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LTC4312IMS#TRPBF

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P20
LTC4312
4
4312f
ELECTRICAL CHARACTERISTICS
The l denotes the specifi cations which apply over the full operating
temperature range, otherwise specifi cations are at T
A
= 25°C. V
CC
= V
CC2
= 3.3V unless otherwise noted.
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
I
LEAK
Input Leakage Current DISCEN = ENABLE1-2 = 5.5V
l
0.1 ±10 μA
I
ACC(IN, HL)
ACC High, Low Input Current V
CC
= 5V, V
ACC
= 5V, 0V
l
±23 ±40 μA
I
ACC(IN, Z)
Allowable Leakage Current in
Open State
V
CC
= 5V
l
±5 μA
I
ACC(EN, Z)
ACC High Z Input Current V
CC
= 5V
l
±5 μA
V
ACC(L, TH)
ACC Input Low Threshold
Voltages
V
CC
= 5V
l
0.2•V
CC
0.3•V
CC
0.4•V
CC
V
V
ACC(H,TH)
ACC Input High Threshold
Voltages
V
CC
= 5V
l
0.7•V
CC
0.8•V
CC
0.9•V
CC
V
Stuck Low Timeout Circuitry
t
TIMEOUT
Bus Stuck Low Timer SDAOUT or SCLOUT < 0.3•V
CC
l
35 45 55 ms
V
FAULT(OL)
FAULT Output Low Voltage I
FAULT
= 3mA
l
0.4 V
I
FAULT(OH)
FAULT Leakage Current
l
0.1 ±5 μA
I
2
C Interface Timing
f
SCL(MAX)
I
2
C Frequency Max (Note 6)
l
400 kHz
t
PDHL
SDA, SCL Fall Delay V
CC
= 3V to 5.5V, C
BUS
= 50pF, I
BUS
= 1mA (Note 6) 60 100 ns
t
f
SDA, SCL Fall Times V
CC
= 3V to 5.5V, C
BUS
= 50pF, I
BUS
= 1mA (Note 6) 10 ns
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: All currents into pins are positive and all voltages are referenced to
GND unless otherwise indicated.
Note 3: SDAIN, SCLIN pulled low.
Note 4: V
MIN
= minimum of V
CC
and V
CC2
if V
CC2
> 2.25V else V
MIN
= V
CC
.
Note 5: V
IL
is tested for the following (V
CC
, V
CC2
) combinations:
(2.9V, 5.5V), (5.5V, 2.25V), (3.3V, 3.3V) and (5V, 0V).
Note 6: Guaranteed by design and not tested.
Note 7: Measured in a special DC mode with V
SDA,SCL
= V
RTA(TH)
+ 1V.
The transient I
RTA
seen during rising edges when ACC is low will depend
on the bus loading condition and the slew rate of the bus. The LTC4312’s
internal slew rate control circuitry limits the maximum bus rise rate to
75V/μs by controlling the transient I
RTA
.
LTC4312
5
4312f
TYPICAL PERFORMANCE CHARACTERISTICS
Rise Time Accelerator Current
vs Temperature
Buffer High to Low Propagation
Delay vs Output Capacitance
Input to Output Offset Voltage
vs Bus Current for Different Driven
Input Voltage Levels
Output to Input Offset Voltage
vs Bus Current for Different
Driven Output Voltage Levels
I
CC
Enabled Current
vs Supply Voltage
I
CC
Disabled (ENABLE1-2 Low)
Current vs Supply Voltage
Multiplexer Switch Resistance
R
MUX
vs Temperature
T
A
= 25°C, V
CC
= 3.3V unless otherwise noted.
Buffer DC I
OL
vs Temperature
TEMPERATURE (°C)
–50
R
MUX
(Ω)
10
5
6
7
8
9
4
500
4312 G03
10025–25 75
V
CC2
= 3.3V
V
CC2
= 5V
I
DS
= 4mA
C
BUS
(pF)
0
t
PDF
(ns)
250
50
100
150
200
0
500
4312 G05
15001000
V
CC
= V
CC2
= V
DD, BUS
= 5V
R
BUS
= 2.7kΩ
V
CC
(V)
2
I
CC
(mA)
8.0
7.5
7.0
6.5
3
4312 G01
645
V
SDAIN, SCLIN
= 0V
V
CC
(V)
2
I
CC
(mA)
3.0
2.5
1.5
2.0
1.0
3
4312 G02
645
V
SDAIN, SCLIN
= 0V
TEMPERATURE (°C)
–50
I
OL
(mA)
10
5
6
7
8
9
4
500
4312 G04
12525–25 75 100
V
SDAIN,SCLIN
= 0.4V
V
SDAOUT,SCLOUT
= 0.4V
V
CC
= V
CC2
= 3.3V
I
BUS
(mA)
0
V
OS
(mV)
350
100
50
150
200
300
250
0
2
4312 G06
64
≥200mV
100mV
DRIVEN V
SDAIN,SCLIN
= 50mV
V
CC
= V
CC2
= V
DD, BUS
= 5V
I
BUS
(mA)
0
V
OS
(mV)
350
100
50
150
200
300
250
0
2
4312 G07
64
100mV
≥200mV
DRIVEN V
SDAOUT, SCLOUT
= 50mV
V
CC
= V
CC2
= V
DD, BUS
= 5V
t
RISE(30%–70%)
vs C
BUS
C
BUS
(pF)
0
t
RISE
(ns)
150
125
100
75
25
50
0
400
4312 G09
800200 600
5V
3.3V
V
CC
= V
CC2
= V
DD, BUS
ACC = 0V
TEMPERATURE (°C)
–50
I
RTA
(mA)
16
14
12
10
8
6
0
4312 G08
100–25 25 50 75
3.3V
V
CC
= V
CC2
= V
DD, BUS
V
SDA,SCL
tV
DD,BUS
ACC = 0V
C
BUS
= 400pF
R
BUS
= 10k
5V
LTC4312
6
4312f
PIN FUNCTIONS
ACC: Three-State Acceleration and Buffer Mode Selector.
