NCP59800
www.onsemi.com
6
PACKAGE DIMENSIONS
DFN8, 3x3, 0.65P
CASE 506DB
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30mm FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
B
E
D
D2
E2
BOTTOM VIEW
b
e
8X
0.10 B
0.05
AC
C
NOTE 3
2X
0.10 C
PIN ONE
REFERENCE
TOP VIEW
2X
0.10 C
A
A1
(A3)
0.05 C
0.05 C
C
SEATING
PLANE
SIDE VIEW
L
8X
1
4
58
DIM MIN MAX
MILLIMETERS
A 0.80 1.00
A1 0.00 0.05
A3 0.20 REF
b 0.25 0.35
D 3.00 BSC
D2 1.65 1.85
E 3.00 BSC
E2 1.40 1.60
e 0.65 BSC
L 0.30 0.50
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
RECOMMENDED
L1
DETAIL A
L
ALTERNATE TERMINAL
CONSTRUCTIONS
L
DETAIL B
DETAIL A
L1 0.00 0.15
NOTE 4
e/2
SOLDERING FOOTPRINT*
DETAIL B
MOLD CMPDEXPOSED Cu
ALTERNATE
CONSTRUCTIONS
A1
A3
e1 0.65 REF
b1 0.20 0.30
8X
0.63
3.30
1.64
0.40
1
0.65
PITCH
3.30
12X
DIMENSIONS: MILLIMETERS
2.05
0.65
PITCH
PACKAGE
OUTLINE
b14X
e1
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