DATA SHEET
SE2613T: 2.4 GHz Wireless LAN/BT Front-End
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
202406A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • September 24, 2012 9
Recommended PCB Footprint and Solder pattern
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6 7 8
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6 7 8
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6 7 8
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2 11
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Figure 5: PCB Footprint and Solder pattern
Package Handling Information
Because of its sensitivity to moisture absorption, instructions on the shipping container label must be followed regarding
exposure to moisture after the container seal is broken, otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder assembly. The SE2613T is capable of withstanding a Pb free
solder reflow. Care must be taken when attaching this product, whether it is done manually or in a production solder reflow
environment. If the part is manually attached, precaution should be taken to insure that the device is not subjected to
temperatures above its rated peak temperature for an extended period of time. For details on both attachment techniques,
precautions, and handling procedures recommended, please refer to:
“QFN solder reflow and rework information application note”, Document Number QAD-00045
“Handling, packing, shipping and use of moisture sensitive QFN application note”, Document Number QAD-
00044
