXO
TCXO
C1_TCXO
C2_TCXO
EN_TCXO
VDD_ANA
GND
ANTP
ANTN
ANTP1
GND
VDD_ANA
CLK16P
CLK16N
TST1
TST2
VDD_IO
PA5
PA4
GND
RESET_N
DBG_EN
PB7
PB6
PB5
PB4
FILT
L2
L1
SYSCLK
PC3
PC2
PC4
GND
PB3
PA3
PA2
PA1
PA0
VDD_IO
PC1
PC0
PB0
PB2
PB1
AX8052F143
PB2
PB2
NOTE: For detailed TCXO network recommendations depending on TCXO output swing refer to the AX5043
Application Note: Use with a TCXO Reference Clock.
AX8052F143
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42
QFN40 PACKAGE INFORMATION
Package Outline QFN40 5 x 7 mm
Figure 23. Package Outline QFN40 5 x 7 mm
NOTES:
1. ‘e’ represents the basic terminal pitch
2. Datum ‘C’ is the mounting surface with which the package is in contact.
3. ‘3’ specifies the vertical shift of the flat part of each terminal from the mounting surface.
4. Dimension ‘A’ includes package warpage.
5. Dimension ‘b’ applies to the metallised terminal and is measured between 0.15 to 0.30 mm from the terminal tip. If the terminal
has the optional radius on the other end of the terminal, the dimension ‘b’ should not be measured in the radius are
6. Package dimension take reference from JEDEC MO220
7. AWLYYWW is the packaging lot code
8. V is the device version
9. RoHS
AX8052F143V
AWLYYWW
ON

AX8052F143-3-TB05

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
IC RF TXRX+MCU ISM<1GHZ 40VFQFN
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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