This pin controls the turn on voltage of the rise time ac-
celerators and their current strength on both the input and
output sides. It also controls the turn-off voltage of the
buffers. See Table 1 in the Applications Information section.
DISCEN: Disconnect Stuck Bus Enable Input. When this
pin is high, stuck busses are automatically disconnected
and FAULT is pulled low after a timeout period of 45ms.
Up to sixteen clock pulses are subsequently applied to the
stuck output channels. When DISCEN pin is low, stuck
busses are neither disconnected nor clocked but FAULT
is pulled low. Connect to GND if unused.
ENABLE1-ENABLE2: Connection Enable Inputs. These
input pins enable or disable the corresponding output
channel. Driving an ENABLE pin low isolates SDAIN and
SCLIN from the corresponding SDAOUT and SCLOUT.
Only enable and disable a channel when all busses are
idle. During a bus stuck low fault condition, a falling edge
on all ENABLE pins followed by a rising edge on one or
more ENABLE pins forces a connection from SDAIN to
the selected SDAOUT and SCLIN to the selected SCLOUT.
Connect to GND if unused.
Exposed Pad (DFN Package Only): Exposed pad may be
left open or connected to device ground.
FAULT: Stuck Bus Fault Output. This open drain N-channel
MOSFET output pulls low if a simultaneous high on the
enabled SCLOUT and SDAOUT channels does not occur in
45ms. In normal operation FAULT is high. Connect a pull
up resistor, typically 10k, from this pin to the bus pull-up
supply. Leave open or tie to GND if unused.
GND: Device Ground.
SCLIN: Upstream Serial Bus Clock Input/Output. Connect
this pin to the SCL line on the upstream bus. Connect an
external pull-up resistor or current source between this
pin and the bus supply. Do not leave open.
SCLOUT1-SCLOUT2: Downstream Serial Bus Clock Input/
Output Channels 1-2. Connect pins SCLOUT1-SCLOUT2
to the SCL lines on the downstream channels 1-2, respec-
tively. When in use, an external pull-up resistor or current
source is required between the pin and the corresponding
bus supply. Leave open or tie to GND and connect the
corresponding ENABLE pin to GND, if unused.
SDAIN: Upstream Serial Bus Data Input/Output. Connect
this pin to the SDA line on the upstream bus. Connect an
external pull-up resistor or current source between this
pin and the bus supply. Do not leave open.
SDAOUT1-SDAOUT2: Downstream Serial Bus Data Input/
Output Channels 1-2. Connect pins SDAOUT1-SDAOUT2 to
the SDA lines on downstream channels 1-2, respectively.
When in use, an external pull-up resistor or current source
is required between the pin and the corresponding bus
supply. Leave open or tie to GND and connect the cor-
responding ENABLE pin to GND, if unused.
V
CC
: Power Supply Voltage. Power this pin from a sup-
ply between 2.9V and 5.5V. Bypass with at least 0.01μF
to GND.
V
CC2
: Output Side Rise Time Accelerator (RTA) Power
Supply Voltage. When powering V
CC2
, use a supply volt-
age ranging from 2.25V to 5.5V and bypass with at least
0.01μF to GND. If the downstream busses are powered
from multiple supply voltages, power V
CC2
from the low-
est supply voltage. Output side RTAs are active if V
CC2
≥
2.25V and ACC is low or open. Grounding V
CC2
disables
output side RTAs.
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LTC4312IMS#TRPBF

Mfr. #:
Buy LTC4312IMS#TRPBF
Manufacturer:
Analog Devices Inc.
Description:
Multiplexer Switch ICs Pin-Sel, 2-Ch, 2-Wire Multxer w/ Bus Buf
Lifecycle:
New from this manufacturer.
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