SI2305CDS-T1-GE3

Vishay Siliconix
Si2305CDS
Document Number: 64847
S10-0720-Rev. C, 29-Mar-10
www.vishay.com
1
P-Channel 8 V (D-S) MOSFET
FEATURES
Halogen-free According to IEC 61249-2-21
Definition
TrenchFET
®
Power MOSFET
100 % R
g
Tested
Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
Load Switch for Portable Devices
DC/DC Converter
PRODUCT SUMMARY
V
DS
(V) R
DS(on)
(Ω)
I
D
(A)
d
Q
g
(Typ.)
- 8
0.035 at V
GS
= - 4.5 V - 5.8
12 nC0.048 at V
GS
= - 2.5 V - 5.0
0.065 at V
GS
= - 1.8 V - 4.3
Ordering Information: Si2305CDS-T1-GE3 (Lead (Pb)-free and Halogen-free)
G
TO-236
(SOT-23)
S
D
Top View
2
3
1
* Marking Code
Si2305CDS (N5)*
S
G
D
P-Channel MOSFET
Notes:
a. Surface mounted on 1" x 1" FR4 board.
b. t = 5 s.
c. Maximum under steady state conditions is 175 °C/W.
d. T
C
= 25 °C.
ABSOLUTE MAXIMUM RATINGS T
A
= 25 °C, unless otherwise noted
Parameter Symbol Limit Unit
Drain-Source Voltage
V
DS
- 8
V
Gate-Source Voltage
V
GS
± 8
Continuous Drain Current (T
J
= 150 °C)
T
C
= 25 °C
I
D
- 5.8
A
T
C
= 70 °C
- 4.7
T
A
= 25 °C
- 4.4
a, b
T
A
= 70 °C
- 3.5
a, b
Pulsed Drain Current (10 µs Pulse Width)
I
DM
- 20
Continuous Source-Drain Diode Current
T
C
= 25 °C
I
S
- 1.4
T
A
= 25 °C
- 0.8
a, b
Maximum Power Dissipation
T
C
= 25 °C
P
D
1.7
W
T
C
= 70 °C
1.1
T
A
= 25 °C
0.96
a, b
T
A
= 70 °C
0.62
a, b
Operating Junction and Storage Temperature Range
T
J
, T
stg
- 55 to 150 °C
THERMAL RESISTANCE RATINGS
Parameter Symbol Typical Maximum Unit
Maximum Junction-to-Ambient
a, c
t 5 s
R
thJA
100 130
°C/W
Maximum Junction-to-Foot (Drain) Steady State
R
thJF
60 75
www.vishay.com
2
Document Number: 64847
S10-0720-Rev. C, 29-Mar-10
Vishay Siliconix
Si2305CDS
Notes:
a. Pulse test; pulse width 300 µs, duty cycle 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
SPECIFICATIONS T
J
= 25 °C, unless otherwise noted
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Static
Drain-Source Breakdown Voltage
V
DS
V
GS
= 0 V, I
D
= - 250 µA
- 8 V
V
DS
Temperature Coefficient ΔV
DS
/T
J
I
D
= - 250 µA
- 9
mV/°C
V
GS(th)
Temperature Coefficient ΔV
GS(th)
/T
J
2.5
Gate-Source Threshold Voltage
V
GS(th)
V
DS
= V
GS
, I
D
= - 250 µA
- 0.4 - 1 V
Gate-Source Leakage
I
GSS
V
DS
= 0 V, V
GS
= ± 8 V
± 100 nA
Zero Gate Voltage Drain Current
I
DSS
V
DS
= - 8 V, V
GS
= 0 V
- 1
µA
V
DS
= - 8 V, V
GS
= 0 V, T
J
= 55 °C
- 10
On-State Drain Current
a
I
D(on)
V
DS
- 5 V, V
GS
= - 4.5 V
- 10 A
Drain-Source On-State Resistance
a
R
DS(on)
V
GS
= - 4.5 V, I
D
= - 4.4 A
0.028 0.035
Ω
V
GS
= - 2.5 V, I
D
= - 3.8 A
0.039 0.048
V
GS
= - 1.8 V, I
D
= - 2 A
0.053 0.065
Forward Transconductance
a
g
fs
