12
RT8106/A
www.richtek.com
DS8106/A-04 April 2011
Users can connect capacitors in parallel to get calculated
ESR.
Input Capacitor
The selection of input capacitor is mainly based on its
maximum ripple current capability. The buck converter
draws pulsewise current from the input capacitor during
the on time of the S1 as shown in Figure 6. The RMS
value of ripple current flowing through the input capacitor
is described as :
(A) D)D(1IIrms
OUT
−=
(6)
The input capacitor must be cable of handling this ripple
current. Sometime, for higher efficiency, the low ESR
capacitor is necessary.
PCB Layout Considerations
MOSFETs switch very fast and efficiently. The current
transition speed between different derices causes voltage
spikes across the interconnecting impedances and
parasitic circuit elements. The voltage spikes can degrade
efficiency and radiate noise that results in over-voltage
stress on devices. Careful component placement layout
and printed circuit design can minimize the voltage spikes
induced in the converter. For example, during the period
of upper MOSFETs turn-off transition, the upper MOSFET
was carrying the full load current. During turn-off, current
stops flowing in the upper MOSFET and is picked up by
the low side MOSFET or schottky diode. Any inductance
in the switched current path generates a large voltage
spike during the switching interval. Careful component
selections, layout of the critical components, and use
shorter and wider PCB traces help in minimizing the
magnitude of voltage spikes. The RT8106/A DC-DC
converter integrates two sets of critical components just
as follows. The switching power components are most
critical because they switch large amounts of energy, and
as such, they tend to generate equally large amounts of
noise. The critical small signal components are those
connected to sensitive nodes or those supplying critical
bypass current.
For the proper layout of the RT8106/A the power
components and the PWM controller should be placed
firstly. And than place the input capacitors, especially the
high-frequency ceramic decoupling capacitors, close to
the power switches. Place the output inductor and output
capacitors between the MOSFETs and the load. Also
locate the PWM controller near by the MOSFETs. A multi-
layer printed circuit board is recommended. Figure 8
shows the connections of the critical components in the
converter.
Note that the capacitors C
IN
and C
OUT
each of them
represents numerous physical capacitors. Use a dedicated
grounding plane and use vias to ground all critical
components to this layer. Apply another solid layer as a
power plane and cut this plane into smaller islands of
common voltage levels. The power plane should support
the input power and output power nodes. Use copper filled
polygons on the top and bottom circuit layers for the LX
node, but it is not necessary to oversize this particular
island. Since the LX node is subjected to very high dV/dt
voltages, the stray capacitance formed between these
islands and the surrounding circuitry will tend to couple
switching noise. Use the remaining printed circuit layers
for small signal routing. The PCB traces between the PWM
controller and the gate of MOSFET and also the traces
connecting source of MOSFETs should be sized to carry
2A peak currents.
Figure 8. The Connections of the Critical Components in
the Converter
+
+
LOAD
+
VCC
GND
RT8106/A
FB
LGATE
UGATE
IL
IQ1
V
OUT
Q2
Q1
IQ2
5V/12V
GND