V
DS
= - 4 V, I
D
= - 4.4 A
17 S
Dynamic
b
Input Capacitance
C
iss
V
DS
= - 4 V, V
GS
= 0 V, f = 1 MHz
960
pFOutput Capacitance
C
oss
330
Reverse Transfer Capacitance
C
rss
300
Total Gate Charge
Q
g
V
DS
= - 4 V, V
GS
= - 8 V, I
D
= - 4.4 A
20 30
nC
Total Gate Charge
Q
g
V
DS
= - 4 V, V
GS
= - 4.5 V, I
D
= - 4.4 A
12 18
Gate-Source Charge
Q
gs
1.5
Gate-Drain Charge
Q
gd
3.1
Gate Resistance
R
g
f = 1 MHz 1 5.1 10.2 Ω
Tur n - O n D e l ay Time
t
d(on)
V
DD
= - 4 V, R
L
= 1.1 Ω
I
D
- 3.5 A, V
GEN
= - 4.5 V, R
g
= 1 Ω
20 30
ns
Rise Time
t
r
20 30
Turn-Off Delay Time
t
d(off)
40 60
Fall Time
t
f
10 15
Tur n - O n D e l ay Time
t
d(on)
V
DD
= - 4 V, R
L
= 1.1 Ω
I
D
- 3.5 A, V
GEN
= - 8 V, R
g
= 1 Ω
10 15
Rise Time
t
r
10 15
Turn-Off Delay Time
t
d(off)
35 55
Fall Time
t
f
10 15
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
I
S
T
C
= 25 °C
- 1.4
A
Pulse Diode Forward Current
I
SM
- 20
Body Diode Voltage
V
SD
I
S
= - 3.5 A, V
GS
= 0 V
- 0.8 - 1.2 V
Body Diode Reverse Recovery Time
t
rr
I
F
= - 3.5 A, dI/dt = 100 A/µs, T
J
= 25 °C
35 55 ns
Body Diode Reverse Recovery Charge
Q
rr
14 25 nC
Reverse Recovery Fall Time
t
a
16
ns
Reverse Recovery Rise Time
t
b
19
Document Number: 64847
S10-0720-Rev. C, 29-Mar-10
www.vishay.com
3
Vishay Siliconix
Si2305CDS
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
Output Characteristics
On-Resistance vs. Drain Current and Gate Voltage
Gate Charge
0
5
10
15
20
0.0 0.5 1.0 1.5 2.0 2.5 3.0
V
DS
-- Drain-to-Source Voltage (V)
I
D
- Drain Current(A)
V
GS
= 5 V thru 2 V
V
GS
= 1.5 V
V
GS
= 1 V
0.00
0.03
0.06
0.09
0.12
0.15
0 5 10 15 20
R
DS(on)
- On-Resistance (Ω)
I
D
-- Drain Current (A)
V
GS
=2.5V
V
GS
= 1.8 V
V
GS
= 4.5 V
0
2
4
6
8
048 12 16 20
I
D
= 4.4 A
- Gate-to-Source Voltage (V)
Q
g
- Total Gate Charge (nC)
V
GS
V
DS
= 6.4 V
V
DS
=2 V
V
DS
=4 V
Transfer Characteristics
Capacitance
On-Resistance vs. Junction Temperature
0
1
2
3
4
5
0.0 0.3 0.6 0.9 1.2 1.5
V
GS
- Gate-to-Source Voltage (V)
I
D
- Drain Current(A)
T
C
= 125 °C
T
C
= - 55 °C
T
C
= 25 °C
C
rss
0
300
600
900
1200
1500
1800
02468
C
iss
V
DS
- Drain-to-Source Voltage (V)
C - Capacitance (pF)
C
oss
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
- 50 - 25 0 25 50 75 100 125 150
T
J
- Junction Temperature (°C)
(Normalized)
- On-Resistance
R
DS(on)
I
D
= 4.4 A
V
GS
=2.5V
V
GS
=4.5V, 1.8 V

SI2305CDS-T1-GE3

Mfr. #:
Manufacturer:
Vishay / Siliconix
Description:
MOSFET -8V Vds 8V Vgs SOT-23
Lifecycle:
New from this manufacturer.
Delivery:
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Payment:
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